Kyocera Corporation

Yuji Kishida

Kazuki Hayata

Kyohei Kobayashi

Hideharu Kurioka

Hiroyasu Tanaka

Toru Fukano

Atsuomi Fukuura

Djuniadi Arifin Sagala

Yoshiko Oya

Hiroyuki Tanaka

Nobuki Hiramatsu

Takeshi Takenoshita

Takahiro Matsubara

Yutaka Kuba

Takehiro Okumichi

Yoshihiro Sakamoto

Ryuji Komeda

Keiko Oda

Kentaro Miyazato

A magnetic sensor includes a diamond substrate and a waveguide body in contact with the diamond substrate. The diamond substrate includes, on a surface not in contact with the waveguide body, a first layer including a diamond crystal on which an NV center is disposed and, on a surface in contact with the waveguide body, a second layer on which a conductive pattern is disposed. The waveguide body includes a line configured to transmit a microwave that generates electron spin resonance to the conductive pattern and an optical waveguide configured to transmit exciting light and fluorescence, the exciting light irradiating the diamond substrate and emitting the fluorescence in the first layer of the diamond substrate.

Magnetic sensor, detection unit, detection system, substrate for magnetic sensor, waveguide body for magnetic sensor, opto-electric hybrid substrate for magnetic sensor, and detection substrate for detection unit

A sensor apparatus according to an embodiment of the present invention includes an element substrate, an element electrode located on an upper surface of the element substrate, an insulating member covering at least a part of the element electrode, and a detection part that includes an immobilizing film located on the upper surface of the element substrate or an upper surface of the insulating member, and performs a detection of a detection object contained in a specimen. A surface roughness of the immobilizing film is smaller than a surface roughness of the element electrode. In a sensor apparatus of other embodiment of the present invention, an amount of oxygen in a surface layer part of the immobilizing film is smaller than an amount of oxygen in a surface layer part of the element electrode.

Sensor apparatus

A biosensor, including: a first cover member comprising an element-accommodating recess in an upper face thereof; a detection element using a surface acoustic wave, the detection element including an element substrate accommodated in the element-accommodating recess, and at least one detection unit located on an upper face of the element substrate configured to perform detection of an analyte; and a second cover member joined to the first cover member and covering the detection element, and including an inflow port from which the analyte flows in and a groove which extends from the inflow port to at least above the at least one detection unit and constitutes a capillary.

Biosensor

To provide a biosensor including a suctioning mechanism while using a detection element such as a surface acoustic wave device, included are: a first cover memberincluding an element-accommodating recesson an upper face thereof; a detection elementincluding an element substrate, and at least one detection unitlocated on the upper face of the element substrateto perform detection of an analyte; and a second cover memberjoined to the first cover memberand covering the detection element, and including an inflow portfrom which the analyte flows in and a grooveextending from the inflow portto at least above the detection unit.

A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a waveguide. The substrate has an input-output portion for high-frequency signals on one surface thereof. The circuit board has a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The waveguide has openings at ends thereof, in which one of the openings is connected to the end face of the dielectric waveguide line, and the other opening is connected to the input-output portion of the substrate.

High-frequency module and method of manufacturing the same, and transmitter, receiver, transceiver, and radar apparatus comprising the high-frequency module

A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a resonator. The substrate has an input-output portion for high-frequency signals formed on one surface thereof. The circuit board includes a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The resonator includes input-output end portions for high-frequency signals at ends thereof, in which one of the input-output end portions is connected to the end face of the dielectric waveguide line, and the other thereof is connected to the input-output portion of the substrate.

The invention relates to a high-frequency transmission line connection structure, a circuit board having the connection structure, a high-frequency module having the circuit board, and a radar apparatus. A first laminated waveguide sub-line part () includes a pair of main conductor layers that oppose each other in a thickness direction with a dielectric layer () having the same thickness as a dielectric layer () of a microstrip line () interposed therebetween. A second laminated waveguide sub-line part () includes dielectric layers () thicker than the dielectric layer of the first laminated waveguide sub-line part (). A laminated waveguide main-line part () includes dielectric layers () thicker than the dielectric layers of the second laminated waveguide sub-line part (). A conversion part () connected to the microstrip line () is formed by integrating with an upper main conductor layer constituting the respective line parts.

High-frequency transmission line connection structure, circuit board, high-frequency module, and radar device

A millimeter-wave transmitter-receiver uses an NRD guide as a fundamental configuration and includes a millimeter-wave signal oscillator, a pulse modulator, a circulator, an antenna and a mixer. In the millimeter-wave transmitter-receiver, a line length of a third dielectric guide is set so that &#x3b4;=&#xb1;&#x3c0; in which &#x3b4; is a phase difference at a center frequency between a portion of a transmission millimeter-wave signal, which is reflected via a third dielectric guide on the leading end portion of the third dielectric guide and returned to leak to a third connecting portion of the circulator, and another portion of the millimeter-wave signal, which leaks from a first connecting portion to the third connecting portion of the circulator. It is possible to reduce the change in the mixer output and enhance the millimeter-wave transmission/reception performance.

Transmitting/receiving antenna, isolator, high-frequency oscillator, and high-frequency transmitter-receiver using the same

Provided is a millimeter-wave transmitting/receiving apparatus of pulse-modulation type in which pulse-modulated millimeter-wave signals for transmission are prevented from being outputted to a reception system due to inner reflection or other causes. Included are: an NRD guide (basic structure) formed of a dielectric line sandwiched between parallel plate conductors; a millimeter-wave signal oscillator; a pulse modulator; a circulator; a transmitting/receiving antenna; and a mixer. At the output end of the mixer is disposed a switching device which interrupts intermediate-frequency signals in an opened state, and, when a millimeter-wave signal for transmission from the pulse modulator enters a non-output state and the condition is stabilized, changes into a closed state to pass intermediate-frequency signals. The intermediate-frequency signal containing noise resulting from the millimeter-wave signal for transmission entering the mixer can be prevented from leaking toward downstream side of the mixer; wherefore a desired intermediate-frequency signal can be outputted.

High-frequency transmitting/receiving apparatus, radar system having the same, and vehicle and small boat equipped with the radar system

A high-frequency oscillator that can tune oscillation characteristics is provided. A high-frequency oscillator includes a Gunn diode serving as a high-frequency oscillation element that generates high-frequency signals, a resonator connected to the Gunn diode, a varactor diode serving as a variable-capacitance element that is disposed on the resonator and changes a resonance frequency, and a bias supply circuit that is connected to the varactor diode and supplies a bias voltage applied in order to change a capacitance. The bias supply circuit includes a trimmable chip resistor serving as a pre-set variable resistor that regulates a bias voltage applied to the varactor diode. By regulating the resistance value of the trimmable chip resistor, it is possible to control the capacitance value of the varactor diode and tune oscillation characteristics to a desired state.

High-frequency oscillator, high-frequency transmission-reception apparatus using the same, radar apparatus, and radar-apparatus-equipped vehicle and small boat equipped with the same

Signal wiring conductors are provided at opposing positions on the upper surface of the uppermost dielectric layer and on the lower surface of the bottommost dielectric layer, and grounding conductors surrounding grounding-conductor non-forming areas are provided on the upper surfaces of intermediate dielectric layers and the bottommost dielectric layer. These grounding conductors form an electromagnetically shielded space by being connected by grounding-conductor via conductors vertically penetrating the respective dielectric layers around the grounding-conductor non-forming areas, and signal via conductors are so provided in the respective dielectric layers as to penetrate this electromagnetically shielded space. A signal via conductor of the uppermost dielectric layer is connected with the signal wiring conductor on the upper surface thereof via a signal-wiring connecting conductor, and a signal via conductor of the bottommost dielectric layer is connected with the signal wiring conductor on the lower surface thereof via a signal-wiring connecting conductor.

High-frequency signal transmitting device

In a mounting structure of an optical module, an optical semiconductor device such as a light emitting device or a photo sensing device and an optical fiber are mounted. The optical fiber is directly mounted in a mounting groove formed on a top face of the substrate. The optical semiconductor device is mounted on a front face of a carrier corresponding to &lcub; &rcub; surface or &lcub; &rcub; surface equivalent to ( ) surface or ( ) surface of a single crystalline silicon. The carrier has a slanted first positioning face corresponding to &lcub; &rcub; surface equivalent to ( ) surface of the single crystalline silicon. The substrate has a slanted second positioning face corresponding to &lcub; &rcub; surface equivalent to ( ) surface of the single crystalline silicon with respect to the top face corresponding to &lcub; &rcub; surface or &lcub; &rcub; surface of the single crystalline silicon. Thus, the front face of the carrier becomes perpendicular to the top face of the substrate.

Optical module and carrier for optical module

An optical coupler wherein on one principal face of an Si single crystal substrate are formed, by etching, grooves for mounting optical fibers and a portion for mounting an optical element that is divided into plural parts, a base substrate, of which coefficient of thermal expansion is substantially identical to that of the optical element, is bonded onto the other principal face of the substrate, and the optical element is mounted on the portion for mounting an optical element.

Growing community of inventors

Seika-cho, Japan

Yuji Kishida