Nippon Electric Co., Ltd.

Nec Corporation

Yuji Kajiwara

Toshio Ohkubo

Hidehiko Katoh

Hideo Takamizawa

Atsushi Saito

Masanori Suzuki

Tsutomu Noguchi

Soichi Saito

Hidetaka Fujiwara

Tsutomu Itano

A method of sampling a suction effusion fluid is provided, which is convenient and highly efficient and which leaves no marks on the skin. First, (a) A suction cell with a cup-shaped hollow body is prepared. The body has an inner space, an aperture connected to the inner space, and a suction port connected to the inner space. The aperture is applied to a skin of a living organism. The inner space of the body is evacuated through the suction port. Next, (b) Bores are formed in a horny layer of the skin of the living organism. The bores has a depth that penetrates the horny layer and do not reach a capillary tube in the skin. Further, (c) The suction cell is held so that the aperture of the cell is opposed to the skin. The cell covers the bores formed in the horny layer and is tightly contacted with the skin. Finally, (d) The inner space of the suction cell is evacuated in such a way that the skin is bulged and the bores are expanded. Thus, the suction effusion fluid is sampled from the skin of the living organism through the suction cell.

Method and apparatus of sampling suction effusion fluid

A device for sucking an effusion fluid from the skin of an organism from which keratin has been removed. A disk is received in the cavity of a cell for sucking an effusion fluid in contact with the surface of an organism. Guide grooves are formed in the surface of the disk facing a suction port while holes are formed through the disk in each guide groove. The disk allows a minimum of fluid to remain thereon and guides the fluid toward the suction side in order to enhance efficient collection. When the fluid is collected a plurality of times, the preceding fluid and the following fluid are prevented from being mixed together, insuring accurate measurement.

Effusion fluid sucking device

The contact type image sensor includes a transparent insulator substrate, a common electrode formed on a main surface of the insulator substrate, an amorphous silicon layer formed on the common electrode, a plurality of individual electrodes formed on the amorphous silicon layer, an insulator layer covering the amorphous silicon layer and having openings at the portions of the individual electrodes, and a plurality of wiring layers formed on the insulator layer for leading out the output signal in response to the light introduced from a back surface of the insulator substrate. A photo-shield layer may be interposed between the common electrode and the amorphous silicon layer.

Amorphous silicon photo-sensor for a contact type image sensor

The present invention provides a dielectric material adapted for microwave integrated circuits (MIC) and an electric circuit making use of said dielectric material. More particularly, an oxide dielectric material principally consisting of (1-x)BaO.xTiO.sub.2 (0.7.ltoreq.x.ltoreq.0.95) and containing both 0.007 to 0.7 weight % of manganese and 0.037 to 3.7 weight % of zirconium, has a large dielectric constant, a small dielectric loss and a small temperature coefficient of dielectric constant and is uniform over a broad range, and especially it is possible to easily manufacture a substrate having a uniform dielectric constant and a uniform dielectric loss. Transistors and MIC's employing such substrates can attain uniform and excellent high-frequency characteristics.

(1-x)BaO.xTiO.sub.2 System dielectric material for use in a microwave

A thermal printing head having a heating resistor prepared according to a thin-film technique and a wiring circuit prepared according to a thick-film technique achieves a high printing quality at a low cost. A thin-film resistor is formed on a heat-insulating dielectric layer which is, in turn, provided partially on a dielectric substrate, while thick-film lead electrodes, which are connected to a driving circuit, are formed on the dielectric substrate so as to make contact with the edge portion of the heat-insulating dielectric layer. Thin-film lead electrodes electrically connect the thick-film lead electrodes to the opposite ends of the thin-film resistor. The heat-insulating dielectric layer and the thick-film lead electrodes are provided by means of thick-film technique such as screen-printing and succeeding firing processes and the thin-film resistor and the thin-film lead electrodes are formed through thin-film technique such as sputtering or vacuum-evaporating process.

Integrated thermal printing head and method of manufacturing the same

Method of manufacturing an integrated thermal printing head

A thermal printing head which effects printing on thermally sensitive paper with Joule's heat generated by passing a current through a thick-film resistor is featured by the surface configuration of the thick-film resistor. In a cross-section perpendicular to the direction of the current passing through the resistor, the resistor is formed in such shape that the center portion is lower than the opposite edge portions. Owing to such concave top surface, despite of the fact that the heating resistor is a thick-film resistor, printing of high quality that is compatible to printing quality by a thin-film resistor can be accomplished. A practically useful thermal head having the resistors with the concave top surface can be realized through the photo-resist pattern technique combined with the screen printing technique.

Thick-film thermal printing head and method of manufacturing the same

As an input and/or an output matching circuit for a transistor, a transistorized high-frequency power amplifier comprises at least one pattern of a conductive material on a sheet of a ferroelectric material placed on a conductive base plate in direct contact therewith. The ferroelectric material is represented by the formula:

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Tokyo, Japan

Yuji Kajiwara