Aisin Seiki Kabushiki Kaisha

Yuji Iwata

Kiyoshi Matsumoto

Isao Shimoyama

Noriyasu Sasa

Akihiro Katsumata

Takahiro Tohyama

Ichiro Kawano

Tsuneo Chinzei

Hidemoto Nakagawa

An internal combustion engine includes an oil seal mounted at a crankshaft of an internal combustion engine body to restrain leakage of oil to an outside of the internal combustion engine, an oil seal fixing member fixed to the internal combustion engine body to fix the oil seal to the internal combustion engine body, and a cover member assembled on a lateral surface portion of the internal combustion engine body in a direction in which the crankshaft extends, the cover member covering the oil seal fixing member from a side opposite to the internal combustion engine body, the oil seal fixing member being fixed to the internal combustion engine body at a fixing position which is provided at an inner side than an outer edge portion of the cover member fastened to the internal combustion engine body.

Internal combustion engine

A surface plasmon sensor includes a plurality of light supply devices for irradiating a beam, a plurality of surface plasmon resonance detection surfaces where the beam irradiated from the light supply means being incident to, a plurality of light detection devices for detecting the beam reflected at the surface plasmon resonance detection surface, a plurality of reflective surfaces provided at respective optical paths from the light supply devices to the light detection devices, the reflective surfaces being arranged opposing to the respective surface plasmon resonance detection surfaces, a wave formed multiwell formed with the surface plasmon resonance detection surfaces and the reflective surfaces, and the light detection devices positioned close to the light supply means.

Surface plasmon sensor, surface plasmon resonance measurement device, and detection chip

A thermoelectric cooling module, in which an electronic device is cooled due to the Peltier effect of P-type and N-type thermoelectric semiconductor elements, comprising a heat radiating section which comprises a heat radiating electrode having a fin-shaped portion for heat radiation integrally formed, a heat absorbing section comprising heat absorbing electrode contacted with the electronic device, and a thermoelectric conversion section comprising the P-type and N-type thermoelectric semiconductor elements interposed between the heat radiating electrode and the heat absorbing electrode.

Thermoelectric cooling module and method for manufacturing the same

Growing community of inventors

Kariya, Japan

Yuji Iwata