Google Inc.

Altera Corporation

Yujeong Shim

Teckgyu Kang

Woon-Seong Kwon

Houle Gan

Mikhail Popovich

Namhoon Kim

Nam Hoon Kim

William F Edwards

Tim Tri Hoang

Kyung Suk Oh

Chenhao Nan

Weiqi Ding

Hae-Chang Lee

Ryohei Urata

Melanie Beauchemin

Yanjing Ke

Woon Seong Kwon

Richard Roy

Xu Zuo

Shinnosuke Yamamoto

Sunitha Chandra

A method includes forming a module aperture in a printed circuit board assembly ('PCBA'), forming an electronic communication interface extending around the module aperture, and plugging a pluggable processor module into the module aperture, the pluggable processor module comprising a micro-processor package, a voltage regulator, and a contact. An electronic communication interface of the pluggable processor module is placed in contact with the electronic communication interface of the PCBA.

Method of plugging a pluggable processor into a PCBA

The technology relates to an integrated circuit (IC) package. The IC package may include a packaging substrate, an IC die, and an integrated voltage regulator die. The IC die may include a metal layer and a silicon layer. The metal layer may be connected to the packaging substrate. The integrated voltage regulator die may be positioned adjacent to the silicon layer and connected to the packaging substrate via one or more through mold vias or through dielectric vias. The IC die may be an application specific integrated circuit (ASIC) die.

Backside integrated voltage regulator for integrated circuits

An integrated circuit package including a substrate configured to receive one or more high-bandwidth memory (HBM) stacks on the substrate, an interposer positioned on the substrate and configured to receive a logic die on the interposer, a plurality of interposer channels formed in the interposer and connecting the logic die to the one or more HBM stacks, and a plurality of substrate traces formed in the substrate and configured to interface the plurality of interposer channels to the one or more HBM stacks.

Integrated circuit package for high bandwidth memory

An assembly includes a printed circuit board ('PCB'). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.

Structure for optimal XPU socket compression

A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contacts that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board. An assembly includes the pluggable processor module and a printed circuit board assembly ('PCBA') including a module aperture that is large enough to receive the power board and narrower than the capacitor board.

Pluggable CPU modules with vertical power

Systems and methods for reducing jitter due to power supply noise in an integrated circuit by drawing additional current. The additional current causes the total current to generally have a frequency higher than a resonant frequency of the integrated circuit and/or a power distribution network of the integrated circuit. A power distribution network may supply power to components of an integrated circuit, and data driver circuitry may draw first current to drive a serial data signal generated from a parallel data signal. Compensation circuitry may receive the parallel data signal and draw second current at times when the compensation circuitry determines data driver circuitry is not drawing the first current based on the parallel data signal, thereby causing a net of the first and second current to be higher than a resonant frequency range of the integrated circuit device and/or a component of the integrated circuit device.

Systems and methods for reducing power supply noise or jitter

Systems and methods are provided for reducing jitter due to power supply noise in an integrated circuit by drawing additional current. The additional current causes the total current to generally have a frequency higher than a resonant frequency of the integrated circuit and/or a power distribution network of the integrated circuit. In one example, a power distribution network may supply power to components of an integrated circuit and data driver circuitry may draw first current to drive a data signal. Compensation circuitry may draw second current at times when the data driver circuitry is not drawing the first current, thereby causing a net of the first and second current to be higher than a resonant frequency range of the integrated circuit device and/or a component of the integrated circuit device (e.g., the power distribution network).

Growing community of inventors

Santa Clara, CA, United States of America

Yujeong Shim