Seiko Epson Corporation

Yuichi Takebayashi

Yoshiyuki Yamaguchi

Koji Hosaka

Kunihito Yamanaka

Takuya Owaki

Mikio Shigemori

An electronic component includes: an oscillation circuit that is electrically connected to a resonator element; and a substrate that includes a first surface on which the oscillation circuit and wiring that is electrically connected with the resonator element and the oscillation circuit to form an oscillation loop are disposed, and a second surface opposite to the first surface. The substrate includes a conductor layer between the first surface and the second surface. The conductor layer overlaps the wiring in a plan view. A distance between the wiring and the conductor layer in a thickness direction as a direction along a direction intersecting the first surface and the second surface is from 0.35 mm to 0.7 mm.

Electronic component, oscillator, electronic apparatus, and moving object

A semiconductor integrated circuit includes a semiconductor substrate on which an oscillation circuit that generates an oscillation signal by oscillating a resonation element, and a plurality of output circuits that outputs signals based on the oscillation signal, are integrated. A package contains the semiconductor integrated circuit and the resonation element. In the semiconductor integrated circuit, an operation of a first output circuit and an operation of a second output circuit, among a plurality of output circuits, are controlled independently from each other.

Semiconductor integrated circuit, oscillator, electronic apparatus, and moving object

A package structure realizing a size and/or thickness reduction and suitable for packaging a surface acoustic wave element is provided. The package structure for solving the above challenge includes a base having a thick floor on which to place a surface acoustic wave element and a thin floor on which to place an electronic component, the surface acoustic wave element and the electronic component being mounted close to each other on the plane coordinate system. In addition, in the package structure described above, the difference in height between the thin floor and the thick floor is the same as, or larger than, the thickness of the electronic component mounted on the thin floor.

Surface acoustic wave device with reduced size and thickness

A method of manufacturing a surface acoustic wave device including a surface acoustic wave element and an electronic component on a package, the method including a component mounting step including mounting the electronic component on the package; an element mounting step including mounting the surface acoustic wave element on the package; an annealing step; a wire bonding step including wire bonding at least one of the electronic component and surface wave element to the package, the wire bonding step being performed after the annealing step.

Package structure for surface acoustic wave device, and surface acoustic wave device

A package structure realizing a size and/or thickness reduction and suitable for packaging a surface acoustic wave element is provided. The package structure for solving the above challenge includes a base having a thick flooron which to place a surface acoustic wave elementand a thin flooron which to place an electronic component, the surface acoustic wave element and the electronic component being mounted close to each other on the plane coordinate system. In addition, in the package structure described above, the difference in height between the thin floorand the thick flooris the same as, or larger than, the thickness of the electronic component mounted on the thin floor

Growing community of inventors

Sagamihara, Japan

Yuichi Takebayashi