Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Yuji Murashima

Masaya Nakatani

Kazuki Komaki

Masahiro Yasumi

Atsuo Nakao

Masanori Samejima

Yuki Nakamura

A thin film magnet includes a substrate, an oxidation-inhibiting layer in an amorphous state disposed on an upper surface of the substrate, a first magnetic layer disposed on the oxidation-inhibiting layer, an intermediate layer disposed on the first magnetic layer, a second magnetic layer disposed on the intermediate layer, and a second oxidation-inhibiting layer in an amorphous state disposed above the second magnetic layer. The intermediate layer contains metal particles. The metal particles are diffused in the first magnetic layer and the second magnetic layer. The concentration of the metal particles in a part of the first magnetic layer decreases as the distance from the intermediate layer to the part of the first magnetic layer increases. The concentration of the metal particles in a part of the second magnetic layer decreases as the distance from the intermediate layer to the part of the second magnetic layer increases.

Thin film magnet and method for manufacturing thin film magnet

An adsorption pump includes a housing, a movable part, and an adsorption part. The housing has inlet and outlet ports for a sample. The movable part is at least partly located inside the housing. The adsorption part is located inside the housing.

Adsorption pump

In a production method of a piezoelectric element, an unneeded electric field is prevented from being applied to a piezoelectric thin film layer during the production process, resulting in a high performance piezoelectric element production method. The production method includes a first process for depositing an under electrode layer, a piezoelectric thin film layer and an upper electrode layer successively on a substrate such that the under electrode layer and the upper electrode layer form a short-circuit, a second process, after the first process, for etching including dry etching, the second process commenced while the under electrode layer and the upper electrode layer are short-circuited, a third process, after the second process, for polarizing by applying a voltage across the under electrode layer and the upper electrode layer, a fourth process, after the third process, for individualizing each piezoelectric element.

Process for fabricating piezoelectric element

Growing community of inventors

Osaka, Japan

Yuji Murashima