Nippondenso Co., Ltd.

Yuji Motoyama

Yasunobu Hirao

Takashi Nagasaka

Yukihiro Maeda

Hidekazu Katsuyama

Makoto Koyama

Mamoru Urushizaki

In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

Electronic device having a plurality of circuit boards arranged therein

Method for producing multi-board electronic device

Container for electronic devices having a plurality of circuit boards

Growing community of inventors

Okazaki, Japan

Yuji Motoyama