Shinkawa Ltd.

Yamaha Robotics Co., Ltd.

Yamaha Motor Robotics Holdings Co., Ltd.

Yuichiro Noguchi

Kohei Seyama

Tetsuya Utano

Alexander Dzhangirov

Toru Maeda

Osamu Watanabe

Tomonori Nakamura

Satoru Nagai

Katsutoshi Nomura

In this method for detecting a degree of parallelism of a mounting device: a triangular pin is arranged at a point A on a placement surface of a stage; a mounting head is lowered, and a height of the mounting head when a holding surface comes into contact with a tip end of the triangular pin is detected using an encoder, after which the triangular pin is moved to a point B and the mounting head is lowered; the height of the mounting head when the holding surface comes into contact with the tip end of the triangular pin is detected by the encoder; and the degree of parallelism between the placement surface of the stage and the holding surface of the mounting head is calculated on the basis of the detected heights at point A and point B.

Mounting device, and method for detecting degree of parallelism of mounting device

A bonding apparatus comprises a chip holding part that disposes a chip part onto a substrate that has been placed on a substrate stage. The bonding apparatus adjusts the inclination of a chip holding surface that releasably holds the chip part. The bonding apparatus comprises: an adjustment controller which stores inclination information pertaining to inclination respectively for locations on a stage main surface having the substrate placed thereon; and a conforming jig which has a conforming surface onto which the chip holding surface is pressed, and in which the inclination of the conforming surface can be changed such that the inclination of the chip holding surface corresponds to the inclination indicated by the inclination information.

Bonding device and adjustment method for bonding head

The present invention provides a mounting apparatus and a parallelism detection method in the mounting apparatus. The parallelism detection method in the mounting apparatus includes: a first height detection process of detecting first heights of a mounting tool when a holding surface comes into contact with the a tip of a triangular pin by placing the triangular pin on a placement surface of a stage and lowering the mounting tool; a second height detection process of detecting second heights of the mounting tool when the tip of the triangular pin comes into contact with the placement surface by holding the triangular pin on the holding surface of the mounting tool and lowering the mounting tool; and a parallelism calculation process of calculating the parallelism between the placement surface of the stage and the holding surface of the mounting tool based on the first heights and the second heights.

Mounting apparatus and parallelism detection method in mounting apparatus

A mounting apparatus () serves to place a film between an electronic component and a bottom surface of a mounting head and mount the electronic component. The mounting apparatus includes: a film winding mechanism () that rotates a winding reel () to wind in a film spanning from a dispensing reel to the winding reel (), the film winding mechanism () executing the winding so that a new film is disposed on the bottom surface of the mounting head each time when an electronic component is mounted; a tension detecting part () that detects the tension of the film after the same is wound by the film winding mechanism (); and a control part () that rotates the winding reel () by a winding motor () to adjust the tension on the basis of the tension detected by the tension detecting part (). A film supply apparatus is also provided.

Mounting apparatus and film supply apparatus

A device for linearly moving bases with respect to an object, includes first and second bases, a linear scale provided with graduations at pitches in the moving direction, first and second encoder heads attached to the first and second bases, and a control unit. The control unit maintains an interval between the first and second encoder heads to be constant, and moves the first and second bases while sequentially detects a first and second graduation numbers, and calculates a distance on the scale between the first and second encoder heads by multiplying a difference between the first and second graduation numbers by the pitch, and calculates a position correction coefficient of the scale as a ratio of the interval with respect to the calculated distance, and controls the movement amount of the first movable body and the second movable body based on the position correction coefficient.

Device and method for linearly moving first and second moving bodies relative to target object

The present invention is provided with: a base moving linearly relative to a substrate and having a first and second positions that are spaced apart from each other by a predetermined interval a in the movement direction; a linear scale where a plurality of graduations having a predetermined pitch are provided along the movement direction; encoder heads which respectively are disposed at the first and second positions of the base and detect first and second graduation numbers of the linear scale with respect to the first and second positions, wherein, as the base is moved along the linear scale, the first and second graduation numbers are detected in this order in the respective encoder heads, and the movement amount of the base is controlled on the basis of the ratio between the predetermined interval and the distance between the first graduation number and the second graduation number on the scale.

Apparatus and method for linearly moving movable body relative to object

This bonding apparatus is provided with: a bonding mechanism which has a bonding surface that holds a semiconductor die in a detachable manner, with a film being interposed therebetween, and a heater that applies heat to the bonding surface; a film conveyance mechanism which supplies the film to the bonding surface; a remover bar which is able to enter between the film and the bonding surface; and a drive unit which drives the remover bar.

Bonding apparatus and bonding method

This mounting device () comprises: a base () that moves linearly in relation to a substrate (); a bonding head () that is attached to the base (); a camera () that is attached to the base () and identifies the position of the substrate (); a linear scale () having a plurality of graduations along the movement direction; a bonding head-side encoder head (); and a camera-side encoder head (). A control unit () causes the base () to move to a position where the bonding head-side encoder head () detects the position of a graduation. Due to this configuration, positioning accuracy of a semiconductor die () in relation to the substrate () is improved.

Device and method for positioning first object in relation to second object

[Problem] To bond an electronic component on a substrate via an adhesive material satisfactorily. [Solution] A bonding devicefor thermally bonding an electronic componentto a substrateor to another electronic component via an adhesive material, the bonding device being provided with: a bonding toolcomprising a bonding distal-end portionwhich includes a bonding surfaceand tapered side surfacesformed in a tapering shape becoming narrower toward the bonding surface, the bonding surfacehaving a first suction holefor suction-attaching the electronic componentvia an individual piece of a porous sheet, the tapered side surfaceshaving second suction holesfor suction-attaching the porous sheet; and a bonding control unitwhich controls the first suction holeand the second suction holesindependently from each other.

[Object] To provide a plasma apparatus capable of igniting plasma reliably over a long period. [Solution] The apparatus includes a hollow structural body () having a hollow structure along an axis, a first electrode () disposed inside the hollow structural body (), and a second electrode () having a structure that externally covers a plasma generation area () of the hollow structural body (). The first electrode () has a deformation structure () within the plasma generation area of the hollow structural body.

Growing community of inventors

Tokyo, Japan

Yuichiro Noguchi