Tokyo Electron Limited

Tatsuno Corporation

Denso It Laboratory, Inc.

Renesas Electronics Corporation

Mitsubishi Hitachi Power Systems, Ltd.

Tokyo Electron Limi Ted

Yuichi Yoshida

Kousuke Yoshihara

Taro Yamamoto

Ryouichirou Naitou

Hiroshi Arima

Yasushi Takiguchi

Koji Takayanagi

Toshinobu Furusho

Hirofumi Takeguchi

Yuzo Ohishi

Takaya Kikai

Shinobu Miyazaki

Arnaud Alain Jean Dauendorffer

Takuo Funaya

Tomohiro Iseki

Kazuhiko Saito

Toshihiko Akiba

Yuichi Terashita

Hideaki Tsuchiya

Takashi Sasa

Kenji Sakata

Toshihiko Sasaki

Mitsuru Ambai

Naoki Shibata

Soichiro Okada

Kentaro Yoshihara

Jun Koizumi

Yukie Minekawa

Yoshiki Noguchi

Naoaki Natori

Noboru Shinotsuka

Mitsuru Anbai

A filling apparatus that does not significantly reduce a required pressure immediately after a start of hydrogen filling, and can reliably fill fuel cell vehicles and the like. The filling apparatus () includes a control unit (), and the control unit () has a function of boosting pressure required from a hydrogen filling apparatus () to a rear facility () until initial pressure measurement is completed. The control unit () may have a function of determining whether or not communication filling is established, and when communication filling is established, setting a pressure higher than an internal pressure of a tank received from a vehicle side by a predetermined pressure (for example, 5 MPa) as a pressure required for the rear facility () at an initial stage of filling.

Filling apparatus

To provide a hydrogen filling system and a hydrogen filling method capable of preventing hydrogen from being filled at high filling rate in the same manner as the communication filling despite a condition that pressure, temperature and so on in the in-vehicle tank are not precisely grasped. The hydrogen filling system () of the present invention includes a control unit (CU, CU, CU) for controlling hydrogen filling, wherein the control unit has a function of judging whether or not there is an abnormality in pressure or temperature data in an in-vehicle tank (IT) at communication filling and a function of stopping the communication filling and converting to non-communication filling when there is an abnormality in the pressure or the temperature data.

Hydrogen filling system and hydrogen filling method

A film forming method for forming a coating film by applying a coating solution onto a substrate having projections and recesses formed on a surface thereof by a predetermined pattern, includes: applying the coating solution onto the surface of the substrate to form a thick film having a depth of projections and recesses on a surface of the film of a predetermined value or less and having a film thickness larger than a target film thickness of the coating film; and removing the surface of the thick film to form the coating film having the target film thickness.

Film forming method, storage medium, and film forming system

There is a need to improve reliability of the semiconductor device. A semiconductor device includes a printed circuit board and a semiconductor chip mounted over the printed circuit board. The semiconductor chip includes a pad, an insulation film including an opening to expose part of the pad, and a pillar electrode formed over the pad exposed from the opening. The printed circuit board includes a terminal and a resist layer including an opening to expose part of the terminal. The pillar electrode of the semiconductor chip and the terminal of the printed circuit board are coupled via a solder layer. Thickness hof the pillar electrode is measured from the upper surface of the insulation film. Thickness hof the solder layer is measured from the upper surface of the resist layer. Thickness his greater than or equal to a half of thickness hand is smaller than or equal to thickness h.

Semiconductor device

In one embodiment, after a new filter unit is installed in a treatment liquid supply apparatus, there is performed, before a solvent-containing treatment liquid is passed through the filter unit, a step of soaking the filter unit with a solvent for pretreatment and then discharging therefrom the solvent. The solubility of a material, constituting a filter part of the filter unit, to the solvent is greater than the solubility of the material to the treatment liquid. This step makes it possible to remove a component, which may elute from the filter part into the treatment liquid to produce foreign matters (particles), before treatment liquid is passed through the filter unit.

Filter unit pretreatment method, treatment liquid supply apparatus, filter unit heating apparatus, and treatment liquid supply passage pretreatment method

Disclosed is a substrate processing apparatus including: a processing chamber that accommodates a substrate; a light source that radiates energy rays for a processing to the substrate in the processing chamber; a rotation driving unit that rotates at least one of the substrate and the light source around an axis intersecting with the substrate in the processing chamber; an opening/closing mechanism that switches between an open state and a closed state; and a controller configured to control the opening/closing mechanism to switch between the open state and the closed state, to increase a light emission amount of the light source in synchronization with the switch of the open state to the closed state by the opening/closing mechanism, and to decrease the light emission amount of the light source in synchronization with the switch of the closed state to the open state by the opening/closing mechanism.

Substrate processing apparatus, substrate processing method, and storage medium

A filtration efficiency, which is similar to the filtration efficiency obtained when a plurality of filters are provided, can be obtained by one filter, and decrease in throughput can be prevented. Based on a control signal from a control unit, a resist liquid L is sucked into a pumpthrough a filter. A part of the resist liquid sucked in the pump is discharged from a discharge nozzle. The remaining resist liquid is returned to a supply conduiton a primary side of the filter. A process is synthesized by adding a replenishment amount equal to the discharge amount to the return amount. The discharge of the synthesized process liquid and the filtration thereof by the filter are performed the number of times corresponding to a rate between the discharge amount and the return amount.

Liquid processing apparatus, liquid processing method, and storage medium for liquid process

In one embodiment, after a new filter unit () is installed in a treatment liquid supply apparatus, there is performed, before a solvent-containing treatment liquid is passed through the filter unit, a step of soaking the filter unit with a solvent for pretreatment and then discharging therefrom the solvent. The solubility of a material, constituting a filter part () of the filter unit, to the solvent is greater than the solubility of the material to the treatment liquid. This step makes it possible to remove a component, which may elute from the filter part into the treatment liquid to produce foreign matters (particles), before treatment liquid is passed through the filter unit.

Disclosed are an apparatus and a method for reducing a processing liquid consumed for removing bubbles from a new filter unit, and shortening a start-up time when the filter unit is attached in a processing liquid supply passage. The method includes: filling the processing liquid into a new filter unit, decompressing inside of the filter unit into a first pressure atmosphere in order to remove bubbles from the filter unit, boosting a pressure of the inside of the filter unit, flowing the processing liquid into the filter unit from a primary side of the filter unit, and supplying the processing liquid flowing from the filter unit to an object to be processed through a nozzle thereby performing a liquid processing and quickly removing the bubbles.

Processing liquid supply method, processing liquid supply apparatus and storage medium

A liquid treatment method includes: supplying a first organic solvent to a substrate with the substrate being held horizontally by a substrate holder; and thereafter supplying a second organic solvent to a substrate held by the substrate holder, the second solvent having a higher cleanliness than the first solvent.

Liquid treatment apparatus and method and non-transitory storage medium

A subcritical pressure high-temperature steam power plant includes a combustion boiler system, steam turbine generator system, and condensate and feedwater system and wherein the conditions of steam generated in the boiler system and supplied to the steam turbine generator system are subcritical pressure and high temperature (turbine inlet temperature of 593&#xb0; C. or more).

Subcritical pressure high-temperature steam power plant and subcritical pressure high-temperature variable pressure operation once-through boiler

A solvent such as PGMEA is coated on a wafer in advance to easily spread resist liquid onto the wafer on a spin chuck. Before coating, the solvent supplied from a solvent supply source is stored in a distill tank first, the solvent is heated by a heating unit to be evaporated, and the evaporated solvent is cooled by a cooler, thereby performing the purification of the solvent by distillation. Therefore, particles among the solvent are removed. The purified solvent is stored in a storage tank first, and then supplied to a solvent nozzle above the spin chuck from a solvent supplying line. And then, the solvent is coated on the wafer by ejecting the solvent from the solvent nozzle to the wafer. Further, the distill tank is cleaned periodically to suppress the increase of the concentration of the particles in the solvent.

Liquid processing apparatus, liquid processing method, and storage medium

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Koshi, Japan

Yuichi Yoshida