Kabushiki Kaisha Nihon Micronics

Nec Corporation

Yuji Miyagi

Hidehiro Kiyofuji

Kiyotoshi Miura

Shinji Kuniyoshi

Akihisa Akahira

Tatsuo Inoue

Katsuo Yasuta

Yoshinori Kikuchi

Hitoshi Sato

Tetsuya Iwabuchi

A plurality of chip stack devices having different external sizes can be tested accurately and efficiently with low cost. The present invention provides a chip stack device testing method testing a chip stack device configured by stacking a plurality of chips separated by dicing a substrate under test tested in a testing unit. A tray for chip stack devices having equal shape and external dimension to those of the undiced substrate under test is used, one or a plurality of the chip stack devices are attached and supported to an adhesive layer of the tray for chip stack devices to align the chip stack devices with positions of the respective chips of the undiced substrate under test, the tray for chip stack devices is installed in the testing unit in a similar manner to that in a test of the substrate under test, and the respective chip stack devices are tested.

Chip stack device testing method, chip stack device rearranging unit, and chip stack device testing apparatus

A probe having an alignment mark that is hardly influenced by scraps of an electrode scraped by a probe tip is provided. A probe according to the present invention comprises a base portion having an attaching end and extending in a direction distanced from the attaching end, an arm portion extending from the base portion laterally with a space in the extending direction of the base portion from the attaching end, a probe tip portion protruded from the arm portion and having a probe tip formed on its protruding end, and an alignment mark for alignment of the probe tip. The arm portion has a flat surface area on the opposite side of a side where the attaching end of the base portion is located when seen along the extending direction of the arm portion. The probe tip portion is formed to be protruded from the flat surface area, and the alignment mark is constituted by at least a part of the flat surface area.

Probe and electrical connecting apparatus using it

A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate.

Probe assembly, method of producing it and electrical connecting apparatus

A probe for electrical test provided with positioning marks parallel to a plane where tips are provided and at a height position lower than the plane on a plane directed in the same direction as the plane, the positioning marks are in a predetermined positional relation to said tips. The positioning marks contain information indicating an existing direction of the tips when the positioning marks are observed from the projecting direction of the tips.

Probe for electrical test comprising a positioning mark and probe assembly

A mounting apparatus that does not compromise the strength of a probe board. The apparatus comprises a probe board spaced from a support member by a spacer. A fixed portion with a female screw hole is mounted on one surface of the probe board. A male screw member is threaded into the screw hole for the purpose of tightening the support member to the probe board at a fixed distance defined by the length of the spacer. The probe board has a support plate. Pluralities of conductive paths penetrate the support plate. A wiring plate wherein wiring paths are connected to corresponding conductive paths, and whose one surface is fixed to the support plate. The other surface is provided with probes corresponding to the wiring paths. The fixed portion includes a female screw member at an area where no conductive paths are formed.

Probe board mounting apparatus

A wiring path of a circuit board has a first vertical path portion penetrating the circuit board at its outer edge in its thickness direction and connected to a connector on one surface, a second vertical path portion penetrating the circuit board in its thickness direction and connected to the electric coupler on the other surface, and a lateral path portion connecting both vertical portions, and the second vertical path portion is formed within an arrangement area (S) of a reinforcing plate. One connecting end portion (electric coupler side) of the wiring path of the circuit board is disposed within the arrangement area (S) of the reinforcing plate. On the other hand, the other connecting end portion (probe side) of the wiring path of the circuit board is disposed to be dispersed in an arrangement area (S) wider than the arrangement area (S) of the reinforcing plate.

Electrical connecting apparatus

An electrical connecting apparatus comprising: a circuit board on which a reinforcing plate is mounted and a plurality of first electric connections are provided; a probe board on which second electric connections corresponding to the first electric connections are provided, with a plurality of probes electrically connected to the corresponding second electric connections; an elastic connector having plural pairs of both contacts capable of contacting the first and second electric connections corresponding to each other of both boards therebetween and receiving a biasing force in directions for both contacts to separate from each other; screw members for integrally combining them; and a spacer member for holding the probe tips substantially on the same plane by tightening of the screw members. Between the reinforcing plate and the probe board, a spacer plate is inserted for adjusting a distance from the other surface of the probe board to the probe tips.

A probe having a first and a second arm portion extending between first and second connecting portions connecting the first and second arm portions respectively at their front end portion and base end portion, and a needle point portion below the first connecting portion. At least one of the entire first and second arm portions or the upper or lower edge portions of the first and second arm portions are arcuate.

Probe for testing an electrical device

The wafer inspection device carries out inspection of a plurality of integrated circuits provided with a plurality of electrode pads, respectively, in a condition where the integrated circuits are formed on a wafer. The wafer inspection device is provided with a test head for outputting a test pattern from a plurality of tester pogo pins, a test board to which the tester pogo pins are connected, and a substrate. A plurality of contact pins that correspond to the tester pogo pins, respectively, and are arranged in a matrix form are provided on the test board. A plurality of first terminals, which are connected, respectively, to the plurality of electrode pads, are provided on a first main surface of the substrate. A plurality of second terminals, which comprise terminal groups for each integrated circuit, are provided on a second main surface of the substrate. The terminal groups are arranged in a matrix form, and the second terminals are connected to the contact pins for each terminal group. Furthermore, inner wiring that connects the first and second terminals is provided in the substrate.

Growing community of inventors

Aomori, Japan

Yuji Miyagi