Other

Hitachi-kokusai Electric Inc.

Yuichirou Tanaka

Hitoshi Oka

Fumio Morita

Masataka Fujiki

Noriyuki Oroku

Susumu Aiuchi

Yoichi Takahara

Tomonori Saeki

Akinobu Yamaoka

Noriyuki Ohroku

At a time of cleaning a plate-like part such as a wafer or the like while rotating, for the purpose of reducing a contamination, a damage and an unevenness of process of the plate-like part which are caused by an amount of charged electricity of the plate-like part, chuck pins (chuck members) which chuck the plate-like part such as the wafer or the like and upper and lower cleaning plates and which oppose to the plate-like part are constituted by a resin material containing carbon powders, and a desired potential difference is applied to a portion between the plate-like part and the cleaning plates by a voltage control unit which is provided in an outer portion.

Cleaning apparatus for plate-like part and method thereof

The fluid treatment apparatus, as disclosed, comprises upper and lower Bernoulli-plates and each of which includes a metal plate provided on overall outer surface thereof. On each of the metal plates there is arranged a spiral-shaped circulating pipe through which a heating medium or a cooling medium are circulated so as to rapidly heat or cool the upper and lower Bernoulli-plates. During the treatment of a wafer by the apparatus, the upper and lower Bernoulli-plates are disposed in parallel with each other to define a narrow gap therebetween while a clearance between the wafer and the upper Bernoulli-plate and a clearance between the wafer and the lower Bernoulli-plate are kept to be equal to each other. Thus, the present invention can achieve various purpose such as a time saving for the cleaning, reduction of consumption of the cleaning liquid and inhibition of cleaning irregularity.

Plate-like specimen fluid-treating apparatus and plate-like specimen fluid-treating method

A substrate treating apparatus and method can recover a substrate treating liquid such as a cleaning liquid in an efficient manner and positively avoid occurrences of treatment defects such as formation of cleaning spots, water marks and the like. A fixed upper plate and a fixed lower plate are disposed in opposition to each other so as to define a space therebetween. A substrate such as a semiconductor wafer is inserted into the space between the fixed upper and lower plates, supported there by a support and adapted to be rotated through rotation of the support. A substrate treating medium such as a cleaning liquid is introduced into the space to treat the substrate while the substrate is rotating. The treating medium after having treated the substrate is discharged from the space through a discharge passage which is defined between an outer peripheral surface of the support and an inner surface of a housing which covers the outer peripheral surface of the support. Rotary blades are disposed in the discharge passage and adapted to rotate in accordance with the rotation of the substrate, thereby enhancing discharging of the substrate treating medium from the space through the discharge passage.

Substrate treating apparatus

Growing community of inventors

Fujisawa, Japan

Yuichirou Tanaka