Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Yuichi Shimayama

Yuusuke Kondou

Etsuo Mizushima

Yoshitaka Hirata

Kazunori Yamamoto

Hideyuki Nagaishi

Yasushi Shimada

Hiroyuki Kuriya

Kazuhisa Otsuka

Masanori Yamaguchi

Ken Madarame

Masayuki Miyazaki

Yukio Nakamura

Hikari Murai

Tomio Fukuda

Nobuhiko Shibagaki

Shinji Tsuchikawa

Takao Tanigawa

Yuki Nagai

Shintaro Hashimoto

Masahiko Oota

Hisayoshi Mizugaki

Takashi Saitou

Tetsuroh Irino

Taketo Nomura

Yuma Yoshida

Keisuke Iijima

Masaya Kirihara

Katsuhiko Nawate

The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.

Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar

The present invention relates to a prepreg including a fiber base material layer containing a fiber base material, a first resin layer formed on one surface of the fiber base material layer, and a second resin layer formed on the other surface of the fiber base material layer, wherein the first resin layer is a layer obtained through layer formation of a resin composition (I) containing, as a main component of resin components, an epoxy resin (A), and the second resin layer is a layer obtained through layer formation of a resin composition (II) containing, as a main component of resin components, an amine compound (B) having at least two primary amino groups in one molecule thereof and a maleimide compound (C) having at least two N-substituted maleimide groups in one molecule thereof; a laminated sheet obtained by using the prepreg; a printed wiring board; a coreless board; a semiconductor package; and a method of producing a coreless board.

Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate

Signals are maintained to be in phase at beam input ports of a Rotman lens antenna, and thus scanning at non-step antenna beam angles can be realized without increasing the number of input beams. The present invention provides an antenna beam scan module including: a Rotman lens that has plural beam ports and plural antenna ports; plural antenna elements; relative phase detectors that detect a relative phase difference between the signals input to the adjacent beam ports; phase shifters that offset the relative phase difference between the signals supplied to the adjacent beam ports on the basis of the relative phase difference detected by the relative phase detectors; and switches that select routes of the signals supplied to the beam ports through variable amplifiers, wherein the phase shifters are arranged on alternate routes through which the signals are supplied to the plural beam ports.

Antenna beam scan module, and communication apparatus using the same

An antenna beam scan unit includes: a Rotman lens that performs power division and synthesis between plural antenna ports and three or more beam ports; plural antenna elements which are connected to the respective antenna ports and to or from which radio waves are inputted or outputted; plural amplifiers that are connected to the respective beam ports of the Rotman lens and perform amplitude modulation on a signal; input paths for a transmission signal disposed in association with the amplifiers; switches for switching the input paths; and a beam control unit. The input paths include first paths and second paths on which a signal that is out of phase with a signal on the first paths is produced. The beam control unit selects two adjoining beam ports, and can switch the first paths and second paths as the input paths for the two beam ports.

Antenna beam scan unit and wireless communication system using antenna beam scan unit

A ground conductor () has a through hole provided through an area thereof for connection with a waveguide (), with dimensions substantially equal to cavity dimensions of the waveguide (), and a metallic spacer () is provided as a holding element for a film substrate (), with an even thickness to a dielectric substrate (), the metallic spacer () having dimensions Eand Eof cavity walls thereof changed in accordance with a desirable frequency, and cooperating with another metallic spacer () having substantially equal dimensions to the metallic spacer (), to sandwich the film substrate () in between, and in addition, an upper ground conductor () is arranged on the other metallic spacer (), and a quadrate resonant patch pattern () is formed at an end of the strip line conductor () formed to the film subs ate (), on an area corresponding to a transducer end of the waveguide (), while a combination of the quadrate resonant patch pattern () and the waveguide () is arranged such that the quadrate resonant patch pattern () has a center position thereof coincident with a center position of the cavity dimensions of the waveguide ().

Triplate line-to-waveguide transducer having spacer dimensions which are larger than waveguide dimensions

A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a wireless electronic device mounting the semiconductor device.

Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device

A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a radio electronic device mounting the semiconductor device.

Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device

Growing community of inventors

Shimotsuke, Japan

Yuichi Shimayama