Fujifilm Corporation

Yuichiro Enomoto

Shinji Tarutani

Sou Kamimura

Keita Kato

Kaoru Iwato

Kana Fujii

Hirotaka Kitagawa

Kunihiko Kodama

Shohei Kataoka

Kazuyoshi Mizutani

Toru Tsuchihashi

Akiko Hattori

Akinori Shibuya

Shuhei Yamaguchi

Yuichiro Goto

Tadashi Oomatsu

Takayuki Ito

Kazuto Shimada

Kenichi Kodama

Tadashi Omatsu

Kazuomi Inoue

Shoichi Saitoh

Kazuyuki Usuki

There are provided a method of manufacturing a cured film, including a first exposure step of exposing a part of a photocurable film formed from a photocurable resin composition, a development step of developing the photocurable film after the exposure with a developing solution to obtain a pattern, and a second exposure step of exposing the pattern with light including light having a wavelength different from a wavelength of light used in the first exposure step, where the photocurable resin composition has a specific constitution, a photocurable resin composition that is used in the method of manufacturing the cured film, a method of manufacturing a laminate including the method of manufacturing a cured film, and a method of manufacturing an electronic device, which includes the method of manufacturing the cured film.

Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device

Provided is a composition for forming underlying layer for imprints, which is excellent in surface flatness and adhesiveness. The composition for forming underlying layer for imprints comprises (A) a resin having an ethylenic unsaturated group (P), and a cyclic ether group (T) selected from oxiranyl group and oxetanyl group, and having a weight-average molecular weight of 1000 or larger; and, (B) a solvent.

Under layer film-forming composition for imprints and method for forming pattern

A pattern forming, method, includes: (i) forming a film from an actinic ray-sensitive or radiation-sensitive resin composition that contains (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation and decomposing by an action of an acid to decrease a solubility of the compound (A) for an organic solvent; (ii) exposing the film; and (iii) performing development by using a developer containing an organic solvent.

Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition and resist film

Provided is a curable composition for photo imprints excellent in the mold releasability and the ink jettability. The curable composition for photo imprints, comprising: a polymerizable compound (A); a photo-polymerization initiator (B); and a mold releasing agent (C), the mold releasing agent (C) being represented by the formula (I) below. Rf represents a Cfluorine-containing alkyl group having two or more fluorine atoms; m represents 1 or 2; L represents a single bond or divalent linking group; n represents 1 or 2; X represents a single bond, oxygen atom, sulfur atom, or nitrogen atom; Rrepresents a Csubstituent being free from a polymerizable group; Rrepresents a hydrogen atom, Csubstituent, or divalent linking group; p represents 1 or 2, q represents 0 or 1, and r represents 1 or 2; Rand Rmay combine with each other to form a ring. 

Curable composition for photo imprints, method for forming pattern, fine pattern, and method for manufacturing semiconductor device

Provided is a method of forming a pattern, ensuring excellent sensitivity, limiting resolving power, roughness characteristic, exposure latitude (EL), dependence on post-exposure bake (PEB) temperature and focus latitude (depth of focus DOF), and a resist composition for use in the method. The method comprises (A) forming a film from a resist composition comprising a resin containing a repeating unit containing a group that is decomposed when acted on by an acid to thereby produce an alcoholic hydroxyl group, which resin thus when acted on by an acid decreases its solubility in a developer containing an organic solvent, (B) exposing the film to light, and (C) developing the exposed film using a developer containing an organic solvent.

Pattern forming method and resist composition

Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing an organic solvent, wherein the developer contains an alcohol compound (X) at a content of 0 to less than 500 ppm based on the total mass of the developer.

Method of forming pattern and developer for use in the method

Disclosed is a to provide a curable composition for imprints capable of keeping a good patternability and of producing less defects even after repetitive pattern transfer. The curable composition for imprints comprising: a polymerizable compound (A);

Curable composition for imprints, patterning method and pattern

The present invention provides a discharge method which makes it possible to appropriately perform discharge even when a head for discharging microdroplets having a size of equal to or less than 6 pL that is necessary for controlling a residual film (forming a thin film and achieving uniformity) is used, and makes it possible to obtain an excellent pattern having excellent release properties. The discharge method is an inkjet discharge method including discharging a photocurable composition in the form of liquid droplets having a size of equal to or less than 6 pL, in which the composition satisfies the following (a) to (c), (a) containing a fluorine-containing material in a proportion of equal to or less than 4% by mass of the composition; (b) having a surface tension of 25 mN/m to 35 mN/m; and (c) containing a solvent having a boiling point of equal to or less than 200&#xb0; C. in an amount of 5% by mass of the composition.

Inkjet discharge method, pattern formation method, and pattern

An under layer film having excellent surface planarity is provided. In one aspect, the under layer film-forming composition for imprints includes a (meth)acrylic resin (A) containing an ethylenic unsaturated group (P) and a nonionic hydrophilic group (Q), and having a weight average molecular weight of 1,000 or larger; and a solvent (B), the resin (A) having an acid value of smaller than 1.0 mmol/g. In another aspect, the under layer film-forming composition for imprints includes a (meth)acrylic resin (A2) containing an ethylenic unsaturated group (P), and containing, as a nonionic hydrophilic group (Q), a cyclic substituent (Q2) having a carbonyl group in the cyclic structure thereof, with a weight average molecular weight of 1,000 or larger; and a solvent (B).

Under layer film-forming composition for imprints and method of forming pattern

Provided is an actinic-ray- or radiation-sensitive resin composition and a method of forming a pattern using the same, ensuring excellent the etching resistivity and the stability during a post-exposure delay (PED) period. The composition contains a resin containing a repeating unit containing a group that is decomposed when acted on by an acid to thereby produce an alcoholic hydroxyl group, and a compound that generates an acid of pKa&#x2267;&#x2212;1.5 when exposed to actinic rays or radiation.

Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the same

Provide is a curable composition for imprints, capable of effectively suppressing chipping of the cured pattern. A curable composition for imprints comprising (A) curable compound and (B) photo-polymerization initiator, having a moisture content ratio, relative to the total weight of all components excluding solvent, of less than 0.8% by weight.

Curable composition for imprints and method of storing the same

Provided is a method of forming a pattern, ensuring excellent exposure latitude (EL) and focus latitude (depth of focus DOF). The method of forming a pattern includes (A) forming a film from a resist composition, the resist composition, (B) exposing the film to light, and (C) developing the exposed film using a developer containing an organic solvent, thereby forming a negative pattern. The resist composition contains (a) a resin that is configured to decompose when acted on by an acid and &#x394;SP thereof represented by formula (1) below is 2.5 (MPa)or above, (b) a compound that is composed to generate an acid when exposed to actinic rays or radiation, and (c) a solvent.&#x394;SP=SP&#x2212;SP&#x2003;&#x2003;(1)

Provided is the pattern formability and line edge roughness of the resultant substrate. An underlay film composition for imprints comprising a compound (A) and a solvent (B), the compound (A) having at least either one of a group (Ka) capable of covalently bonding and/or interacting with a substrate, and, a group (Kb) capable of covalently bonding and/or interacting with a curable composition for imprints, an Ohnishi parameter (Z) calculated from (equation 1) of 3.8 or larger, and a molecular weight of 400 or larger:the Ohnishi parameter=(total number of atoms)/(number of carbon atoms&#x2212;number of oxygen atoms).&#x2003;&#x2003;(Equation 1)

Underlay film composition for imprints and method of forming pattern and pattern formation method using the same

Provided is an adhesion-promoting composition between a curable composition for imprints and a substrate, which excellent in adhesiveness and can control pattern failure. An adhesion-promoting composition used between a curable composition for imprints and a substrate, which comprises a compound having a molecular weight of 500 or larger and having a reactive group, and has a content of a compound, with a molecular weight of 200 or smaller, of more than 1% by mass and not more than 10% by mass of a total solid content.

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Shizuoka, Japan

Yuichiro Enomoto