Matsushita Electric Industrial Co., Ltd.

Mitsubishi Heavy Industries Limited

Yuji Maruyama

Hidehiko Kawakami

Atsuharu Yamamoto

Hideaki Kawamura

Yukifumi Tsuda

Hiroto Toba

Kazutoshi Ikegaya

Toshiharu Kurosawa

Hiroyoshi Tsuchiya

Katsuo Nakazato

Kunio Sannomiya

Kiyoshi Takahashi

Hidemi Takahashi

Iwao Ichikawa

Katsuhiro Kondoh

Seiji Kobayashi

Noriya Hayashi

Hidetaka Hattori

Toyoki Kawahara

Junko Watanabe

Mitsuyoshi Uematsu

Nobuhiro Araki

Takahito Shimomukai

Kunjo Sannomiya

Masaaki Nakashima

Takumi Seto

In an artificial defect materialof an FRP structure, a heat-resistant high-linear-expansion materialarranged between the layers thermally expands in case of high-temperature shaping of the FRP structure, so that a predetermined shape is shaped between a plurality of layers of the fiber reinforcing base materialand the materialthermally shrinks at the room temperature after the shaping, so that a space is formed due to the shrinkage difference from the fiber reinforcing base materials. The materialhas a linear expansion coefficient larger than that of the FRP structure by a predetermined value or more, and has the shape keeping property and the heat resistance to endure the shaping temperature.

Artificial defect material and manufacturing method of FRP structure

A wiring pattern inspection apparatus for inspecting an abnormality of a wiring pattern formed on a printed circuit board, which is equipped with an optical image pickup device for optically illuminating a surface of the printed circuit board including the wiring pattern to photoelectrically convert optical information of the printed circuit board surface due to the optical illumination into a grey level image. This grey level image is converted into a bi-level image which separates the grey level image into the wiring pattern side and a background side of the wiring pattern. Thereafter, the bi-level image is once contracted by a first size and then expanded by a second size so as to eliminate a micro conductive portion left on the printed circuit board or a micro pinhole which can be disregarded in the abnormality inspection, thereby preventing the excessive detection.

Wiring pattern inspection apparatus for printed circuit board

Pieces of feature information in a bi-level image such as a width, a branching point and an ending point of a wiring pattern are detected in a design rule checking section according to a micro inspection to find out pieces of feature information departing from a design rule. Also, feature codes in the bi-level image such as a corner of the wiring pattern are detected in a specific shape detecting section according to a macro inspection. The feature information are compared with pieces of referential feature information pertaining to a non-defective wiring pattern in a first comparing and judging section to judge whether the wiring pattern indicated by the feature information is defective or non-defective. The feature codes are compared with referential feature codes pertaining to a non-defective wiring pattern in a second comparing and judging section to judge whether the wiring pattern indicated by the feature codes is defective or non-defective. Therefore, defective types and portions of the wiring pattern can be detected by performing the macro inspection and the micro inspection in parallel without dividing the wiring pattern into processed regions.

Apparatus for inspecting a wiring pattern according to a

An inspection apparatus for inspecting a wiring pattern on a printed board by illuminating the printed board with light to photoelectrically convert light reflected from the printed board into an optical grey level image corresponding to the wiring pattern thereon, the grey level image being converted into a bi-level image. The inspection apparatus includes a thinning circuit to perform a thinning process for removing the bi-level image by one picture element from the background side of the wiring pattern, the thinning process being repeatedly performed predetermined times with respect to all of picture elements of the wiring pattern to output the number of repetitions of the thinning process and further to output a skeleton image. Also included is a distance image converter to output a distance conversion image where the number of repetitions is given as a distance value from the background of the wiring pattern. The inspection apparatus compares the distance value of the distance conversion image with one or more thresholds along the skeleton image. This arrangement allows direct detection of the wiring pattern width, thereby permitting the wiring pattern inspection with a simple structure.

Apparatus for inspecting wiring pattern formed on a board

A pattern inspection system for inspecting a pattern of a land for a through-hole formed in a printed board. In the system there are included a first illumination device for optically illuminating the printed board, a second illumination device for illuminating the printed board with light modulated at a predetermined period and an image pickup responsive to reflection light and transmission light from the printed board due to the first and second illumination devices to photoelectrically convert the printed board into a gray level image. The gray level image is converted into a bi-level image by a bi-level conversion device and then converted into an edge image by an edge detecting device. The edge image is expanded and contracted by predetermined amounts so as to obtain a through-hole image corresponding to the through-hole. A defect detecting device detects a defect of the pattern of the printed board on the basis of the through-hole image and the bi-level image from the bi-level conversion device.

Pattern inspection system for inspecting defect of land pattern for

A system for inspecting a condition of parts packaged on a printed-circuit board. The inspection system includes a position detecting device to receive scattered light due to illumination of the printed-circuit board with a laser beam and convert the received scattered light into a position signal. This position signal is used for obtaining luminance data and at least two height data of the parts on the printed-circuit board. Proper height data of the parts is determined on the basis of the difference between the two height data. The inspection system determines the package condition by comparing the final height data with a predetermined reference data.

System for optically inspecting conditions of parts packaged on substrate

A beam of light is applied to a surface of a circuit board provided with at least one solder portion. The light beam scans the surface of the circuit board. Height data are derived from a portion of the light beam which is scattered at the surface of the circuit board. The height data represent a height of a currently-scanned point of the surface of the circuit board. The height data are accumulatively added for the solder portion. A variation in the height data is calculated. The accumulative addition of the height data is executed and suspended in response to the calculated variation in the height data. A decision is made as to whether the solder portion is acceptable or unacceptable on the basis of a result of the accumulative addition.

Apparatus for inspecting solder portion of a circuit board

A printed-circuit board inspection apparatus for checking the condition of each circuit component mounted by soldering on a printed-circuit board is disclosed in which a luminance signal obtained from the reflected light scattering from the printed-circuit board being illuminated is converted through a given threshold level to binary signals, then the binary signals and mask data are processed to calculate the ratio of an area represented by the number of binary '1' signals to an area represented by the number of binary '0' signals, and the soldering condition of the component is judged based on the area ratio. With this arrangement, the inspection is not negatively influenced by the misalignment of the component with a mating soldering land, is capable of judging the amount of solder, and can be performed automatically and efficiently. The binary signals may be converted into code data by assigning a code '1' or '0' to each of a plurality of split masks set on each soldering land, depending on the largeness of the area in which the number of binary '1' signals '1' is larger than the number of binary '0' signals or vice versa. In this case, the judgment of the soldering condition is made by comparing the code data with code patterns contained in a predetermined code table.

Electro-optical inspection apparatus for printed-circuit boards with

A linescan apparatus for detecting salient pattern on a surface of a product comprises: a laser light source for continuously emitting a laser beam; a polygon mirror for reflecting the laser beam; a drive for rotating the polygon mirror to scan said laser beam; an f.theta. lens arranged such that the linescan laser beam strikes against the plane perpendicularly; a carrying device for moving the product in the direction substantially perpendicular to the plane; a mirror for reflecting the linescan laser beam reflected at a surface of the product to direct the linescan laser beam to the polygon mirror through the f.theta. lens, the mirror being positioned apart from the second plane; and a beam position detector for detecting unidimensional position of a spot mede by the linescan laser beam projected thereon from the mirror via the polygon mirror. This linescan apparatus provides three-dimensional data of a surface of the product. The detected position signal is compared by reference data for inspecting the product. An linescan apparatus further comprises second beam position detector and an averaging circuit for averaging outputs from first mentioned and second beam detectors.

Linescan apparatus for detecting salient pattern of a product

An image signal processing apparatus for converting input signal values representing density levels of successive picture elements of an image to corresponding bi-level signal values, whereby a conversion error for an object picture element is apportioned among a set of unprocessed adjacent picture elements, to update respective values of accumulated error. Each input signal value is compensated, prior to conversion, by a value derived from the total accumulated errors of the object picture element and these adjacent picture elements, while the conversion error is derived by subtracting from the bi-level output value a value obtained by compensating the input signal by the accumulated error for the object picture element.

Bi-level image display signal processing apparatus

An image signal processing circuit for converting step-gradation density values (I.sub.xy) of successive picture elements to bi-level values (P.sub.xy) for display by a bi-level display device, in which a bi-level error (E.sub.xy) between a bi-level value determined for a picture element and an appropriate density value for the element is apportioned among a set of peripherally adjacent picture elements (A to D) by computing a corresponding set of error apportionment values (G.sub.A to G.sub.D), and in which a difference between the sum total of these apportionment values and the bi-level error is derived, and error apportionment is modified such as to eliminate the effects of this difference. Improved reproduction is thereby attained of image regions which are of uniformly high density or low density.

An image signal processing circuit for converting a continuous tone image signal to a bi-level image signal, for producing a spatial gray scale image on a bi-level display device such as a gas plasma display panel. Respective values of apportionment factors (K.sub.A to K.sub.D) used for apportioning a bi-level conversion error of each picture element of the image among a plurality of picuture elements (A to D) positioned peripehrally adjacent thereto are periodically altered, in a periodic or random succession of values, to thereby effectively eliminate the generation of a texture pattern in display regions corresponding to areas of uniform density in the original image.

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Tokyo, Japan

Yuji Maruyama