Kobelco Research Institute, Inc.

Yuichi Taketomi

Moriyoshi Kanamaru

Yuki Tao

Shintaro Yoshida

Provided is a sintered body comprising LiCoOused for a sputtering target. The area A of a surface of the sintered body that corresponds to a sputtering surface is 200-1500 cmand the relative density of the entire sintered body is 75% or higher. When B1 represents the area of a region in which the area ratio that is occupied by pores is 10% or higher in the surface that corresponds to a sputtering surface, the ratio of B1 to the area A is 50% or higher, and the area B2 of a region having a specific resistance of 1.0&#xd7;10&#x3a9;-cm or smaller in the surface that corresponds to a sputtering surface occupies 25% or more of the area A.

Sintered body comprising LiCoO2, sputtering target, and production method for sintered body comprising LiCoO2

Provided is a Li-containing phosphoric-acid compound sintered body of both high relative density and very small crystal grain diameter with reduced incidence of defects (voids) such as air holes, the Li-containing phosphoric-acid compound sintered body causing a Li-containing phosphoric-acid compound thin film useful as a solid electrolyte for a secondary cell or the like to be stabilized without any incidence of target cracking or irregular electrical discharge, and offering high-speed film-forming capability. This Li-containing phosphoric-acid compound sintered body contains no defects measuring 50 &#x3bc;m or larger within a 1 mmcross-sectional region in the interior thereof, while having an average crystal grain diameter of no more than 15 &#x3bc;m and a relative density of at least 85%.

Li-containing phosphoric-acid compound sintered body and sputtering target, and method for manufacturing said Li-containing phosphoric-acid compound sintered body

Provided is a target assembly which is manufactured by bonding a Li-containing oxide sputtering target and an Al-based or Cu-based backing plate through a bonding material. The Li-containing oxide target assembly does not undergo warping or cracking during the bonding. The Li-containing oxide target assembly according to the present invention is manufactured by bonding a Li-containing oxide sputtering target to a backing plate via a bonding material, and has bending strength of 20 MPa or larger.

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Takasago, Japan

Yuichi Taketomi