Applied Materials, Inc.

Yuji Murayama

Yuanhong Guo

Sheng Michael Guo

Marek W Radko

Pingping Gou

Jeffrey C Hudgens

Xiaoxiong Yuan

Steven Victor Sansoni

Michael C Kuchar

Song-Moon Suh

See-Eng Phan

Steve Sansoni

Matvey Farber

Shaofeng Chen

Nagendra Madiwal

Anurag Bansal

Yoshikatsu Shirai

A method of cleaning a chamber for an electronics manufacturing system includes flowing a gas mixture comprising oxygen and a carrier gas into a remote plasma generator. The method further includes generating a plasma from the gas mixture by the remote plasma generator and performing a remote plasma cleaning of the chamber by flowing the plasma into an interior of the chamber, wherein the plasma removes a plurality of organic contaminants from the chamber.

Remote plasma cleaning of chambers for electronics manufacturing systems

A method includes machining a raw surface of a metal component to remove first native oxide from a metal base of the metal component to generate an as-machined surface of the metal component. A second native oxide is formed on the metal base of the as-machined surface of the metal component subsequent to the machining. The method further includes, subsequent to the machining, performing operations to generate a finished surface of the metal component. The operations include a surface machining of the as-machined surface of the metal component to remove the second native oxide.

Organic contamination free surface machining

A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.

A liquid level sensor has sensor probes to and a monitor unit The monitor unit has a probe potential difference detecting section for detecting the output potential difference between sensor probes and the output potential difference between sensor probes and a liquid level determining section for determining the level of the liquid from the result of detection. The monitor unit has a bubbling detection pulse generator section for detecting an occurrence of bubbling of a bubbling gas from the result of detection by the probe potential difference detecting section and generating a pulse signal, and a pulse counter for counting the number of pulses generated by the bubbling detection pulse generator section thereby making it possible to grasp the number of bubbling periods of the bubbling gas.

Liquid level sensor, ampoule, and liquid amount detection method

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Los Gatos, CA, United States of America

Yuji Murayama