Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Sumitomo Electric Fine Polymer, Inc.

Yuichiro Yamanaka

Hirohisa Saito

Yoshihiro Imagawa

Yoshio Oka

Makoto Nakabayashi

Yoshifumi Uchita

Masato Hasegawa

Shigeru Nakayama

Satoshi Kiya

Keiichiro Geshi

Provided is a joined body including a piezoelectric substrate and a polycrystalline spinel substrate provided on one main surface of the piezoelectric substrate, wherein a ratio T1/T2 between T1 and T2 is 0.1 or less, where the T1 represents an average thickness of the piezoelectric substrate and the T2 represents an average thickness of the polycrystalline spinel substrate, and the polycrystalline spinel substrate has a TTV of 1.5 μm or less in a main surface which contacts the piezoelectric substrate.

Joined body and surface acoustic wave device

Provided is a joined body including a piezoelectric substrate and a polycrystalline spinel substrate provided on one main surface of the piezoelectric substrate, wherein the polycrystalline spinel substrate has a porosity of 0.005% or more and 0.6% or less.

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

Growing community of inventors

Osaka, Japan

Yuichiro Yamanaka