Nichia Corporation

Yuichiro Tanda

Toshio Matsushita

Hiroto Tamaki

Tomohide Miki

Shinji Nishijima

Masato Fujitomo

Masahito Fujitomo

A light emitting device including a bulb having a side surface, a board elongated longer in a first direction than in a second direction perpendicular to the first direction, and a plurality of light emitting elements mounted on the board. Each of the plurality of light emitting elements has an upper surface and a lower surface opposite to the upper surface, where the lower surface is mounted on the board. The device includes a plurality of sets of metal plates and leads electrically connected to the plurality of light emitting elements, and a wavelength conversion member covering the light emitting elements and a portion of each of the metal plates. The board, the light emitting elements, the sets of metal plates and leads, and the wavelength conversion member are disposed in the bulb. The upper surface of each of the light emitting elements faces the side surface of the bulb.

Light emitting device

A light emitting device including a board, light emitting elements, a wavelength conversion member, and first and second metal plates. The board has a first surface and an opposite second surface, and is longer in a first direction than in a second direction perpendicular to the first direction. The light emitting elements are mounted on the first surface and are arrayed in a row along the first direction. The wavelength conversion member includes a first portion covering the light emitting elements and a second portion covering the second surface. The light emitting elements includes a first light emitting element located closest to the first metal plate, and a second light emitting element located closest to the second metal plate. The light emitting elements on the first surface are located between a first end surface of the first metal plate and a first end surface of the second metal plate.

A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Optical-semiconductor device including a wavelength converting member and method for manufacturing the same

A light emitting device includes a first metal plate, a second metal plate, and light emitting elements between the metal plates. The device further includes a wavelength conversion member excited by a first light from the light emitting elements to emit a second light having a wavelength different from the first light, a bulb including a base, a first lead connected to the first metal plate, and a second lead connected to the second metal plate. The base of the bulb includes terminals connected to respective leads. The conversion member covers the light emitting elements entirely, opposite surfaces of the first metal plate partially, and opposite surfaces of the second metal plate partially. The first lead is connected to a portion of the first metal plate exposed from the conversion member, and the second lead is connected to a portion of the second metal plate exposed from the conversion member.

A light emitting device includes a plurality of leads and a board having a first surface on a first surface side thereof and a second surface on a second surface side thereof, the second surface being an opposite side to the first surface. Light emitting elements are mounted on a first surface of a board. A wavelength conversion member is formed unitarily with a transparent member and covers the light emitting elements. The wavelength conversion member has a first end and a second end. The wavelength conversion member is disposed at a first surface side and a second surface side and is elongated in a longitudinal direction when viewed in a plan view of the first surface side of the board. A first metal plate protrudes at the first end of the wavelength conversion member. A second metal plate protrudes at the second end of the wavelength conversion member.

A light emitting device includes light emitting elements mounted on a first surface of a board, and a common-lead region disposed on the first surface of the board between the first light emitting element and the second light emitting element. A wavelength conversion member covers the light emitting elements and the common-lead region. The wavelength conversion member has a first end and a second end. A first metal plate protrudes at the first end of the wavelength conversion member. A second metal plate protrudes at the second end of the wavelength conversion member. The first light emitting element is connected to the common-lead region via the first wire and is electrically connected to the first metal plate via the second wire. The second light emitting element is connected to the common-lead region via the third wire and is electrically connected to the second metal plate via the fourth wire.

A light emitting device including a transparent board elongated in a first direction and having a first surface and an opposite second surface. Light emitting elements are arranged in the first direction on the first surface side of the board. A transparent bulb houses the board and the elements. A base is connected to the bulb, and leads electrically connect the elements to the base. The leads have a first end portion connected to the base, and an opposite second end portion. Conductive members are respectively connected to the second end portions of the leads, and the conductive members are arranged at both side of the elements on the board in the first direction. A first wavelength converting member is provided on the first surface and seals the elements. The first wavelength converting member is elongated in the first direction. The second surface of the board faces the base.

Optical-semiconductor device with bottom surface including electrically conductive members and light-blocking base member therebetween, and method for manufacturing the same

Optical-semiconductor device and method for manufacturing the same

A light emitting device includes a board, light emitting element chips, a wavelength conversion member, a transparent bulb, support leads, and a support base. The board has a first surface and a second surface. The second surface is an opposite side to the first surface. The light emitting element chips are mounted on the first surface side. The wavelength conversion member is formed unitarily with a transparent member. The transparent bulb encloses the board and the light emitting element chips. The support leads secure the light emitting element chips inside the transparent bulb. The support base can be threadedly engaged with a conventional light bulb socket along a socket axis. The wavelength conversion member is provided on a first surface side and a second surface side, and is elongated in a longitudinal direction. The light emitting element chips is aligned along a line that extends in the longitudinal direction.

Broad light emission is provided and additionally heat conductivity is increased to improve reliability. A light emitting device comprises a light emitting element, a pair of conductor members, a transparent board and a transparent member. The conductor members are spaced away from each other at an interval in a side-surface direction of the light emitting element and are electrically connected to the light emitting element. The transparent board supports the light emitting element and the pair of conductive members. The transparent member is located on the transparent board and seals the light emitting element and the pair of conductor members. The pair of conductor members are provided with a pair of metal plates that are secured thereon. The pair of metal plates project from the transparent member in directions different from each other.

A light emitting device includes a board, a light emitting element, and a transparent member. The light emitting element is mounted on the board. The transparent member seals the light emitting element. The transparent member is disposed around a periphery of the board and the light emitting element. The transparent member comprises a phosphor therein.

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Shinjuku-ku, Japan

Yuichiro Tanda