3m Innovative Properties Company

Yuji Hiroshige

Jun Fujita

Junichi Saito

Tetsu Kitamura

Toshihiro Kasai

Hideki Minami

Norihisa Watanabe

Hideo Yamazaki

Kohichiro Kawate

Michiru Hata

Yoshinao Yamazaki

James S McHattie

Hiroaki Yamaguchi

Naoki Toshima

Sridhar V Dasaratha

James R Shirck

Makoto Sekiguchi

Hidekl Minami

Mayumi Yoshikawa

Koji Ito

The present application relates to a pavement marker including a core from which extends protrusions and a cavity between adjacent protrusions. The microsphere lenses are fixed within the cavity by one of a softening material disposed in the core and an adhesive agent disposed in the cavity.

Retroreflective elements

The present disclosure provides a thermoelectric material which can be formed into a flexible and thin type material. The thermoelectric material is a composite that includes a binder resin, thermoelectric material particles dispersed in the binder resin, and fine metal particles supported on a surface of the thermoelectric material particles.

Composite thermoelectric material and method for producing the same

An electrically conductive composite material that includes an electrically conductive polymer, and at least one metal nanoparticle coated with a protective agent, wherein said protective agent includes a compound having a first part that has at least part of the molecular backbone of said electrically conductive polymer and a second part that interacts with said at least one metal nanoparticle.

Electrically conductive nanocomposite material and thermoelectric device comprising the material

Electrically conductive polymer composite and thermoelectric device using electrically conductive polymer material

A thermoelectric conversion device including a thermoelectric conversion material including a polythienylenevinylene including units represented by formula (1), wherein R1 and R2 are each independently a hydrogen atom, or an alkoxy or alkyl group, and the thermoelectric conversion material is doped with a dopant. 

Polythienylenevinylene thermoelectric conversion material

Provided is a thermally conductive composition which shows a low thermal resistance, and good releasability after service. For example, one composition includes an acrylic-based thermally conductive composition comprising a binder component containing a crystalline acrylic polymer with an alkyl group of 18 carbons or more and a thermally conductive filler.

Acrylic-based thermally conductive composition and thermally conductive sheet

Disclosed is a method for making flexible circuits in which portions of a tie layer are removed by etching the underlying polymer. Also disclosed are flexible circuits made by this method.

Flexible circuits and method of making same

To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.

Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it

To produce a conductive epoxy resin composition with improvement in the characteristics of rapid-curability, heat resistance and moisture resistance, adhesion reliability, storage properties and low-temperature curability that can be used effectively for production of conductive adhesive films. The conductive epoxy resin composition comprises an alicyclic epoxy resin, optional diols, a styrenic thermoplastic elastomer with an epoxy group in the molecule, an ultraviolet activated cationic polymerization catalyst, an optional tackifier having an aromatic ring in the molecule, and conductive particles.

Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods

An adhesive composition, which is useful as an adhesive for FPC protective film and is particularly superior in dimensional stability and adhesion is described herein. The adhesive composition comprises a resin component containing an phenoxy resin, an epoxy resin and a curing agent, characterized in that said resin component further contains a polyester polyol and an inorganic colloid dispersed in said resin component.

Growing community of inventors

Tokyo, Japan

Yuji Hiroshige