Ushio Denki Kabushiki Kaisha

Yuji Imai

Satoshi Kamiyama

To provide a light emitting device that does not experience a decline in radiant efficiency in use, enables luminous flux from LED elements to be increased, and white light of good color rendering to be produced, and heat generated by the LED elements to be smoothly transmitted to an SiC fluorescent substrate. The light emitting device is provided with first LED elements for emitting UV radiation, second LED elements for emitting visible light, an SiC fluorescent substrate that is mounted with the first LED elements and the second LED elements and is made of SiC doped with at least one of B and Al as well as N and emits visible light when excited by radiation emitted from the first LED elements, and has a body made of inorganic material.

Light emitting device and method for producing the light emitting device

A light emitting device that has a radiant efficiency that does not decline in use, enables luminous flux to be increased by a high electric current, and produces white light with good color rendering and a method for producing a light emitting device capable of smoothly transmitting heat generated by LED elements to a carrier substrate. The radiation emitting device has first LED elements for emitting UV radiation, second LED elements for emitting visible light, a substrate made of an inorganic material and which carries the first LED elements and the second LED elements, a body made of inorganic material containing the first LED elements, the second LED elements and the substrate, and an SiC fluorescent screen that is doped with at least one of B and Al as well as N and emits visible light when excited by radiation emitted from the first LED elements.

A LED device formed of LED chips bonded to an exoergic member by the LED chips being bonded to an Au&#x2014;Sn alloy layer formed on an upper surface of the exoergic member with columnar crystals being formed within the Au&#x2014;Sn alloy layer extending in a direction perpendicular to the upper surface of the exoergic member. The method of producing the LED device forms an Sn film directly on the upper surface of the exoergic member, an Au film on a lower surface of the LED chips, mounts the LED chips with the Au film thereon onto the Sn film formed on the upper surface of the exoergic member, and the exoergic member with LED chips mounted thereon is heated in an atmosphere in which a forming gas flows, so that the LED chips are bonded to the exoergic member.

Growing community of inventors

Kanzaki-gun, Japan

Yuji Imai