Toto Ltd.

Yuichi Yoshii

Hitoshi Sasaki

Kosuke Yamaguchi

Kengo Maehata

Kazuki Anada

Jumpei Uefuji

Shumpei Kondo

Takuma Wada

Tetsuro Itoyama

Kaduko Ishikawa

Junji Yonezawa

An electrostatic chuck includes: a ceramic dielectric substrate; a base plate; and a heater plate. The heater plate includes a first and a second support plates including a metal, a heater element provided between the first and the second support plates, a first resin layer provided between the first support plate and the heater element, and a second resin layer provided between the second support plate and the heater element. A surface of the first support plate on the second support plate side includes a first region and a second region, the first region overlapping the heater element when viewed along the stacking direction, the second region not overlapping the heater element when viewed along the stacking direction. In a cross section parallel to the stacking direction, the second region protrudes toward the second support plate side compared to the first region.

Electrostatic chuck

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing an object to be processed and a second major surface on an opposite side of the first major surface, and a base plate provided on a side of the second major surface and supporting the ceramic dielectric substrate. The base plate includes a first communicating passage passing a medium which adjusts a temperature of the object to be processed. The first communicating passage has an upper surface, a side surface, and a lower surface. A ratio of variation of a maximum height Sz in the upper surface to a height of the first communicating passage is not more than 1%.

An electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater plate. The heater plate is provided between the ceramic dielectric substrate and the base plate. The heater plate includes first and second support plates, first and second resin layers, and a heater element. Each of the first and second resin layers is provided between the first support plate and the second support plate. The heater element includes first and second electrically conductive portions. The first electrically conductive portion is provided between the first resin layer and the second resin layer. The second electrically conductive portion is separated from the first electrically conductive portion in an in-plane direction. The first resin layer contacts the second resin layer between the first electrically conductive portion and the second electrically conductive portion.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate including a sealing ring provided at a peripheral edge portion of the ceramic dielectric substrate, and an electrode layer including a plurality of electrode components. An outer perimeter of the ceramic dielectric substrate is provided to cause a spacing between the outer perimeter of the ceramic dielectric substrate and an outer perimeter of the electrode layer to be uniform. The spacing between the outer perimeter of the electrode layer and the outer perimeter of the ceramic dielectric substrate is narrower than a spacing of the electrode components. A width of the sealing ring is not less than 0.3 millimeters and not more than 3 millimeters. A width where the electrode layer overlaps the sealing ring is not less than &#x2212;0.7 millimeters and not more than 2 millimeters.

Electrostatic chuck and wafer processing apparatus

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater plate. The ceramic dielectric substrate has a surface where a processing object is placed. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the ceramic dielectric substrate and the base plate. The heater plate includes a first support plate including a metal, a second support plate including a metal, a heater element, a first resin layer, and a second resin layer. The heater element is provided between the first support plate and the second support plate. The heater element emits heat due to a current flowing. The first resin layer is provided between the first support plate and the heater element. The second resin layer is provided between the second support plate and the heater element.

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, an electrode layer, a base plate, and a heater plate. The ceramic dielectric substrate has a first major surface where a processing object is placed. The electrode layer is provided in the ceramic dielectric substrate. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the base plate and the first major surface. The heater plate includes a first heater element and a second heater element. The first heater element emits heat due to a current flowing. The second heater element emits heat due to a current flowing. When viewed along a direction perpendicular to the first major surface, bends of the first heater element is more than bends of the second heater element, and the first heater element includes a portion positioned at a gap of the second heater element.

An electrostatic chuck includes a ceramic dielectric substrate having a first major surface on which an object to be processed is mounted, and a second major surface, the ceramic dielectric substrate being a polycrystalline ceramic sintered body, an electrode layer provided on the ceramic dielectric substrate, a base plate provided on a side of the second major surface and supporting the ceramic dielectric substrate, and a heater provided between the electrode layer and the base plate. The base plate includes a through hole piercing the base plate and a communication path passing a medium adjusting a temperature of the object to be processed, and when viewed in a direction perpendicular to the first major surface, at least a part of the heater exists on a side of the through hole as viewed from a first portion of the communication path which is closest to the through hole.

According to an aspect of an embodiment of the invention, there is provided an electrostatic chuck including: a ceramic dielectric substrate including a first major surface for mounting a clamped target, a second major surface on opposite side from the first major surface, and a through hole provided from the second major surface to the first major surface; a metallic base plate supporting the ceramic dielectric substrate and including a gas feed channel communicating with the through hole; and an insulator plug including a ceramic porous body provided in the gas feed channel and a ceramic insulating film provided between the ceramic porous body and the gas feed channel and being denser than the ceramic porous body, the ceramic insulating film biting into the ceramic porous body from a surface of the ceramic porous body.

According to an aspect of an embodiment of the invention, there is provided an AC-driven electrostatic chuck including: a dielectric substrate including protrusions formed on a major surface on a side of mounting a clamped object, and a bottom surface part formed around the protrusions; and an electrode provided on the dielectric substrate, the electrode including a plurality of electrode elements spaced from each other, the plurality of electrode elements being enabled to be applied with an AC voltage of mutually different phases, respectively, and the protrusions being arranged on the major surface with a prescribed spacing depending on shape of the plurality of electrode elements. The AC-driven electrostatic chuck is capable of suppressing local damage to part of the protrusions provided on the mounting surface side.

Growing community of inventors

Kitakyushu, Japan

Yuichi Yoshii