The Boeing Company

Yuing Huang

Eric Y Chan

Dennis Gary Koshinz

Quynhgiao Nguyen Le

Eric Yuen-Jun Chan

A fiber optic transceiver module having built-in test capability is packaged in a housing to meet small-form-factor (SFF) requirements. The module has a first optical fiber having an angled end that defines an acute angle relative to a longitudinal axis of the first optical fiber. A second optical fiber also has an angled end that defines an acute angle relative to the longitudinal axis of the second optical fiber. The first optical fiber and the second optical fiber are aligned with one another. An optical source emits an optical signal propagated along the first optical fiber in which a portion of the optical signal is received at the second optical fiber and is propagated along the second optical fiber. An optical detector receives a return optical signal transmitted through the angled end of the second optical fiber in response to reflection from a discontinuity in the optical path of the second optical fiber.

Small-form-factor fiber optic transceiver module having built-in test capability and method

More cost-effective fiber optic interface modules, such as fiber optic transmitter modules and fiber optic receiver modules, are provided that meet the high performance requirements demanded by avionics and other specialized applications over a wide range of temperatures and other environmental conditions. The fiber optic interface module includes a printed wiring board having a pair of outwardly extending arms that define a notch therebetween. The fiber optic interface module also includes an integrated circuit mounted upon a medial portion of the printed wiring board and an optical subassembly. The optical subassembly includes a receptacle and an optoelectronic device, such as a light source or a detector. The receptacle generally defines an internal cavity for receiving the optoelectronic device and a pair of slots proximate the internal cavity. As such, the transmitter optical subassembly can be mounted to the printed wiring board so as to be at least partially disposed in the notch defined by the printed wiring board. In this regard, the respective arm portions of the printed wiring board are preferably inserted into the pair of slots defined by the receptacle in order to permit a portion of the optical subassembly to be disposed within the notch. As such, the path length between the optoelectronic device and the integrated circuit is effectively reduced, thereby correspondingly reducing circuit parasitics and improving the performance of the fiber optic interface module. Additionally, a method of fabricating a fiber optic interface module is provided.

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Bellevue, WA, United States of America

Yuing Huang