Hitachi, Ltd.

Hitachi Global Storage Technologies Netherlands B.v.

Hitachi Global Storage Technologies Japan, Ltd.

Hitachi Media Electronics Co., Ltd.

Yuji Fujita

Jun Yamada

Takashi Shiba

Toshimitsu Takahashi

Yasuo Amano

Kouki Uefune

Toshiyuki Ajima

Takashi Yamaguchi

Nobuyuki Ushifusa

Akitsuna Yuhara

Asao Nakano

Norio Hosaka

Tasao Soga

Tetsuya Nakatsuka

Masahide Okamoto

Hanae Shimokawa

Toshiharu Ishida

Masato Nakamura

Koji Serizawa

Toyoki Asada

Hideki Mukuno

Mari Matsuyoshi

Toshihiro Hachiya

Takeshi Murakami

Shigeo Nakamura

Takako Hayakawa

Naoya Kanda

Kazumi Kawamoto

Kunio Matsumoto

Kiyoharu Kishimoto

Hideo Sotokawa

Naotoshi Akamatsu

Shinya Hamagishi

Kie Ueda

Misao Nakajima

Yoshihide Yamaguchi

Koki Uefuna

A disk device has a small size, a small thickness, a high efficiency, a small degree of vibration and a small level of noise. In one embodiment, the disk device comprises a disk for storing information and a disk drive for driving the disk. The disk drive includes a rotor portion mounting an annular permanent magnet on the outer peripheral portion thereof, and a stator portion disposed on the outer side in the radial direction of the annular permanent magnet. The stator portion is constituted by a wiring board provided with a stator core formed by laminating magnetic metal plates in a radial manner and a coil that is so formed as to surround the stator core while electrically connecting wiring layers and through hole portions. The coil is so formed that among the envelopes connecting the outermost peripheral surfaces of the coil in the radial direction, the neighboring envelops and intersect at an inner position in the radial direction.

Compact disk device and disk drive

Embodiments of the invention provide a disk drive device excellent in reliability that can reduce influence of a temperature change in an environment of use. In one embodiment, a disk drive device includes a disk drive mechanism that records information in a disk or reproduces information stored in the disk and a housing in which the disk drive mechanism is housed. The disk drive device further includes a humidity control element that controls humidity in the inside of the housing, a temperature sensor that detects ambient temperature of the disk drive device or temperature of a portion where temperature changes substantially in the same manner as the ambient temperature, and a control circuit that controls the temperature control element on the basis of a rapid change in temperature detected by the temperature sensor.

Disk drive device with temperature and humidity control

A magnetic disk drive includes a base constituting at least a face included in an enclosure; a shaft secured to the base; a rotor which rotates around the shaft as a rotary axis; a stator for rotating the rotor; and a magnetic disk secured to the rotor; wherein the stator is disposed on a face facing the base. This improves durability of the magnetic disk drive.

Magnetic disk device having a low-profile motor without deterioration in the strength of the enclosure

A technique of connection between VCM system wires and a FPC of a disk drive is improved in the following manner to enable miniaturization and thinning of the disk drive and reduction in cost. There is provided a disk drive comprising a disk-shaped medium for recording information, an actuator on which a head for recording/reproducing information is mounted, a VCM for driving the actuator, a coil holder supporting a coil of the VCM, a FPC for transmitting a signal, which is read by the head, and a signal to the VCM, a cut groove formed on a side of the coil holder, ends of coil lead wires and an end of a ground wire, which are arranged in the cut groove, and an end of the FPC inserted into the cut groove to thereby be connected to the ends of the coil lead wires and the end of ground wire.

Disk drive with spring provided in groove of voice coil holder to electrically connect voice coil with flexible printed circuit

A disk drive comprising a rotor, to which a disk and a plurality of magnets are fixed, and an open-slot type integrally molded stator disposed about an outer periphery of the magnets, and wherein the stator comprises coils formed by etching metallic films on teeth. The invention may also be applied to a closed-slot type stator. With either type, it is possible to produce an opening that is equal to or smaller than the thickness of a coil wire and cogging torque is minimized.

Disk drive motor and disk drive storage device incorporating same

An object of the invention is to inhibit a turning force of a magnetic disc apparatus from being reduced. In order to achieve the object, there is provided a magnetic disc apparatus having a rotor to which a magnetic disc fixed, and a stator which is filled with a resin between stator coils, wherein a member having a lower expansion coefficient than a thermal expansion coefficient of the resin is arranged between the stator coils.

Magnetic disc apparatus having stator structure with reduced distortion

An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.

Electronic device

An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.

Electronic device and optical transmission module

The present invention a structure in which a semiconductor integrated circuit chip can be easily removed and the reliability of flip-chip bonding is assured, a method of packaging electronic parts, and method and apparatus for detaching electronic parts. According to the invention, the object is achieved by a flip-chip bonding structure using two kinds of soluble and insoluble resins for bonding a semiconductor integrated circuit chip and a circuit board.

Packaging structure and method of packaging electronic parts

An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0&tilde;2.0 mass %, In: 0.1&tilde;10 mass %, and Sn: remaining amount.

Electron device and semiconductor device

A surface acoustic wave device which comprises: a plurality of interdigital transducers formed on a surface acoustic wave substrate; and a plurality of thin film electrodes disposed between the interdigital transducers and an end surface of the surface acoustic wave substrate and electrically independently of the interdigital transducers, at least one of distances between adjacent ones of the thin film electrodes being set to be smaller than a distance between the thin film electrodes and the interdigital transducers, so that the electrical performance of the device as well as the insulation resistance does not deteriorate, and the interdigital transducers can be prevented from being electrostatically broken.

Surface acoustic wave device with closely spaced discharge electrodes

A surface acoustic wave apparatus wherein a reflector for reflecting a surface acoustic wave is provided on both sides of at least one of an input interdigital transducer and an output interdigital transducer, or, on one side of one of the input interdigital transducer and the output interdigital transducer.

Surface acoustic wave apparatus and method of productivity and

A surface acoustic wave device characterized in that in addition to linear first bus-bar electrodes which connect in alignment the edges of the same potential electrodes of interdigital electrodes, second bus-bar electrodes are provided which connect the same potential electrodes in the vicinity of the overlapping positions. Also disclosed is a surface acoustic wave device characterized in that the metalized ratio g/p, which is the ratio of the width of an electrode and the intercentral distance between the adjacent electrodes in an irregular pitch electrode group, is varied between 0.1 to 0.4 or between 0.6 to 0.9.

Surface acoustic wave device having apodized transducer provided with

A group-type unidirectional surface acoustic wave filter composed of sending electrodes, reflecting electrodes and meander electrodes constituted by interdigital electrodes, respectively. As a phase shifter of the filter, a capacitive element is used. The geometrical configuration of the meander electrode is determined in accordance with geometrical phase difference. The filter enjoys low insertion loss with a simplified structure.

Surface acoustic wave filter with capacitive phase shifter

In order to present an asymmetric frequency characteristic in an unidirectional acoustic surface wave device with a simple external phase shifter, a transducer formed on a substrate have three interaction areas (acoustic sources) defined by different three electrodes, first electrode being common, second electrode being connected to one end of the phase shifter, third electrode being connected to another end of the phase shifter, and distances between interaction areas being unequal to 2n (n:integer).

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Yokohama, Japan

Yuji Fujita