Hitachi, Ltd.

Hitachi Microcomputer Engineering, Ltd.

Other

Yuji Hara

Satoru Ito

Tatsuro Toya

Hideaki Takahashi

Satoshi Meguro

Kazuhiro Komori

Minoru Fukuda

Atsushi Ogishima

Takashi Aoyagi

Hirotaka Kobayashi

A semiconductor integrated circuit device including a plurality of holes in an interlayer insulating film beneath a bonding pad wherein a plug is buried in the respective holes and is made of the same conductive film (W/TiN/Ti) as a plug in a through-hole. Any wire as a second layer is not formed in a lower region of the bonding pad. The plug buried in the holes is connected only to the upper boding pad and is not connected to a lower wire.

Process for multilayer wiring connections and bonding pad adhesion to dielectric in a semiconductor integrated circuit device

A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

Resin molded type-semiconductor device having a conductor film

Resin molded type semiconductor device having a conductor film

An EPROM and a method of testing the former, in which a defective memory cell caused by defects in the insulating films between a substrate and a floating gate and between the floating gate and a control gate can be tested without writing any data in the individual memory cells by holding data lines to a low potential and word lines fed with a voltage.

Semiconductor integrated circuit device and method of testing the same

A resin molded type semiconductor device has a metallic ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the ring.

Growing community of inventors

Akishima, Japan

Yuji Hara