Senju Metal Industry Co., Ltd.

Ricoh Company, Ltd.

Other

Sony Corporation

Denso Corporation

Yuji Kawamata

Hiroyoshi Kawasaki

Isamu Sato

Takahiro Roppongi

Masato Shiratori

Daisuke Soma

Minoru Ueshima

Takashi Hagiwara

Atsushi Ikeda

Kazuhiro Matsushita

Masashi Sakamoto

Tomu Tamura

Ryoichi Suzuki

Min Woo Kang

Nekka Matsuura

Kaichi Tsuruta

Toshihiko Taguchi

Hiroyuki Fukasawa

Takahiro Hattori

Naoki Sato

Shigeki Kondo

Takashi Akagawa

Hiroki Sudo

Daisuke Maruko

Atsumi Takahashi

Hiroyuki Yamada

Toshio Hakuto

Kazuyuki Hamamoto

Kazuhiro Minegishi

Kazuto Shibuya

Tomoaki Nishino

Hisayuki Abe

Hajime Kato

Takashi Saito

Tadashi Oshima

Akiko Iwano

Tomohiko Hashimoto

Kayako Nakagawa

Yasuaki Kokubu

A solder paste contains a flux and a metal powder, wherein the flux contains: 0.5% by mass to 20.0% by mass of a (carboxyalkyl)isocyanurate adduct; 5.0% by mass to 45.0% by mass of a rosin; and a solvent. The (carboxyalkyl)isocyanurate adduct is at least one selected from the group consisting of mono(carboxyalkyl)isocyanurate adducts, bis(carboxyalkyl)isocyanurate adducts and tris(carboxyalkyl)isocyanurate adducts.

Solder paste

A sliding member includes a metal substrate and a sliding layer formed on one surface of the metal substrate. The sliding layer has a matrix phase containing Cu and Sn and hard particles dispersed in the matrix phase and containing a Laves phase constituted of a composition of Co, Mo and Si.

Sliding member, bearing, sliding member manufacturing method, and bearing manufacturing method

An information processing apparatus includes a first image receiver configured to receive a first image captured by an imaging apparatus in which a user of an electronic device and the electronic device are captured; a first user identifier configured to identify a first user from the first image; a usage information receiver configured to receive, from the electronic device, usage information based on an operation of the first user identified by the first user identifier; a second image receiver configured to receive a second image captured by the imaging apparatus in which a settlement apparatus and a second user capable of using the settlement apparatus are captured; a second user identifier configured to identify the second user from the second image; and a usage information transmitter configured to transmit the usage information to the settlement apparatus, based on the identified first user and the identified second user.

Information processing apparatus, information processing system, fee management method, and recording medium that transmits usage fee in response to detecting that first and second users belong to a same group

A flux containing an organic acid, a water-soluble base agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid. The water-soluble base agent is one or more selected from the group consisting of a nonionic surfactant and a weak cationic surfactant. The content of the 1,2,3-propanetricarboxylic acid is 1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux, the total content of the water-soluble base agent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux, and the total content of the solvent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux. According to this flux, the wettability of solder can be enhanced and ball missing after reflow and flux residue washing is suppressed.

Flux and solder paste

A solder alloy is provided which can withstand the severe characteristics of a temperature cycle between a low temperature of &#x2212;40&#xb0; C. and a high temperature of 125&#xb0; C., withstand an external force applied due to, for example, riding on a curb or collision with a vehicle ahead for a long period of time, and can suppress change in viscosity of a solder paste over time. In addition, a solder paste, a solder ball, and a solder preform in which the solder alloy is used; a solder joint formed through the use thereof; and an on-board electronic circuit, an ECU electronic circuit, an on-board electronic circuit device, and an ECU electronic circuit device which include this solder joint are provided. The solder alloy contains, by mass %, 1% to 4% of Ag, 0.5% to 1.0% of Cu, 1.5% to 5.5% of Bi, 1.0% to 5.3% of Sb (or greater than 5.5% and less than or equal to 7.0% of Bi and 2.0% to 5.3% of Sb), 0.01% to 0.2% of Ni, 0.0040% to 0.0250% of As, and a balance of Sn.

Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ECU electronic circuit, on-board electronic circuit device, and ECU electronic circuit device

An object of the present invention is to provide an Sn&#x2014;Bi&#x2014;Cu&#x2014;Ni solder alloy or the like which has a low melting point, excellent ductility, and high tensile strength, and in which if soldering is performed on a Cu electrode subjected to electroless Ni plating treatment, a solder joint formed through this soldering exhibits high shear strength. In addition, another object of the present invention is to provide an Sn&#x2014;Bi&#x2014;Cu&#x2014;Ni solder alloy in which a solder joint formed through soldering exhibits high shear strength even for a Cu electrode which has not been subjected to plating treatment. Furthermore, still another object of the present invention is to provide, in addition to the above-described objects, a solder alloy or the like of which yellowish discoloration can be suppressed and in which change in viscosity of a solder paste over time can be suppressed. The solder alloy has an alloy composition consisting of, by mass %, 31% to 59% of Bi, 0.3% to 1.0% of Cu, 0.01% to 0.06% of Ni, 0.0040% to 0.025% of As, and a balance of Sn.

Solder alloy, solder paste, solder ball, solder preform, solder joint, and substrate

Provided are a solder alloy which has excellent temperature cycle characteristics and in which yellowish discoloration is suppressed, excellent wettability is maintained, and an increase in viscosity of a solder paste over time can be suppressed, and a solder paste, a solder ball, and a solder joint in which the solder alloy is used. The solder alloy consists of, by mass %, 1.0% to 5.0% of Ag, 0.5% to 3.0% of Cu, 0.5% to 7.0% of Sb, 0.0040% to 0.025% of As, and a balance of Sn.

Solder alloy, solder paste, solder ball, solder preform, and solder joint

A sheet conveying device includes a support configured to move between a storage position and a full open position and including a pair of rollers, a plurality of contact bodies, and a switching unit. The switching unit switches the pair of rollers in response to contact of the plurality of contact target bodies included in the switching unit, with the plurality of contact bodies. The plurality of contact bodies includes a first contact body closer to the storage position than the plurality of contact target bodies with the support at the full open position and closer to the full open position with the support at the storage position, and a second contact body closer to the storage position than a part of the plurality of contact target bodies with the support at a halfway position and closer to the full open position with the support at the storage position.

Sheet conveying device and image forming apparatus incorporating the sheet conveying device

Provided are a solder alloy, which has excellent heat cycle characteristics and in which Cu erosion and yellowish discoloration are suppressed, and an increase in viscosity of a solder paste over time is suppressed, a solder paste, a solder ball, a solder preform, a solder joint, and a circuit. The solder alloy has an alloy composition consisting of, by mass %, 2.8% to 4% of Ag, 1.5% to 6% of Bi, 0.8% to 1.2% of Cu, 0.0040% to 0.025% of As, and a balance of Sn.

Solder alloy, solder paste, solder ball, solder preform, solder joint, and circuit

The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150&#xb0; C. with a temperature of 25&#xb0; C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

Soldering material

Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3 &#x3bc;m, and its Vickers hardness is equal to or higher than 20 HV and equal to or less than 60 HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.

Cu column, Cu core column, solder joint, and through-silicon via

Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 &#x3bc;m or less, and the solder material has a spherical diameter of 1 to 230 &#x3bc;m and a sphericity of 0.95 or more.

Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint

Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

Flux composition for solder applications

Provided is a solder material which enables a growth of an oxide film to be inhibited. A solder ball which is a solder material is composed of a solder layer and a covering layer covering the solder layer. The solder layer is spherical and is composed of a metal material containing an alloy including Sn content of 40% and more. Otherwise the solder layer is composed of a metal material including Sn content of 100%. In the covering layer, a SnO film is formed outside the solder layer, and a SnOfilm is formed outside the SnO film. A thickness of the covering layer is preferably more than 0 nm and equal to or less than 4.5 nm. Additionally, a yellow chromaticity of the solder ball is preferably equal to or less than 5.7.

Solder material, solder joint, and method of manufacturing the solder material

A Cu core ball is provided that prevents any soft errors and decreases any connection failure. The Cu core ball includes a solder plating film formed on the surface of a Cu ball that is a Sn solder plating film or is made of a lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U of 5 ppb or less and Th of 5 ppb or less. The Cu ball has a purity of not less than 99.9% Cu and not more than 99.995% Cu. Pb and/or Bi contents therein are at a total of 1 ppm or more. The sphericity thereof is 0.95 or more. The obtained Cu core ball has an &#x3b1; dose of 0.0200 cph/cmor less.

Growing community of inventors

Tochigi, Japan

Yuji Kawamata