Fujitsu Corporation

Yuji Akasaki

Terumi Kamifukumoto

Kenji Itasaka

Nobuo Ooyama

Takayuki Mihara

This semiconductor device comprises a semiconductor chip, a signal lead connected to a signal electrode of the semiconductor chip, an external signal electrode connected with the signal lead, a ground lead extending along the signal lead, and a sealing resin sealing these elements. The external signal electrode is formed as a protruding electrode protruding from an undersurface of the sealing resin. One surface of the signal lead is exposed on the undersurface of the sealing resin.

Semiconductor device having a signal lead exposed on the undersurface of a sealing resin with an air gap between the signal lead and a mounting substrate

A method of testing semiconductor devices includes an adhering step, a position correcting step, and an electrical test step. The adhering step includes adhering either a semiconductor device collective body or a plurality of individual semiconductor devices onto an adhesive tape provided on a tape-holding member, the semiconductor device collective body being constructed by a plurality of semiconductor devices integrated together. The position correcting step includes positioning the semiconductor devices by mounting the tape-holding member on a position correction unit and, using an image processing technique, implementing position recognition and position correction of the semiconductor devices adhered on the adhesive tape. The electrical test step includes implementing an electrical characteristic test on the semiconductor devices positioned in the position correction step by connected the semiconductor devices on a testing contactor.

Growing community of inventors

Satsuma, Japan

Yuji Akasaki