Fujitsu Corporation

Sharp Kabushiki Kaisha Corporation

Yuichiro Ohta

Kenji Iida

Yasuhito Takahashi

Norikazu Ozaki

Hiroyuki Katayama

Toshiro Katsube

Masaru Sumi

Yasunaga Kurokawa

Kazuo Nakano

Kazuhiro Watanabe

Masaru Kitano

Mikio Fujii

Katsuyuki Miyazaki

Yuuichi Kubo

Hideo Ishii

Mitsuaki Sugine

Mineo Watashiro

The vacuum processing apparatus includes a vacuum chamber, a vacuum pump, and a pipeconnecting the vacuum chamber to the vacuum pump to evacuate the vacuum chamber. A flexible pipe is included as a part of the pipe, and a mechanism for fixing the flexible pipe so as not to shrink at the time of evacuation. The mechanism includes a bar for fixing the vacuum pump side of the flexible pipe to a floor. In an embodiment, the vacuum processing apparatus is a substrate bonding apparatus for fabricating a display device.

Vacuum processing apparatus

The invention relates to a method of production control and a method of manufacturing industrial products. It is an object of the invention to provide a method of production control and a method of manufacturing industrial products which make it possible to set a target processing quantity of a process appropriately set and to improve the throughput of a production line as a whole. A method of production control for a production line including a plurality of processes is provided, in which a target processing quantity Lk for a process Pk is obtained from:()=0()where the processes are represented by Pn (n=1, 2, . . . , k&#x2212;1, k, . . . ) in the order of their closeness to warehousing; Nk represents a total quantity scheduled to be warehoused from a day as a starting point until after lead time Tk from the process Pk up to the warehousing passes; and SKk represents an expected cumulative quantity completed, which will contribute to the warehousing, among work in process which has passed through the process Pk.

Method of production control and method of manufacturing industrial products

A process for fabricating thin multi-layer circuit boards. A substrate is disposed over a heat-accumulating block adjacent thereto so that it is uniformly heated from the back side thereof during the pre-baking.

Process for fabricating a thin multi-layer circuit board

A thin multi-layer circuit board having alternately stacked wiring pattern layers, including a top wiring pattern layer and insulating layers on an insulating plate-like substrate. The wiring pattern layers are electronically connected through vias in the insulating layers to form a predetermined circuit pattern by said wiring pattern layers. A metallic barrier layer is formed on the top wiring pattern layer, except at an exclusion zone of the metallic barrier layer. An electronic part-mounting pad layer and a remodeling pad layer are formed on the metallic barrier layer. The remodeling pad layer is arranged adjacent the electronic part-mounting pad layer, with the exclusion zone therebetween.

Thin multi-layer circuit board having a remodeling pad layer and a metallic barrier layer with an exclusion zone

A plurality of subsidiary transport paths are disposed crossing a main transport path, for transferring a workpiece. A stocker is disposed at each cross point between the main transport path and each of the subsidiary transport paths. The stocker transfers the workpiece to and from the main transport path and a corresponding subsidiary transport path and temporarily stocks the workpiece. A plurality of processing apparatuses are disposed corresponding to each of the subsidiary transport paths. The processing apparatus receives the workpiece transported on a corresponding subsidiary transport path, processes it, and returns it to the corresponding subsidiary transport path. An efficient transport as a whole can be realized.

Production line workflow and parts transport arrangement

A process for fabricating thin multi-layer circuit boards which allow the electrical conduction of remodeling pads to be easily cut do not use etching for gold, avoid the lift-off method for forming a thin chromium film on the wiring pattern layer, allow a defective wiring pattern layer to be removed, and which uses uniform heating of the substrate, from the back side thereof, at the time of pre-baking. A barrier metal (60) is excluded from a portion where the electrical conduction of a remodeling pad (62b) is to be cut (FIGS. 1 to 16). Alternatively, gold-plating resist is formed in order to avoid the etching for gold (FIGS. 17 to 19). Alternatively, a thin chromium film is formed in advance by etching on the wiring pattern layer (FIGS. 27 to 33). Alternatively, a metallic barrier film (122) is formed on each of the wiring pattern layers so that the wiring pattern layer can be removed without affecting other wiring pattern layers (FIGS. 36 to 42). Alternatively, the substrate is disposed over a heat-accumulating block (138) adjacent thereto so that it is uniformly heated from the back side thereof during the pre-baking.

Thin multi-layer circuit board and process for fabricating the same

Growing community of inventors

Yonago, Japan

Yuichiro Ohta