Canon Kabushiki Kaisha

Kyoto University

National Institute of Advanced Industrial Science and Technology

Yuichi Shimakawa

Makoto Kubota

Masaki Azuma

Hisato Yabuta

Kaoru Miura

Yoshihiko Matsumura

Yoshitaka Nakamura

Kenji Takashima

Takashi Iijima

Bong-Yeon Lee

Kenichi Takeda

Jumpei Hayashi

Mikio Shimada

Masanori Kawai

Provided are a thermal expansion suppressing member having negative thermal expansion properties and a metal-based anti-thermally-expansive member having small thermal expansion. More specifically, provided are a thermal expansion suppressing member, including at least an oxide represented by the following general formula (1), and an anti-thermally-expansive member, including a metal having a positive linear expansion coefficient at 20&#xb0; C., and a solid body including at least an oxide represented by the following general formula (1), the metal and solid being joined to each other: (BiM)NiO(1) where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02&#x2264;x&#x2264;0.15.

Thermal expansion suppressing member and anti-thermally-expansive member

Provided are a piezoelectric thin film having good piezoelectricity in which a rhombohedral structure and a tetragonal structure are mixed, and a piezoelectric element using the piezoelectric thin film. The piezoelectric thin film includes a perovskite type metal oxide, in which the perovskite type metal oxide is a mixed crystal system of at least a rhombohedral structure and a tetragonal structure, and a ratio between an a-axis lattice parameter and a c-axis lattice parameter of the tetragonal structure satisfies 1.15&#x2266;c/a&#x2266;1.30. The piezoelectric element includes on a substrate: the above-mentioned piezoelectric thin film; and a pair of electrodes provided in contact with the piezoelectric thin film.

Piezoelectric thin film, piezoelectric element, and manufacturing method thereof

Provided are a bismuth-based piezoelectric material whose insulation property is improved while its performance as a piezoelectric body is not impaired and a piezoelectric device using the piezoelectric material. The piezoelectric material includes a perovskite-type metal oxide represented by the following general formula (1):Bi(FeCo)O&#x2003;&#x2003;(1)where 0.95&#x2266;x&#x2266;1.25 and 0&#x2266;y&#x2266;0.30, and a root mean square roughness Rq (nm) of a surface of the piezoelectric material satisfies a relationship of 0&#x3c;Rq&#x2266;25y+2 (0&#x2266;y&#x2266;0.30).

Method of producing piezoelectric device using Be, Fe and Co under excess oxygen atmosphere

Provided are resin-based and metal-based anti-thermally-expansive members each having small thermal expansion. More specifically, provided are an anti-thermally-expansive resin and an anti-thermally-expansive metal, each including a resin or a metal having a positive linear expansion coefficient at 20&#xb0; C. and a solid particle dispersed in the resin or metal, in which the solid particle includes at least an oxide represented by the following general formula (1): (BiM)NiO(1), where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02&#x2266;x&#x2266;0.15.

Anti-thermally-expansive resin and anti-thermally-expansive metal

Provided are a thermal expansion suppressing member having negative thermal expansion properties and a metal-based anti-thermally-expansive member having small thermal expansion. More specifically, provided are a thermal expansion suppressing member, including at least an oxide represented by the following general formula (1), and an anti-thermally-expansive member, including a metal having a positive linear expansion coefficient at 20&#xb0; C., and a solid body including at least an oxide represented by the following general formula (1), the metal and solid being joined to each other: (BiM)NiO(1) where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02&#x2266;x&#x2266;0.15.

Provided are resin-based and metal-based anti-thermally-expansive members each having small thermal expansion. More specifically, provided are an anti-thermally-expansive resin and an anti-thermally-expansive metal, each including a resin or a metal having a positive linear expansion coefficient at 20&#xb0; C. and a solid particle dispersed in the resin or metal, in which the solid particle includes at least an oxide represented by the following general formula (1):(BiM)NiO&#x2003;&#x2003;(1),where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02&#x2266;x&#x2266;0.15.

Provided are a bismuth-based piezoelectric material whose insulation property is improved while its performance as a piezoelectric body is not impaired, and a piezoelectric device using the piezoelectric material. The piezoelectric material includes a perovskite-type metal oxide represented by the following general formula (1):Bi(FeCo)O&#x2003;&#x2003;(1)where 0.95&#x2266;x&#x2266;1.25 and 0&#x2266;y&#x2266;0.30, and a root mean square roughness Rq (nm) of a surface of the piezoelectric material satisfies a relationship of 0&#x3c;Rq&#x2266;25y+2 (0&#x2266;y&#x2266;0.30).

Growing community of inventors

Uji, Japan

Yuichi Shimakawa