Kyocera Corporation

Yuichiro Ishizaki

Seiichirou Itou

Genshitaro Kawamura

Haruki Umeki

A wiring substrate includes an insulating substrate including a first surface and a wiring conductor located at the insulating substrate, the insulating substrate containing multiple bulk crystallites of SiC with different polytypes. An electronic device includes the wiring substrate described above and an electronic component mounted on the wiring substrate. An electronic module includes the electronic device described above and a module substrate on which the electronic device is mounted.

Wiring substrate, electronic device, and electronic module

A wiring substrate includes: an insulating substrate comprising a principal face; a wiring line located on the principal face; and a protruding portion on a side of the wiring line, the protruding portion being smaller in thickness than the wiring line and protrudes from the side along the principal face.

Wiring substrate and electronic device

Provided is a plasma generator which can eliminate breakage due to thermal stress without deteriorating plasma generating efficiency. A plasma generatorhas an base memberprovided with a discharge spaceand a pair of electrodesprovided on the base memberwhile sandwiching the discharge spacetherebetween, wherein at least one electrodeof the pair of electrodeshas a plurality of electrode layersprovided at positions different from each other in a facing direction of the pair of electrodes

Growing community of inventors

Kyoto, Japan

Yuichiro Ishizaki