Matsushita Electric Industrial Co., Ltd.

Yuji Mido

Suzushi Kimura

Tatsuo Fujii

Katsumasa Miki

Nobuya Matsutani

Seiji Takagi

Tetsuhiro Korechika

Ayumi Kochi

Koichi Kojima

Hideki Masumi

Makoto Nakano

Yukihiro Shimasaki

Akira Kisoda

Koji Shimoyama

Tsutomu Inuzuka

Shinji Harada

Satoshi Tomioka

Tadashi Tojyo

Hiroshi Fujii

Junichi Kurita

Masaaki Hayama

Akihiko Ibata

Kazunori Sakamoto

Nobuyuki Aoki

Hiroshi Higashitani

Michio Ohba

Kazuaki Onishi

Kiyoshi Hirota

Yasuo Kanemitsu

Takumi Haneda

A coil electric conductor has an insulating substrate, a first conductive layer, and a second conductive layer. The first conductive layer is formed at a depression provided on a face of the insulating substrate. The second conductive layer is formed on the first conductive layer with the first conductive layer interposed between the second conductive layer and the insulating substrate. This construction realizes a coil electric conductor having a highly precisely uniformized cross-sectional shape.

Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same

A voltage converter module is formed by multi-layering a first connecting layer, a first inner wiring layer, a component built-in layer, a second inner wiring layer, a second connecting layer, and a capacitor-mounted layer, and a capacitor built-in layer with resin composite. A connecting terminal formed on a terminal surface of the first connecting layer, the first inner wiring layer, the second inner wiring layer and the capacitor-mounted layer are electrically coupled to each other through via-hole conductors. The second inner wiring layer couples a voltage converter IC to peripheral components, both being incorporated in the component built-in layer. A first capacitor and a second capacitor incorporated in the capacitor built-in layer are mounted to the capacitor-mounted layer. This structure forms a circuit, in which the first capacitor is coupled to the second capacitor, between the voltage converter IC and the grounding.

Voltage converter module

A solid electrolytic capacitor includes a valve metal sheet having a porous portion on one side of the sheet, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer formed on the solid electrolyte layer, a through-hole electrode connected to the collector layer and penetrating the valve metal sheet to be exposed to the other side of the sheet, and an electrode terminal insulated from the through-hole electrode and connected to the valve metal sheet. The capacitor further includes an insulating portion penetrating the valve metal sheet and a penetration electrode penetrating the insulating portion. The solid electrolytic capacitor has a large capacitance and an excellent radio frequency response, and can be easily mounted on a semiconductor device.

Electrolytic capacitor and method for manufacturing the same

A capacitor element includes a valve metal foil including a core layer and a porous layer on the core layer, a dielectric layer on a portion of the valve metal foil excluding an end portion of the valve metal foil, a solid electrolyte layer on the dielectric layer, a collector layer on the solid electrolyte layer, and a zinc layer on the end portion of the valve metal foil. A solid electrolytic capacitor includes the capacitor element, an insulating case for sealing the capacitor element as to expose the zinc layer, a nickel layer on the zinc layer, and an electrode provided on the case and electrically connected to the collector layer. The solid electrolytic capacitor has a small impedance even at high frequencies, and has a small overall size and a large capacitance.

Solid electrolytic capacitor and method of manufacturing the same

A solid electrolytic capacitor having excellent electrical characteristics due to an insulating protective layer. A water-shedding silicone rubber that cures by moisture or heat energy is coated to form the insulating protective layer on a protruding portion of a valve metal foil, at a protruding portion on the end surface of a porous valve metal body and on the surface of a dielectric layer covering the protruding portion of the valve metal foil.

Solid electrolytic capacitor and manufacturing method thereof

A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foilis made porous in one of the surfaces, a dielectric layeris formed on the porous portion, a through holeis provided in the aluminum foilat a certain specific location. An insulation layeris formed to cover the other surface, viz. non-porous surface, of the aluminum foiland the inner wall surface of through hole, a solid electrolytic layeris provided on the dielectric layer, and a through hole electrodeis formed in the through hole, and then a collector layeris formed on the solid electrolytic layer. The insulation layerdisposed on aluminum foilis provided with an openingat a certain specific location, and a connection terminalis provided at the openingof insulation layerand the exposed surface of the through hole electrode, respectively.

Method for producing solid electrolytic capacitor

A method for manufacturing solid electrolytic capacitor that can be mounted direct on a semiconductor component and offers a superior high frequency characteristic. An aluminum foilis provided on one surface with a resist filmand then with a through hole. Next, an insulation filmis formed to cover the other surface of aluminum foiland to fill the first through hole, and then the resist filmis removed; and then the surface of aluminum foilis roughened to be provided with a dielectric layerthereon. A second through holeis formed in the insulation film, which is filling the first through hole. A through hole electrodeis formed in the second through hole; and then, on the surface of the dielectric layer, a solid electrolytic layerand a collector layerare formed. After an openingis provided, a first connection terminalis formed therein, and a second connection electrodeon the exposed surface of the through hole electrode

Method for manufacturing solid electrolytic capacitor

A solid electrolytic capacitor includes a bulb-metal sheet of which first face has a porous section. A dielectric film, a solid electrolyte layer, and a current-collecting layer are formed in this order on the porous section. On top of the current-collecting layer, a reinforcing plate is bonded. A second face opposite to the first face of the sheet has a connecting terminal conductive to the current-collecting layer. This connecting terminal is coupled to a through-hole electrode which extends through the bulb-metal sheet for appearing outside the second face. The second face has another connecting terminal conductive to the bulb-metal sheet. This structure makes the capacitor thin, and allows the capacitor to increase its stress-resistance and be excellent in responsiveness to a high frequency as well as in mounting convenience.

Solid electrolytic capacitor and manufacturing method of the same

A method of manufacturing solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet ( ) is made porous and a dielectric coating ( ) is provided on the porous face ( ); an element forming stage where a solid electrolytic layer ( ) and a collector layer ( ) are formed on the dielectric coating ( ); and a terminal forming stage where a connecting terminal ( ) for connecting to an external electrode is formed. The element forming stage includes the steps of forming the solid electrolytic layer ( ); a forming through-hole electrode ( ) in a through-hole ( ) that is prepared on the valve metal sheet ( ); and forming the collector ( ) on the solid electrolytic layer ( ).

Method of manufacturing solid-state electrolytic capacitor

A first capacitor element of a sheet form includes a porous valve metal film, a dielectric layer provided on the porous valve metal film, a solid electrolyte layer provided on the dielectric layer, and a collector layer provided on the solid electrolyte layer. A second capacitor element of a sheet form includes a valve metal film, a porous valve metal body provided on the valve metal film, a dielectric layer provided on the porous valve metal body, a solid electrolyte layer provided on the dielectric layer, and a collector layer provided on the electrolyte layer. The first and second capacitor elements are stacked. The porous valve metal film of the first capacitor element and the valve metal film of the second capacitor element are connected to one external electrode while the collector layers of the first and second capacitor elements are connected to another external electrode, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has a small size, a large capacitance, and a small ESR.

Solid electrolytic capacitor

The present invention aims to provide a circuit module that includes a sheet-like solid electrolytic capacitor and reduces an area and volume required for mounting electronic components. In the sheet-like solid electrolytic capacitor, valve metal sheet has dielectric layer and current collector layer formed on the surface thereof, and is packaged by insulators and The circuit module is structured to embed the sheet-like solid electrolytic capacitor in a circuit board.

Circuit module

A dielectric layer is formed on a surface of a porous portion formed at least on a surface of a valve metal sheet. A solid electrolyte layer is formed on the dielectric layer, and a collector layer is formed on the solid electrolyte layer. A first insulating portion is formed on an outer periphery of the dielectric layer, and a solid electrolyte layer is formed on a portion of the dielectric layer corresponding to an opening of the first insulating portion. A portion of the solid electrolyte layer is formed on the first insulating portion. A second insulating portion is formed on the first insulating portion and on the outer periphery of the solid electrolyte layer. A collector layer is formed on a surface of the solid electrolyte layer exposed through an opening of the second insulating portion, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has less current leakage and a high withstand voltage.

Solid electrolytic capacitor and method of manufacturing capacitor

A solid electrolytic capacitor having a high capacitance and excellent high frequency response including a valve metal sheet which is made porous, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer and an electrode exposure area formed on the solid electrolyte layer, and an insulating section electrically insulating the electrode exposure area from the collector layer, in which the electrode exposure area and the collector layer are formed on the same surface of the valve metal sheet.

Solid electrolytic capacitor and method of manufacturing the capacitor

A dielectric coating, a solid electrolytic layer and a collector layer are provided to one face of a porous valve metal sheet. An insulating section covers this metal sheet including the layers discussed above. Conductive bodies, which are coupled with a first connecting terminal and a second connecting terminal, respectively, are surfaced on at least one face of the insulating section. Connecting bumps are formed on these conductive bodies, so that ICs and other parts are coupled with these bumps. This structure realizes a thin composite electronic component having an excellent high-frequency response.

Composite electronic components

A composite magnetic body used for a choke coil, etc. is formed by compression molding of a mixture of magnetic alloy powder containing iron (Fe) and nickel (Ni) as the main component, an insulating material and a binder of an acrylic resin. In the composite magnetic body, high packing rate of the magnetic alloy powder and good insulation between the powder particles stand together, exhibiting a low core loss and a high magnetic permeability. The composite magnetic body can be formed in various core pieces of complex shapes.

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Higashiosaka, Japan

Yuji Mido