Fujifilm Corporation

Yuichiro Goto

Naoya Shimoju

Hirotaka Kitagawa

Akihiro Hakamata

Akinori Shibuya

Tadashi Oomatsu

Yuichiro Enomoto

Kunihiko Kodama

Kenichi Kodama

Kazuhiro Marumo

Provided are: a composition for forming an underlayer film for imprinting, which contains a high-molecular-weight compound having a polymerizable group, a chelating agent, and a solvent, and a method for producing the same; a kit including the composition for forming an underlayer film; a pattern producing method using the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, which includes the pattern producing method as a step.

Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film, kit, pattern producing method, and method for manufacturing semiconductor element

Provided are a curable composition for imprinting including a polymerizable compound, a photopolymerization initiator, and a particulate metal which has a particle diameter of 1 nm or larger, as measured by a single particle ICP-MASS method, and includes at least one kind of iron, copper, titanium, or lead, in which a content of the particulate metal is 100 ppt by mass to 30 ppb by mass with respect to a solid content of the composition; a method for producing the curable composition for imprinting; a cured product using the curable composition for imprinting; a pattern producing method; and a method for manufacturing a semiconductor element.

Curable composition for imprinting, method for producing curable composition for imprinting, cured product, pattern producing method, and method for manufacturing semiconductor element

A composition for forming an underlayer film in an imprinting method, which includes a high-molecular-weight compound having a polymerizable functional group and a monomer having a plurality of crosslinking functional groups capable of being bonded to the polymerizable functional group, and in which a Hansen solubility parameter distance, which is a difference between a Hansen solubility parameter of the high-molecular-weight compound and a Hansen solubility parameter of the monomer, is 5.0 or less, and regarding the two crosslinking functional groups among the plurality of crosslinking functional groups, the number of atoms, which constitute a shortest atom chain mutually linking crosslinking points in the respective crosslinking functional groups, is 7 or more; a laminate including a layer formed of the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, in which a semiconductor element is manufactured using a pattern obtained by a pattern producing method.

Composition for forming underlayer film in imprinting method, kit, pattern producing method, laminate, and method for manufacturing semiconductor element

Provided are a composition for forming an underlayer film for imprinting, including a curable component, and a particulate metal which has a particle diameter of 10 nm or larger, as measured by a single particle ICP-MASS method, and contains at least one kind of iron, copper, titanium, or lead, in which a content of the particulate metal is 50 ppt by mass to 10 ppb by mass with respect to the composition; a method for producing a composition for forming an underlayer film for imprinting; a pattern producing method; a method for manufacturing a semiconductor element; a cured product; and a kit.

Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film for imprinting, pattern producing method, method for manufacturing semiconductor element, cured product, and kit

Provided is a kit including a curable composition for imprinting which contains a polymerizable compound having an aromatic ring and a composition for forming an underlayer film for imprinting which contains a polymer and a solvent, in which the polymer contains at least one kind of specific constitutional unit and has a polymerizable group, a film formed of the composition for forming an underlayer film for imprinting is a solid film at 23° C., and a portion that has a continuous partial structure containing an aromatic ring which is included in the polymerizable compound and accounts for 60% by mass or more of the polymerizable compound is common to a continuous partial structure containing an aromatic ring which is included in a substituent R in a side chain in the polymer. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting which is used in combination with a curable composition for imprinting; a laminate; a method for producing a laminate; a method for producing a cured product pattern; and a method for manufacturing a circuit board.

Kit, composition for forming underlayer film for imprinting, laminate, and production method using the same

Provided is a kit including a curable composition for imprinting, and a composition for forming an underlayer film for imprinting, in which the composition for forming an underlayer film for imprinting contains a polymer having a polymerizable functional group, and a compound in which the lower one of a boiling point and a thermal decomposition temperature is 480&#xb0; C. or higher and &#x394;HSP, which is a Hansen solubility parameter distance from a component with the highest content contained in the curable composition for imprinting, is 2.5 or less. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting, a pattern forming method, and a method for manufacturing a semiconductor device, which are related to the kit.

Kit, composition for forming underlayer film for imprinting, pattern forming method, and method for manufacturing semiconductor device

There are provided a composition for forming an adhesive film for imprinting having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting contains a resin having a polymerizable group; and a solvent, in which the resin has at least one kind of a repeating unit derived from a polymerizable compound having a C log P value less than or equal to 0, and solubility of the resin in water at 25&#xb0; C. is greater than or equal to 1 mass %, provided that the C log P value is a coefficient showing affinity of an organic compound with respect to water and 1-octanol.

Composition for forming adhesive film for imprinting, adhesive film, laminate, method for producing cured product pattern, and method for manufacturing circuit substrate

A curable composition for imprinting satisfies the following A to C: A: the curable composition includes a polyfunctional polymerizable compound having a polymerizable group equivalent of 150 or higher; B: the curable composition includes a photopolymerization initiator; and C: the curable composition satisfies at least one of a condition that the content of an ultraviolet absorber in which the light absorption coefficient at a maximum emission wavelength of an irradiation light source is 1/2 or higher of the light absorption coefficient of the photopolymerization initiator is 0.5 to 8 mass % with respect to non-volatile components or a condition that the content of a polymerization inhibitor is 0.1 to 5 mass % with respect to the non-volatile components. The non-volatile components refer to components in the curable composition for imprinting other than a solvent.

Curable composition for imprinting, method of manufacturing cured product pattern, method of manufacturing circuit substrate, and cured product

The curable composition for imprinting includes: a compound represented by the following Formula (1); a radically polymerizable compound other than the compound represented by Formula (1); and a photoradical polymerization initiator, in Formula (1), Rand Reach independently represent a hydrogen atom or an organic group having 1 to 8 carbon atoms and may be bonded to each other to form a ring, Rrepresents a monovalent organic group, and Rand Reach independently represent a hydrogen atom or a monovalent organic group. 

Curable composition for imprinting, cured product, pattern forming method, lithography method, pattern, mask for lithography, and polymerizable composition for imprinting

There are provided a composition having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting, includes a compound 1 or a compound group 2; and a solvent, in which the compound 1 and the like is a compound decomposable into two or more compounds in a case where a polarity conversion group is treated, and at least one compound has a molecular weight of 30 to 400, and at least one compound has a molecular weight of 1,000 or more, the compound 1: a compound is a resin having a polymerizable group and a polarity conversion group, in which the resin has the polarity conversion group in at least a main chain or a side chain, the polarity conversion group is bonded to the main chain of the resin via a linking group in a case where the polarity conversion group is provided in the side chain, and the number of atoms constituting a chain of the linking group is 8 or more; and the compound group 2: a compound that has a polymerizable group and does not have a polarity conversion group, and a compound that does not have a polymerizable group and has a polarity conversion group.

Composition, adhesive film, laminate, method for producing cured product pattern, and method for manufacturing circuit substrate

Provided are a method for producing a pattern laminate, the pattern laminate having a first layer having a pattern on an object to be processed and a second layer, which has a small waviness after etching (&#x394;LWR), in which the method includes a step of forming a first layer having a pattern on an object to be processed and a step of forming a second layer on the first layer, and the glass transition temperature of the first layer is 90&#xb0; C. or higher; a method for producing a reversal pattern; and a pattern laminate.

Method for producing pattern laminate, method for producing reversal pattern, and pattern laminate

Provided are a curable composition for imprinting and a cured product, a pattern forming method, and a lithography method in which the curable composition for imprinting is used, the curable composition having excellent resolution ability, filling properties into a mold, and releasability from a mold in a case where a fine pattern having a size of 20 nm or less is prepared. The curable composition for imprinting includes: a monofunctional polymerizable compound; a bifunctional polymerizable compound; and a photopolymerization initiator, in which a content of the monofunctional polymerizable compound is 5 to 30 mass % with respect to a content of all the polymerizable compounds, a content of the bifunctional polymerizable compound is 70 mass % or higher with respect to a content of all the polymerizable compounds, at least one bifunctional polymerizable compound is a bifunctional polymerizable compound in which the number of atoms linking two polymerizable groups to each other is 2 or less, and a content of a bifunctional polymerizable compound that does not include an alicyclic structure and an aromatic ring structure and in which the number of atoms linking two polymerizable groups to each other is 3 or more is 30 mass % or lower with respect to the content of all the polymerizable compounds.

Curable composition for imprinting, cured product, pattern forming method, and lithography method

A curable composition for optical imprinting which is excellent in ink jet adequacy and releasability, a pattern forming method, a fine pattern, and a method for manufacturing a semiconductor device are provided. The curable composition for optical imprinting contains a polymerizable compound (A), a photopolymerization initiator (B), and a compound (C) expressed by General Formula (I); in General Formula (I), A represents a dihydric to hexahydric polyhydric alcohol residue. p represents 0 to 2, l q represents 1 to 6, p+q represents an integer of 2 to 6, each of m and n independently represents 0 to 20. r expressed by Formula (1) is 6 to 20. Each R independently represents an alkyl group having 1 to 10 carbon atoms, an aryl group, or an acyl group. 

Curable composition for optical imprinting and pattern forming method

Provided are a method of manufacturing a porous body capable of easily manufacturing a porous body, a porous body, a method of manufacturing a device, a device, a method of manufacturing a wiring structure, and a wiring structure. A photocurable composition including a condensing gas and a polymerizable compound is applied to a substrate or a mold, the photocurable composition is sandwiched between the substrate and the mold and then the photocurable composition is irradiated with light to cure the photocurable composition, and the mold is released from a surface of the cured photocurable composition.

Method of manufacturing porous body, porous body, method of manufacturing device, device, method of manufacturing wiring structure, and wiring structure

Provided are a photocurable composition for imprints, having good releasability and temporal stability of the releasability, a pattern forming method, and a method for manufacturing a device. This photocurable composition for imprints includes a monofunctional chained aliphatic (meth)acrylate (A1) not containing a fluorine atom, a bifunctional or higher polyfunctional (meth)acrylate (A2) not containing a fluorine atom, a monofunctional (meth)acrylate (B) containing a fluorine atom, a photopolymerization initiator (C), and a non-polymerizable compound (D) having a polyoxyalkylene structure in a proportion of 1% to 5% by mass, in which the monofunctional chained aliphatic (meth)acrylate (A1) not containing a fluorine atom has a boiling point of 100&#xb0; C. to 200&#xb0; C. at a pressure of 0.67 kPa, and the monofunctional (meth)acrylate (B) containing a fluorine atom has a boiling point of 100&#xb0; C. to 200&#xb0; C. at a pressure of 0.67 kPa.

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Haibara-gun, Japan

Yuichiro Goto