Renesas Technology Corp.

Hitachi Tohbu Semiconductor, Ltd.

Yuji Kakegawa

Yoshihiko Kobayashi

Tsutomu Ida

Akio Ishizu

Susumu Takada

Norinaga Arai

Kazutoshi Takashima

Iwamichi Koujiro

Shiro Oba

Shigeru Haga

A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts () and semiconductor pellets () onto each of wiring substrates () formed on a matrix substrate () after inspection. A defect mark () is affixed to a wiring substrate () as a block judged to be defective in the inspection of the matrix substrate (), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate () with the defect mark () thereon is omitted to attain the rationalization of a manufacturing line.

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Semiconductor device fabrication method and semiconductor device fabrication apparatus

Growing community of inventors

Saku, Japan

Yuji Kakegawa