Murata Manufacturing Co., Ltd.

Yuichiro Teshima

Kenichi Ishizuka

Toshiyuki Nakaiso

Yutaka Takeshima

An impedance conversion circuit includes an auto-transformer circuit including a first inductor connected between a first port connected on a power supply portion side and a second port connected on an antenna side and a second inductor connected between a third port that is grounded and the second port; a first phase shifter with a first end connected to the first port; an inductor connected in series between a second end of the first phase shifter and the power supply portion; and a capacitor connected in series to the inductor and connected in series between the second end of the first phase shifter and the power supply portion.

Impedance conversion circuit, antenna apparatus, and wireless communication apparatus

A semiconductor package includes an interposer, a semiconductor element installed on a first surface of the interposer, bumps formed on a second surface of the interposer, and a chip component installed on the second surface of the interposer. The interposer is a silicon interposer; the semiconductor element is flip-chip mounted on the first surface of the interposer; the chip component is a thin film passive element formed by carrying out a thin film process on a silicon substrate, and a pad being formed on one surface of the thin film passive element; and the pad of the chip component is connected to a land formed on the second surface of the interposer using a conductive bonding material. According to this structure, the reliability of a bond between the interposer and the chip component of the semiconductor package can be ensured while achieving a small size.

Growing community of inventors

Nagaokakyo, Japan

Yuichiro Teshima