Hitachi, Ltd.

Yuichiro Sano

Toru Miyasaka

Tomohiro Inoue

Mamoru Okano

The purpose of the present invention is to provide a method for transferring a pattern of a circuit pattern precursor formed of electroconductive particles containing no resin component onto an objective substrate with high transfer efficiency while retaining a pattern shape. A method of transferring the circuit pattern precursor formed from an conductive particle dispersed solution on a dielectric thin film body includes the steps of: temporarily removing a liquid film remaining around the circuit pattern precursor right after a development step; subsequently re-electrifying the electroconductive particle pattern by supplying a solvent again to the circuit pattern precursor; and then electrostatically transferring the pattern onto the objective substrate through electrophoresis in the solvent.

Circuit pattern formation device and method of forming circuit pattern

An object is to improve the adhesion strength between a circuit pattern and its substrate without increasing the resistance value of the circuit pattern in preparation of a circuit pattern holding substrate. A circuit pattern formation deviceforms, after forming a precursor circuit-patternin the surface of a dielectric thin film body, a circuit patternonto a target substratefrom the dielectric thin film body. After forming an electrostatic latent imagein the upper surface of the dielectric thin film body, the electrostatic latent image is exposed using an exposure unitto prepare a pattern. A development apparatussupplies a conductive particle dispersion solutionto this pattern to form a precursor circuit-pattern. By energizing the circuit pattern holding substrate, in which an adhesive layeris formed, the precursor circuit-pattern is temporarily transferred to the circuit pattern holding substrate. The transferred precursor circuit-pattern is heated using the heaterto form a circuit pattern. The circuit pattern and the adhesive layer are released from the circuit pattern holding substrate, thereby transferring to the target substrate.

Circuit pattern formation device and method of forming circuit pattern to substrate

An electrically conductive pattern forming apparatus has process disposition which reduces contamination of a pattern or inside of the apparatus due to backflow and leakage of a liquid material such as a developing agent or a cleaning liquid. A developing device and a cleaning device in the electrically conductive pattern forming apparatus using an electrophotographic method are disposed in a lower region about the center of a photoreceptor, a solvent removing process is disposed in a region in which the photoreceptor rotates upward, and a transfer liquid applying process and an electrostatic transfer process are disposed above the center of the photoreceptor and in a region in which the photoreceptor rotates downward.

Electrically conductive pattern forming apparatus

Microscopic particle decentralized solution having microscopic particles with different diameters are decentralized, wherein: the microscopic particle decentralized solution has two peaks in a granularity distribution, at a large diameter and a small diameter; and microscopic particle mixtures satisfying the following relationships are decentralized in the solution;and&#x3e;3.84&#xd7;()

Decentralized solution of microscopic particles and circuit formation device

A droplet generator comprising a first unit having an elongate liquid chamber one end thereof is open and at least one raw of orifices disposed in a line oppositely to the open end in the longitudinal direction of the first unit, a second unit having an elongate diaphragm provided on the bottom of the second unit and a plurality of vibrators provided within the diaphragm area, a vibrating apparatus provided on the top of the vibrators, and a stationary section to fix the vibrating apparatus. The diaphragm of the second unit is provided closely and oppositely to the open end of the liquid chamber of the first unit.

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Mito, Japan

Yuichiro Sano