Nikon Corporation

Nikon Corooration

Yuichi Shibazaki

Yuho Kanaya

Tomoharu Fujiwara

Kazuya Ono

Masayuki Shiraishi

Yoshio Kawabe

Yosuke Tatsuzaki

Shigeki Egami

Shigeru Hirukawa

Hideki Komatsuda

Alton Hugh Phillips

Go Ichinose

Makoto Shibuta

Kazuhiro Hirano

Hiromitsu Yoshimoto

Takeyuki Mizutani

Akira Okutomi

A processing apparatus has: a light irradiation apparatus that irradiates a surface of an object with a processing light; a first position change apparatus that changes a position of at least one of the object and an irradiation area that is formed on the surface of the object by the light irradiation apparatus; and a control apparatus that controls the first position change apparatus to form a structure for reducing a frictional resistance of the surface of the object to a fluid by irradiating the surface of the object with the processing light while changing the position of at least one of the irradiation area and the object to change a thickness of a part of the object.

Processing apparatus, and manufacturing method of movable body

A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.

Processing apparatus and processing method for removal processing with a light beam and having a workpiece position measurement system

A processing apparatus has: a light irradiation apparatus that irradiates a surface of an object with a plurality of processing lights; and a first change apparatus that changes an intensity distribution of the plurality of processing lights from the light irradiation apparatus on the surface of the object, the processing apparatus changes a thickness of a part of the object by irradiating the surface of the object with the plurality of processing lights.

A processing apparatus has: a light irradiation apparatus that irradiates a surface of an object with a processing light; and a measurement apparatus that measures a position of an irradiation area, which is formed on the surface of the object by the light irradiation apparatus, relative to the object.

A measurement device has: a slider which holds a substrate and is movable parallel to the XY plane; a drive system that drives the slider; a position measurement system which emits beams from a head section to a measurement surface in which grating section are provided on the slider, which receives respective return beams of the beams from the measurement surface, and which is capable of measuring position information in at least directions of three degrees of freedom including the absolute position coordinates of the slider; a mark detection system that detects a mark on the substrate; and a controller which detects the marks on the substrate using the mark detection system while controlling the drive of the slider, and which obtains the absolute position coordinates of each mark based on the detection result of each mark and measurement information by the position measurement system at the time of detection.

Measurement device, lithography system and exposure apparatus, and control method, overlay measurement method and device manufacturing method

A lithography system is provided with: a measurement device measuring position information of marks on a substrate held in a first stage; and an exposure apparatus on a second stage, the substrate for which the position information measurement for the marks has been completed, performs alignment measurement to measure position information for part of marks selected from among the marks on the substrate, and performs exposure. The measurement device measures position information of marks on the substrate to obtain higher-degree components of correction amounts of an arrangement of divided areas, and the exposure apparatus measures position information of a small number of marks on the substrate to obtain lower-degree components of the correction amounts of the arrangement of the divided areas and exposes the plurality of divided areas while controlling the position of the substrate by using the obtained lower-degree components and the higher-degree components obtained by the measurement device.

Substrate processing system and substrate processing method, and device manufacturing method

The processing system is provided with: a liquid supply device which can supply a liquid; a liquid processing device which processes a liquid supplied from the liquid supply device such that a non-liquid-immersion state is generated locally in a partial area including a target portion on a predetermined surface; a beam irradiation section which emits beams toward the target portion; and a moving apparatus which moves the predetermined surface. The beams are irradiated on the target portion to apply a predetermined processing to the target portion, in a state in which the target portion is in the non-liquid-immersion state.

Processing method and processing system

A shaping apparatus is equipped with: a beam shaping system having a beam irradiation section that includes a condensing optical system which emits a beam and a material processing section which supplies a shaping material irradiated by the beam from the beam irradiation section; and a controller which, on the basis of 3D data of a three-dimensional shaped object to be formed on a target surface, controls a workpiece movement system and the beam shaping system such that a target portion on the target surface is shaped by supplying the shaping material from the material processing section while moving the beam from the beam irradiation section and the target surface on a workpiece (or a table) relative to each other. Further the intensity distribution of the beam in the shaping plane facing the emitting surface of the condensing optical system can be modified.

Shaping apparatus and shaping method

This shaping apparatus is equipped with: a movement system which moves a target surface; a measurement system for acquiring position information of the target surface in a state movable by the movement system, a beam shaping system that has a beam irradiation section and a material processing section which supplies a shaping material irradiated by a beam from beam irradiation section; and a controller. On the basis of 3D data of a three-dimensional shaped object to be formed on a target surface and position information of the target surface acquired using the measurement system, the controller controls the movement system and the beam shaping system such that a target portion on the target surface is shaped by supplying the shaping material while moving the target surface and the beam from beam irradiation section relative to each other.

In corner sections of first to fourth quadrants whose origin point is a center of an upper surface of a stage, three each of two-dimensional heads are provided. The three each of two-dimensional heads include one first head and two second heads. The stage is driven, while measuring a position of the stage using three first heads that face a two-dimensional grating of a scale plate provided above the stage from the four first heads, and during the driving, difference data of measurement values of the two second heads with respect to the first head in a measurement direction are taken in for head groups to which the three first heads belong, respectively, and using the difference data, grid errors are calibrated.

Exposure apparatus and exposure method, and device manufacturing method

A determination apparatus has a calculation section, where first and second direction pitches intersecting within a predetermined plane of a plurality of detection areas are Dand D, respectively, sizes in the first and second directions of each of a plurality of divided areas arranged two-dimensionally along the first and second directions on a substrate are Wand W, respectively, and first and second direction pitches of a plurality of marks arranged on the substrate are pand p, respectively, calculates pitch pand pitch pof the plurality of marks that satisfy formulas (a) and (b) below, based on pitch D, pitch D, size W, and size W.(denotes a natural number)=(denotes a natural number)&#x2003;&#x2003;(a)(denotes a natural number)=(denotes a natural number)&#x2003;&#x2003;(b)

Determination method and apparatus, program, information recording medium, exposure apparatus, layout information providing method, layout method, mark detection method, exposure method, and device manufacturing method

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Kumagaya, Japan

Yuichi Shibazaki