Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Yuji Midou

Tatsuo Fujii

Yukihiro Shimasaki

Tsuyoshi Yoshino

Junichi Kurita

Tatsuji Aoyama

Suzushi Kimura

Hiroshi Fujii

Kenji Kuranuki

Ayumi Kochi

Katsumasa Miki

Akira Kisoda

Kazunori Sakamoto

Kazuo Tadanobu

Hiroshi Serikawa

A process for producing an aluminum electrode foil for a capacitor, which includes a first step of preparing an emulsion from a mixture including a first phase of a liquid resin or a resin solution obtained by dissolving a resin in a solvent, a second phase of a liquid that is incompatible with the first phase, and an emulsifier; a second step of coating the emulsion on a surface of an aluminum foil; a third step of removing the second phase to form a resin film having a plurality of pores on its surface; a fourth step of etching the aluminum foil having the resin film formed thereon; and a fifth step of removing the resin film after etching. The production process can form high-density etching pits with high accuracy.

Process for producing aluminum electrode foil for capacitor and aluminum foil for etching

A capacitor includes a first capacitor element and a second capacitor element laminated on this first capacitor element. The first capacitor element is a solid electrolytic capacitor including a through-hole electrode penetrating a valve metal sheet and having one surface on which cathode and anode terminal portions are taken out. The second capacitor element has first and second electrodes which are provided via a dielectric layer, and second through-hole electrodes penetrating the dielectric layer. The second through-hole electrodes are coupled to the first electrode and insulated from the second electrode. Lead-out portions of the second electrodes are exposed from the dielectric layer. The second through-hole electrodes and the lead-out portions are disposed alternately. The first electrode is electrically coupled to the first through-hole electrode and the second electrode is electrically coupled to the valve metal sheet.

Capacitor

A solid electrolytic capacitor includes a flat-shaped anode terminal having a first surface connected to an anode portion of a capacitor element and having a second surface opposite to the first surface, a flat-shaped cathode terminal having a first surface connected to a cathode layer of the capacitor element and having a second surface opposite to the first surface thereof, and an insulating resin package accommodating the capacitor element, the anode terminal, and the cathode terminal. The second surface of the cathode terminal is flush with the second surface of the anode terminal. The second surface of the anode terminal and the second surface of the cathode terminal expose to an outside of the resin package. The anode terminal includes a first thick portion and a first thin portion thinner than the first thick portion. The first thick portion has the second surface of the anode terminal and a portion of the first surface of the anode terminal. The first thin portion has a portion of the first surface of the anode terminal and being connected to the first thick portion. The cathode terminal includes a second thick portion and a second thin portion thinner than the second thick portion. The second thick portion has the second surface of the cathode terminal and a portion of the first surface of the cathode terminal. The second thin portion has a portion of the first surface and being connected to the second thick portion. This solid electrolytic capacitor has a small equivalent series inductance, and is stably mountable to a mount body.

Solid-state electrolytic capacitor and manufacturing method thereof

A chip solid electrolytic capacitor includes a capacitor element with an anode portion and a cathode portion, an anode lead frame, a cathode lead frame and packaging resin. The anode lead frame includes a first plane, an anode junction and an anode terminal. The anode junction is formed on one end of the first plane and connected to the anode portion. The anode terminal is formed on the other side of the first plane. The cathode lead frame has a second plane and a cathode terminal. The second plane has the cathode portion mounted thereon, is connected to the cathode portion, and is stacked on the first plane. The cathode terminal is formed on the same side of the second plane as the anode terminal. The packaging resin has a surface to be mounted and covers the capacitor element, with the anode terminal and the cathode terminal exposed on the surface to be mounted.

Chip solid electrolytic capacitor

In the magnetic recording medium, the spherical particles are added in the surface magnetic layer of the magnetic film having multilayer configuration (structure). And the spherical particles have a diameter in the range of from 0.5 to 1.5 times as large as the thickness of surface magnetic layer, and the amount of the spherical particles is in the range of from 0.1 parts to 1 part per 100 parts by weight of magnetic powder included in the surface magnetic layer. Fine studs are formed on the surface of the surface magnetic layer, and it results in both small surface roughness and low coefficient of friction.

Magnetic recording medium

Growing community of inventors

Osaka, Japan

Yuji Midou