Taiyo Yuden Co., Ltd.

Yuji Hoshi

Masataka Watabe

Shota Yajima

A mounting structure of a chip component includes a chip component that is bonded by having a pair of external terminal electrodes provided on both ends of an element body of the thin chip component bonded to a pair of lands respectively through solder, the pair of lands being provided on an attaching substrate in a lateral direction with respect to each other. Where plan view distances from ends of the external terminal electrodes at the ridge lines formed between the surfaces and side faces of the element body of the chip component to the edges of the lands connected to the external terminal electrodes are designated as 'd,' and the vertical distances from the bottom surfaces of the external terminal electrodes and the lands are designated as 't,' then d&#x3e;t/tan 35&#xb0; and preferably d&#x3e;t/tan 25&#xb0; is fulfilled.

Mounting structure of chip component

In a laminated capacitor, one additional first internal electrode layer, which has its edge connected to the first external electrode as do the first internal electrode layers, is provided to one of the five first internal electrode layers so as to face one another via the second dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity, and one additional second internal electrode layer, which has its edge connected to the second external electrode as do the second internal electrode layers, is provided to one of the five second internal electrode layers so as to face one another via the third dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity.

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Takasaki, Japan

Yuji Hoshi