Nichia Corporation

Yuichi Yamada

Motokazu Yamada

Takeshi Tamura

Shinsaku Ikuta

Tomonori Ozaki

An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.

LED package and integrated light emitting device

A integrated light-emitting device including: a base including a conductive wiring; a plurality of light-emitting devices mounted on the base and configured to emit a first light, each of the light-emitting devices comprising a light-emitting element and a encapsulant covering the light-emitting element; a light reflective film provided on an upper surface of the light-emitting element; and a plurality of light reflective members disposed between adjacent ones of the light-emitting devices. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5. Each of the light-emitting devices has a batwing light distribution characteristics.

Light-emitting device, integrated light-emitting device, and light-emitting module

A light emitting device includes: a base; a phosphor frame positioned inward of edges of a lower face of the base; a light emitting element disposed in an area surrounded by the phosphor frame; and a light transmissive member contacting at least a portion of the edges of the lower face of the base and at least a portion of outer lateral faces of the phosphor frame.

Light emitting device, method of manufacturing light emitting device, planar light source, and liquid crystal display device

A light emitting device includes: a base; a light emitting element; a light reflective film located on an upper surface of the light emitting element; and a encapsulant. A ratio of a maximum width (W) of the encapsulant with respect to a maximum width of the light emitting element, in a side view, is 2 or more. An outer shape of a part of the encapsulant located within a range of elevation angles that is in a range of 10&#xb0; to 50&#xb0; from a center of a mounting region at an upper surface of the base on which the light emitting element is mounted is formed to have a curved surface. A ratio (r/W) of a radius of curvature (r) of the curved surface with respect to the maximum width (W) of the encapsulant, in a side view, is in a range of 0.25 to 0.50.

Light emitting device and integrated light emitting device

A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A reflecting film provided on the sapphire substrate. A light-transmissive covering member is provided on the support surface. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member. A light reflecting layer is provided on a first region of the base such that a first reflectivity in the first region of the base being higher than a second reflectivity in a second region of the base, the second region overlapping with the light emitting element and being surrounded by the first region as viewed in the height direction.

Light emitting device

A method of manufacturing a light emitting device includes: providing a first member comprising: a base, a plurality of phosphor frames positioned on the base, the plurality of phosphor frames including a first phosphor frame and a second phosphor frame that is adjacent to the first phosphor frame, and a light transmissive member, a portion of which is disposed between the first phosphor frame and the second phosphor frame; disposing a first light emitting element in the first phosphor frame and a second light emitting element in the second phosphor frame, wherein: each light emitting element has an emission face and an electrode forming face located opposite to the emission face, each light emitting element comprises an electrode located on its electrode forming face, and each light emitting element is disposed such that its emission face faces the base; and cutting the light transmissive member.

A light-emitting device includes a base including a conductive wiring; a light-emitting element mounted on the base and configured to emit light; a light reflective film provided on an upper surface of the light-emitting element; and a encapsulant covering the light-emitting element and the light reflective film. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5.

A light emitting device includes a substrate, a light source, a cover member, a light transmissive member disposed on or above the light source, a light reflecting layer disposed on or above the light transmissive member, and a light transmissive cover member. The cover member is made of a resin material containing a light reflecting substance and covers a lateral face of the light source. The light transmissive cover member covers at least a lateral face of the light transmissive member and includes an annular lens part. A thickness of a portion of the light transmissive cover member disposed above a perimeter of the light reflecting layer is larger than a thickness of a portion of the light transmissive cover member disposed above a portion of the light reflecting layer where an optical axis of the light emitting element passes through.

Light emitting device including light transmissive cover member including an annular lens part, and LED package

A light-emitting device includes: a base member that includes conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.

Light-emitting device and integrated light-emitting device

A light emitting device includes: a substrate; a light emitting element disposed on the substrate, the light emitting element having an upper surface and a lateral surface; a reflecting layer located on the upper surface of the light emitting element; a first light-transmissive member having a first surface in contact with the lateral surface of the light emitting element, and a second surface that is inclined toward the substrate in a direction outward from the light emitting element; and a second light-transmissive member in contact with the second surface and covering the light emitting element. A refractive index of the first light-transmissive is smaller than a refractive index of the second light-transmissive member.

A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A light-transmissive covering member is provided on the sapphire substrate to sandwich the sapphire substrate between the semiconductor layer and the reflecting film. A light emitted from the semiconductor layer is configured to be extracted from the sapphire substrate between the semiconductor layer and the reflecting film. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member.

A light emitting device includes at least one LED package, and at least one light transmissive sealing member. Each of the at least one LED package includes a light emitting element, a wavelength converter, and a reflection member. The light emitting element is mounted on a mounting surface of a base and electrically connected to a conductor wiring. The wavelength converter is provided on an upper surface of the light emitting element. The reflection member covers a side surface and a lower surface of the light emitting element. Each of the at least one light transmissive sealing member includes a light diffusion material and covers each of the at least one LED package. Each of the at least one light transmissive sealing member has a projection shape with a substantially circular bottom surface facing the base and with a height in the light axis direction of the light emitting element.

A light-emitting device includes: a base member that comprises conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.

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Anan, Japan

Yuichi Yamada