Tokyo Electron Limited

Yuji Murakami

Satoru Tanaka

Yusuke Saito

Mitsunori Nakamori

Hiromitsu Nanba

Akira Ishihara

Masahiro Yoshida

Hiroshi Nagayasu

A liquid processing apparatus is arranged to planarize a film on a substrate by supplying onto the film a process liquid for dissolving the film while rotating the substrate. The apparatus includes a substrate holding member configured to rotatably hold the substrate in a horizontal state, a rotation mechanism configured to rotate the substrate holding member, and a liquid supply mechanism configured to supply the process liquid onto a surface of the substrate. The liquid supply mechanism includes first and second liquid delivery nozzles configured to deliver the same process liquid. The first liquid delivery nozzle has a smaller diameter and provides a smaller delivery flow rate, as compared to the second liquid delivery nozzle. The first liquid delivery nozzle is inclined to deliver the process liquid in a rotational direction of the substrate, and is movable between a center of the substrate and a peripheral edge thereof.

Liquid processing apparatus and liquid processing method

At first, with a chamber being filled with a first gas, a process liquid is supplied onto a surface of a wafer in the chamber so as to process the surface of the wafer. At this time, the process liquid discharged from the chamber is returned to a process-liquid supplying part. Thereafter, with the chamber being filled with a second gas whose humidity is lower than that of the first gas, a fluid for forming a liquid film is supplied onto the surface of the wafer in the chamber to form a liquid film on the surface of the wafer and to dry the surface of the wafer.

Substrate processing method, substrate processing apparatus, and storage medium

Growing community of inventors

Koshi, Japan

Yuji Murakami