Tdk Corporation

Yuichiro Okuyama

Takashi Ohtsuka

Hajime Kuwajima

Hideya Matsubara

Takeshi Oohashi

Masashi Iwata

Kenichi Yoshida

Tomoya Hanai

Kazuhiro Yoshikawa

Isao Kanada

Yoshihiro Shinkai

Yusuke Ariake

Tomonaga Nishikawa

Shinya Nakai

Manabu Yamatani

Masami Itakura

Yusuke Oba

Yu Fukae

Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.

Electronic component configured to relax internal stresses due to changes in temperature and manufacturing method of the same

Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.

Electronic component and manufacturing method therefor

Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

Electronic component and its manufacturing method

An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer.

LC composite component

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

An LC composite component includes a non-magnetic substrate, a magnetic layer with magnetism, capacitors, inductors, and core parts with magnetism. The non-magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the non-magnetic substrate. The inductors and the capacitors are disposed between the first surface of the non-magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the non-magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core parts is 1.0 or more times the thickness of the magnetic layer in a direction perpendicular to the first surface of the non-magnetic substrate, and each of the magnetic layer and the core parts contains magnetic metal particles and resin.

Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.

Multilayer wiring structure and its manufacturing method

A high frequency module comprises: a switch circuit connected to two antenna terminals; a diplexer connected to two reception signal terminals and the switch circuit; and a diplexer connected to two transmission signal terminals and the switch circuit. Each of the diplexers incorporates two band-pass filters and a low-pass filter. Each of the band-pass filters is formed by using a resonant circuit.

High frequency module

A high frequency module comprises a layered substrate. Inside the layered substrate, a reception diplexer for processing reception signals and a transmission diplexer for processing transmission signals are provided. The reception diplexer and the transmission diplexer are located in two different regions inside the layered substrate. A conductor portion that is connected to the ground and that electromagnetically separates the reception diplexer and the transmission diplexer from each other is provided between the two regions inside the layered substrate. The conductor portion is formed by using a plurality of through holes.

A high frequency module comprises: a switch circuit connected to two antenna terminals; a diplexer connected to two reception signal terminals and the switch circuit; and a diplexter connected to two transmission signal terminals and the switch circuit. Each of the diplexers incorporates two band-pass filters and a low-pass filter. Each of the band-pass filters is formed by using a resonant circuit.

A high frequency electronic component comprises a layered substrate. On the bottom surface of the layered substrate, there are provided a plurality of functional terminals for inputting and outputting signals relating to functions of a circuit inside the layered substrate, a plurality of ground terminals, a plurality of terminals that are not connected to external circuits, and a conductor section for grounding. The conductor section for grounding includes: a center portion located in a region surrounded by a plurality of terminals; and a plurality of coupling portions for coupling the center portion to the terminals.

High frequency electronic component

A high frequency module comprises: a switch circuit connected to first and second antenna terminals; a first diplexer connected to first and second reception signal terminals and the switch circuit; a second diplexer connected to first and second transmission signal terminals and the switch circuit; and a layered substrate for integrating these components. The layered substrate includes a first region and a second region that are divided from each other by an imaginary plane that passes through the center of the bottom surface of the layered substrate and that intersects the bottom surface at a right angle. The first diplexer is located in the first region while the second diplexer is located in the second region. The locations of the first antenna terminal and the first and second reception signal terminals and the locations of the second antenna terminal and the first and second transmission signal terminals are symmetric with respect to the imaginary plane.

A high frequency module comprises a switch circuit connected to two antenna terminals and two diplexers connected to the switch circuit. Each of the diplexers incorporates two band-pass filters (BPFs). Each of the diplexers further incorporates a capacitor provided between one of the BPFs and a node of signal paths and another capacitor provided between the other of the BPFs and the node.

Growing community of inventors

Tokyo, Japan

Yuichiro Okuyama