Nikon Corporation

Olympus Optical Company, Ltd.

Olympus Corporation

Nippon Kogaku K.k.

Olympus Imaging Corporation

Nixon Corporation

De L Associates Inc.

Olympus Corporatoin

Yuji Imai

Shinji Wakamoto

Junichi Itoh

Yasuo Asakura

Osamu Nonaka

Azuma Miyazawa

Yuji Kobayashi

Tsuneo Miyai

Kazuaki Suzuki

Masataka Ide

Tetsuo Taniguchi

Yasuaki Tanaka

Juro Kikuchi

Toshio Matsuura

Minoru Matsuzaki

Yuta Sato

Seiro Murakami

Takashi Muroi

Masaharu Hamada

Katsumi Motohashi

Kazuya Ohta

Tatsuya Suzuki

Sumio Kawai

Hideo Mizutani

Kousuke Suzuki

Atsushi Maruyama

Akikazu Tanimoto

Takeshi Ito

Junichi Ito

Kyoichi Suwa

Yoshinori Matsuzawa

Hideaki Hara

Yoichiro Okumura

Kazuyuki Iwasa

Tsuyoshi Yaji

Yuichi Saito

Toshiyuki Toyofuku

Minoru Hara

Kenji Fujibayashi

Osamu Furukawa

Toshihiko Tsuji

Hisayuki Matsumoto

Mitsumasa Okubo

Hiroki Tateno

Masayuki Murayama

Naohiro Tsuchida

Kesayoshi Amano

Takashi Fujii

Shoji Kawamura

Yasuo Tambara

Hideto Kitazawa

Kazutada Kobayashi

Koji Kaise

Sumito Honda

Masayoshi Yamazaki

Kouji Mizobuchi

Mizutani Hideo

[Problem] To provide a chip-on-board light emitting device and a method for manufacturing the same such that even though the light emitting device is a chip-on-board light emitting device, it is possible to improve color rendering thereof without excessively reducing the amount of light emission and without installing special circuit patterns or performing current control. [Solution] A chip-on-board light emitting device in which a plurality of LED elements are mounted directly on a package substrate includes a circuit pattern formed on the package substrate, the circuit pattern including a plurality of mounting sections on which the plurality of LED elements are mounted and an anode electrode and cathode electrode pair. The LED elements mounted on the circuit pattern include a plurality of types of LED elements having different emission wavelengths and temperature characteristics, so that by utilizing the temperature characteristics of the plurality of types of LED elements, the device as a whole has a greater average color rendering index (Ra) at an operating temperature than at a ordinary temperature.

Light emitting device comprising chip-on-board package substrate and method for manufacturing

An imaging device includes an imaging unit that images a subject to generate electronic image data; and a communication unit that communicates with a plurality of servers through a network. The imaging device also includes an image file generating unit that generates an image file including first interpretation subject information interpreted by anyone of the plurality of servers.

Imaging device, imaging system, image management server, image communication system, imaging method, and image management method

An imaging device includes an imaging unit that images a subject to generate electronic image data; and a communication unit that communicates with a plurality of servers through a network. The imaging device also includes an image file generating unit that generates an image file including first interpretation subject information interpreted by any one of the plurality of servers.

An image pickup apparatus configured to pick up a still image includes an image pickup device having a plurality of pixels to convert an object image formed by an optical system to an electric charge. A pixel reading circuit operates in either a first reading mode for reading electric charges obtained from the respective pixels of the image pickup device on a pixel by pixel basis or a second reading mode for adding and reading the electric charges obtained from the respective pixels of the image pickup device. A controller evaluates camera shake during exposure. When an evaluation level of the shake is greater than a predetermined level, this controller controls the pixel reading circuit to operate in the second reading mode. when the evaluation level is smaller than the predetermined level, the controller controls the pixel reading circuit to operate in the first reading mode.

Image pickup apparatus and method for controlling pixel reading using a shake determination

A camera comprises an optical photographing system, an image pickup device which receives a luminous flux via the optical photographing system to output image data, a monitor on which an image is displayed based on the image data, an actuator which controls a position of the image pickup device to obtain the image data in which an influence of camera shake is reduced, and a camera shake detecting section which detects a camera shake state. In the camera, the image data at the time of non-operation of the actuator is processed/formed from the image data obtained at this time and the camera shake state detected by the camera shake detecting section, and a control is executed in such a manner that the image data at the time of the non-operation of the actuator and the image data at the time of operation of the actuator are displayed on the monitor.

Camera

A display device or a camera includes an organic electroluminescent element emitting multiple color lights. A driving condition setting circuit sets data corresponding to driving conditions for driving the organic electroluminescent element. A drive circuit drives the organic electroluminescent element on the basis of the driving conditions set by the driving condition setting circuit.

Display device for camera using organic EL element

An electronic image pickup apparatus comprises a photographic optical system; solid state image pickup devices disposed on a plant where a subject image formed by subject beams which have passed through the photographic optical system is formed; a main mirror disposed between the photographic optical system and the solid state image pickup devices, wherein a part of the main mirror is formed of a half mirror to divide the subject beams which have passed through the photographic optical system into an observing beam and a focus detecting beam; a sub-mirror for reflecting the subject beam which has passed through the part of the main mirror; a focus detecting optical system for forming an image of the subject beam reflected by the sub-mirror on a partial area of the solid image pickup devices; and an electrical circuit for outputting focus detecting information based on image signals of the partial areas of the solid image pickup devices. The structure provides an electronic image pickup apparatus which contributes to the down-sizing of the apparatus and to the reduction of production cost by eliminating an image pickup device which is dedicated for focus detection.

Electronic image pickup apparatus

When the ordinary exposure is performed, a wafer, to which a photoresist is applied by a resist coater, is transported onto a wafer stage of a projection exposure apparatus to perform the exposure, followed by development by a developing apparatus. When the characteristic is evaluated, respective shot areas on the wafer applied with the photoresist are exposed with an image of a predetermined evaluating mark in a narrow area in an effective field of a projection optical system of the projection exposure apparatus. The characteristic of the resist coater or the developing apparatus is evaluated by detecting a state of a resist pattern after the development. When the image formation characteristic of the projection exposure apparatus is evaluated, the wafer is exposed with images of a plurality of predetermined evaluating marks in a wide area in the effective field. The respective characteristics of the resist coater, the exposure apparatus, and the developing apparatus for constructing a lithography system can be evaluated respectively independently.

Method for evaluating lithography system, method for adjusting substrate-processing apparatus, lithography system, and exposure apparatus

An electronic still camera includes an imaging device imaging an object. A release section puts the imaging operation of said imaging device into effect. A camera shake detection circuit detects the quantity of camera shake during the imaging operation of said imaging device. A sequence control circuit evaluates the quantity of camera shake during the imaging operation detected by camera shake detection circuit in response to the release operation by said release section and reads out an imaging signal when the result of camera shake detection is below a predetermined value.

Electronic still camera with imaging operation performed in parallel with camera shake detection

Method for evaluating lithography system and method for adjusting substrate-processing apparatus

An exposure apparatus and method for a photolithographic process uses a projection optical system that transfers an image of a reticle pattern onto a first shot area on a wafer, the first shot area being made coincident with an image plane within an exposure field of the system. When moving a second shot area into the exposure field, variations in the vertical position of the wafer are compensated by a Z/levelling-stage. Focusing and exposure are performed for the second shot area after an AF sensor system measures and stores a defocus amount of the second shot area relative to the image plane. Repeating this procedure for shot areas on the wafer yields a plurality of defocus amounts, from which any foreign matter existing on the bottom of the wafer is detected. Alternatively, for exposing the first shot area, the vertical position and tilt angle of the wafer are made coincident with those of the image plane. When positioning the second shot area into the exposure field, the tilt angle is kept unchanged, and is measured and stored. Before exposing the second shot area, the vertical position and tilt angle of the wafer is made coincident with those of the image plane. Foreign matter on the wafer is detected from a distribution of the tilt angles on the surface of the wafer.

Exposure apparatus and method for photolithography

A camera includes a finder for enabling an image which is shot on a film to be monitor-displayed by branching a portion of a light beam (image) imaged by a picture-taking lens system, by an up/down movable pellicle mirror comprised of a half mirror, to let the image be received on a image pick-up device. In this camera, a pupil-dividing LCD is arranged in front of the image pick-up device to impart a phase difference to the light beam imaged by the picture-taking lens system to obtain corresponding image data. By doing so, phase difference AF control is carried out. The image pick-up device has both the function of monitoring a pick-up image and the function of detecting a just-in-focus state.

Camera having image pick-up device

The present invention relates, to an exposure method, exposure apparatus, and the like having a configuration for effectively preventing color inconsistencies from occurring due to defocusing upon scanning exposure. In particular, the exposure method and apparatus according to the present invention control the scanning exposure according to the positional relationship between a substrate and a detection area for detecting a focus state of the substrate, the positional relationship between individual shot areas on the substrate the positional relationship between a shot area on the substrate and an edge of the substrate, or the like.

Scanning exposure method detecting focus during relative movement between energy beam and substrate

A projection exposure apparatus detects positions at the measurement points (P,-P,) in the Z-direction on the shot area of the wafer W, and obtains the distribution of the irregularity of the shot area based on the detected result and the pre-known process structure data. For example, when the pattern leaving the narrowest line width is exposed in the pattern area (,B), the pattern area (,B) is made as a focusing reference plane and the difference in level (Z,&minus;Z,) of another area of which reference is pattern area (,B) is added to the level of the best image plane (,) as an offset value. The pattern area (,B) is focused to the best image plane (,) by fitting image plane (,A) to the exposure surface.

Projection exposure apparatus for transferring mask pattern onto photosensitive substrate

An exposure method for a photolithographic process uses a projection exposure apparatus including a projection optical system. The surface of a first shot area on a wafer is caused to be coincident with an image plane of the projection optical system within an exposure field thereof so as to achieve focused condition, and an image of a reticle pattern is transferred onto the first shot area. Then, a second shot area is moved into the exposure field, during which the vertical position of the wafer is corrected by means of a Z/levelling-stage so as to compensate for the variation in the vertical position of the wafer W which could otherwise occur depending on the angle formed between the running plane of the wafer stage and the image plane. Then, an AF sensor system is used to measure and store a defocus amount of the second shot area relative to the image plane. Then, focusing and exposure are performed for the second shot area. This procedure is repeated for the shot areas on the wafer so as to obtain a plurality of defocus amounts, from which any foreign matter existing on the bottom of the wafer are detected. In another embodiment, the vertical position and tilt angle of the wafer are caused to be coincident with those of the image plane, and the first shot area is exposed. Then, the wafer is moved so as to position the second shot area into the exposure field, during which the tilt angle of the surface of the wafer is kept unchanged. Then, the tilt angle of the wafer is measured and stored. Thereafter, the vertical position and tilt angle of the wafer are caused to be coincident with those of the image plane, and the second shot area is exposed. Foreign matter are detected from a distribution of the tilt angles on the surface of the wafer.

Exposure method

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Tokyo, Japan

Yuji Imai