Taiyo Yuden Co., Ltd.

Copyer Co., Ltd.

Sds Biotech Kabushiki Kaisha

Nec Corporation

Showa Denko Kabushiki Kaisha

Canon Finetech Inc.

Taiyo Yudenco., Ltd.

Yuichi Sugiyama

Masashi Miyazaki

Tatsuro Sawatari

Yutaka Hata

Yoshiki Hamada

Hideki Yokota

Yusuke Inoue

Kazuhiro Watanabe

Hiroyuki Kobayashi

Tetsuo Saji

Yukihiro Nakamura

Takashi Isono

Michitaka Fukuda

Masaki Naganuma

Nobuyuki Nagato

Eiji Mugiya

Akihiro Hoshino

Toshiyuki Kagawa

Kazuaki Ida

Yutaka Takata

Akihiro Takaiwa

Masashi Katakai

Kenichi Komatsubara

Provided is a circuit board including: a metal core layer having a first main surface capable of supporting a mounting component and a second main surface which is opposite to the first main surface; a first exterior coating base material which is arranged facing the first main surface; and a second exterior coating base material which is arranged facing the second main surface and includes a heat dissipation layer having a via which is connected to the second main surface.

Circuit board and circuit module

A circuit board includes a core layer including a plurality of metal layers laminated one over another, a bottommost metal layer of the plurality of metal layers being thickest, and a topmost metal layer of the plurality of metal layer being thinnest; an upper insulating layer and an upper conductive pattern provided over a top surface of the core layer; and a lower insulating layer and a lower conductive pattern provided below a bottom surface of the core layer, wherein the topmost metal layer of the core metal layer is patterned to have a prescribed shaped section that serves as wiring and that is connected to the upper conductive pattern, wherein a metal ratio that is defined as a ratio of an area that is formed of metal relative to an entire area in a plan view is higher in the bottommost metal layer than in the topmost metal layer.

Circuit board

A manufacturing method of a multilayer board includes: forming a metal core layer including a main body, an island portion, and four connection portions, the island portion having a substantially rectangle shape and being located in an opening formed in the main body, the opening having a substantially rectangle shape, the four connection portions connecting side surfaces of four corners of the island portion or side surfaces of vicinities of the four corners of the island portion to a side surface of the main body; forming a first insulating layer on the metal core layer and in the opening; and forming, in the first insulating layer, a hole reaching each of the four connection portions and removing at least a part of each of the four connection portions through the hole to electrically separate the main body and the island portion from each other

Multilayer board and manufacturing method of the same

An intermediate printed board has a plurality of unit regions that are to be cut out and separated to become a plurality of individual printed circuit boards, respectively. The intermediate printed board includes a metal core substrate including: a metal layer; and a plating layer formed on each of a top surface and a bottom surface of the metal layer, the plating layer being absent in each of cutting regions, the cutting regions being regions on the intermediate printed board where the plurality of unit regions are separated so as to produce the plurality of individual printed circuit boards; an insulating layer formed so as to cover a surface of the metal core substrate; and a conductive pattern formed on the insulating layer.

Intermediate printed board for making multiple printed circuit boards and method of manufacturing the same

A circuit board includes a flexible wiring board having a first section in one end and a second section next to the first section in a plan view; a plate-shaped reinforcing member embedded in the flexible wiring board in the first section; and a first multilayer wiring layer on a top surface of the flexible wiring board in the first section, the first multilayer wiring layer having an opening that exposes a portion of a top surface of the reinforcing member for mounting a device thereon.

A printed wiring board for camera module includes: first and second mounting regions for first and second image pickup devices respectively provided on one and the other sides in a front surface of the printed wiring board, the first and second mounting regions respectively provided with first and second conductive patterns configured to be electrically connected to the first and second image pickup devices, respectively, and a component mounting region provided between the first mounting region and the second mounting region, the component mounting region provided with a third conductive pattern, the third conductive pattern configured to be electrically connected to a signal processing component, amounting density of the third conductive pattern in the component mounting region being higher than that of the first conductive pattern in the first mounting region or a mounting density of the second conductive pattern in the second mounting region, in a plan view.

Printed wiring board and camera module

A semiconductor module includes a metal core layer that includes: a first metal layer and a second metal layer on the first metal layer, wherein a portion of the second metal layer is removed to expose a surface of the first metal layer, the removed portion of the second metal layer defining a cavity in the metal core layer having the exposed surface of the first metal layer as a bottom surface, and at least one of a side wall and the bottom surface of the cavity has a smoother surface profile than a surface of the first metal layer that is not exposed by the cavity and under the second metal layer; and a semiconductor element provided in the cavity, affixed to the bottom surface of the cavity with a fixing material containing a resin component.

Semiconductor module

A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape. The first section of the wiring board is positioned closer to one of the wiring layers than to another of the wiring layers in a vertical direction.

A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape and is disposed closer to one of the pair of the wiring layers than to another of the pair of the wiring layers in a vertical direction.

Provided is a module substrate including an inductor that can be made thinner and smaller. A module substrate according to an aspect of the present invention includes a substrate member having a mounting surface on which electronic components are mounted, a magnetic core disposed within the substrate member, and a conductor coil provided in the substrate member and wound around the magnetic core. The module substrate has a configuration in which an inductor is built into the substrate member, which makes it possible to make the overall module substrate smaller and thinner.

Module substrate

A circuit substrate of one aspect of the present invention includes a first substrate body made of a flexible wiring substrate and having a first edge and a second edge opposite to the first edge, the first substrate body having a bottomed or bottomless recess adjacent to the first edge; a plate-shaped or frame-shaped reinforcement member disposed in the recess of the first substrate body adjacent to the first edge; a pair of resin layers sandwiching the reinforcement member in the recess and a portion of the first substrate body adjacent to the reinforcement member including the first edge, each of the resin layers having a circuit portion formed thereon electrically connected to the flexible wiring substrate.

Circuit substrate and method of manufacturing same

An embedded component substrate includes: a core layer; a first electrode provided on a top surface of the core layer with a first insulating layer therebetween; and a second electrode provided on a bottom surface of the core layer with a second insulating layer therebetween, wherein a cavity is formed in the embedded component substrate from a top surface thereof to expose the second insulating layer at a bottom of the cavity, wherein a placement region is defined on the bottom of the cavity, for accommodating an electronic component; and wherein the embedded component substrate further includes a pad electrode on a portion of the second insulating layer, exposed by the cavity, surrounding the placement region located on the bottom of the cavity, the pad electrode vertically protruding from a top surface of the exposed second insulating layer upwardly and being configured to electrically connect to the electronic component.

Embedded component substrate with a metal core layer having an open cavity and pad electrodes at the bottom of the cavity

In one embodiment of the present invention, a multilayer wiring substrate includes: a first wiring substrate having a first core member made of metal with cavities therein; a second wiring substrate having a second core member made of metal; and a bonding layer between the first wiring substrate and the second wiring substrate to bond a top surface of the first wiring substrate to a bottom surface of the second wiring substrate, the bonding layer having a patterned conductive layer.

Multilayer wiring substrate

A composite substrate has a rigid substrate that includes: a core layer, a first laminated layer on a first surface of the core layer, and a second laminated layer on a second surface of the core layer, the rigid substrate having a cutout in the core layer and the second laminated layer on one side face of the rigid substrate; and a flexible substrate inserted into the cutout in the rigid substrate on the one side face and laterally and externally protruding from the one side face of the rigid substrate, wherein the rigid substrate has opposing walls each constituted of the second laminated layer and the core layer erected on the first laminated layer to define inner side faces, respectively, of the cutout so as to accommodate the flexible substrate in a direction perpendicular to a direction in which the side face of the rigid substrate extends.

Composite substrate and rigid substrate

In a camera module, a planar part, which is for mitigating deformation of the surface of a second insulating portion on which an imaging device is mounted, is embedded in the second insulating portion of a substrate so as to face the imaging device mounted on the surface (top surface) of the second insulating portion.

Growing community of inventors

Tokyo, Japan

Yuichi Sugiyama