Konica Minolta Opto, Inc.

Konica Minolta Advanced Layers, Inc.

Yuiti Fujii

Shigeru Hosoe

Takemi Miyazaki

Akira Sato

Tougo Teramoto

Toshiyuki Imai

Akihiro Fujimoto

Hajime Mori

Atsushi Naito

Kazuhiro Wada

Daisuke Watanabe

Tohru Tominami

Toshiya Takitani

Yasushi Iijima

The aim is to regulate thickness on the optical axis in the production of wafer lenses. Disclosed is a wafer lens production method that is equipped with a dispensing process for dropping resin onto a molding die (), an imprinting process for pressing either the molding die () or a glass substrate () toward the other, and a releasing process for releasing the glass substrate () from the molding die (), and that repeats the processing from the dispensing process to the releasing process as a single cycle and successively forms resin lenses () on the glass substrate); wherein the height (A) of the non-lens area () surrounding the lenses () and the heights (B and C) of the glass substrate () are measured between the releasing process of a first cycle and the dispensing process of a second cycle, and the position of the molding die () is corrected for imprinting processes of the second cycle, on the basis of the heights (A-C).

Production method of wafer lens

Disclosed is an image pickup device, by which cut resistance at the time of cutting a wafer lens is reduced, high production efficiency is maintained, and excellent optical characteristics are obtained. The image pickup device has a first lens block, a second lens block, a spacer, and a sensor unit. The side surface section of the first lens block, the side surface section of the second lens block, and the side surface section of the spacer are formed on the same plane. A lens cover that covers the first and the second lens blocks is provided in a step formed by respective side surface sections of the first lens block, the second lens block and the spacer, and the side surface section of the sensor unit.

Image pickup device and method for manufacturing the image pickup device

Provided are a wafer lens production method, an intermediate die, an optical component, a molding die, and a molding die production method. The production method of a wafer lens () includes a first intermediate die production step using a die (), a second intermediate die production step using the first intermediate die (), and a wafer lens production step using the second intermediate die (). A first intermediate-die substrate () is provided with a depressed section () on the surface facing the die (). When photo-curable resin (A) is pressed, at least a portion closer to the first intermediate-die substrate () among the top () and the peripheral section () of the die () is arranged in the depressed section (), and a gap is provided so that the die () does not contact with a depressed plane () of the depressed section ().

Production method of wafer lens, intermediate die, optical component, molding die, and production method of molding die

Provided is an optical component manufacturing method wherein various types of information, including information relating to each optical component, can be relatively easily printed on each optical component, even in the case where a plurality of optical components are manufactured in a batch. A lens, a lens unit and a camera module manufactured by using such method are also provided. Prior to dividing camera modules into individual camera modules, a pattern to be printed on each camera module, i.e., printing contents determined based on information on a first lens array or the like after formation, is printed on the surface of the first lens array at one time. Thus, information specific to each camera module can be printed even by the relatively simple method.

Optical component manufacturing method, and lens, lens unit and camera module

It is possible to provide a camera module manufacturing method and a camera model which can improve performance of a camera module without complicating the manufacturing method. A light shield is formed on the side surface of each lens body () and a lens support member (). Thus it is possible to obtain the diaphragm function for regulating the incident light flux transmission area and the function for suppressing the intrusion of stray light without using a separate diaphragm or a light shielding member.

Camera module manufacturing method and camera module

Provided is an injection nozzle and a molding apparatus which ensure injection pressure by suppressing resin leakage even when a resin material having a low viscosity is used. In injection molding, it is especially important that the injection nozzle and a fixed die are excellently kept in contact with each other and that the resin is not leaked. Resin leakage from between the injection nozzle and the fixed die lowers molding pressure, increases molding shrinkage of the resin, and directly affects the qualities of a molded product resulting in generation of a sink, transfer failure and the like. Since an O-ring in a circumferential groove of the nozzle closely comes in contact with a concave spherical surface while elastically transforming on the entire circumference, leakage is effectively suppressed even the resin is a heat-curable resin having a low viscosity.

Injection nozzle and molding apparatus

Provided are a structure of molding tools and an injection molding device that can easily perform molding of an optical element even from a resin of low velocity or the like and can suppress any negative effects by air. The structure of the molding tools includes between the molding tools () a fixed molding tool () and a movable molding tool () and an O-ring () for keeping air tightness and a resin seal () for preventing any resin leakage. The O-ring () performs decreasing of the pressure in a cavity (CV) formed by joining the molding tools (), whereby the vacuum molding in which resin supply and resin curing is carried out under a decreased pressure can be performed. Accordingly, the effects such as prevention of air bubbling due to air trapping by injected resin within the cavity (CV) can be attained. Furthermore, the resin seal () can prevent any resin leakage from the molding tools () even when the resin having a low viscosity is used.

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Hino, Japan

Yuiti Fujii