Hitachi, Ltd.

Hitachi Displays, Ltd.

Hitachi Chemical Company, Ltd.

Panasonic Liquid Crystal Display Co., Ltd.

Hitachi Industrial Equipment Systems Co., Ltd.

Yuichi Sawai

Takashi Naito

Takuya Aoyagi

Tadashi Fujieda

Motomune Kodama

Masanori Miyagi

Hajime Murakami

Takashi Namekawa

Mitsuo Hayashibara

Osamu Shiono

Shigemi Hirasawa

Takashi Naitou

Hiroyuki Akata

Hiroki Yamamoto

Masahiko Ogino

Shinichi Tachizono

Yuji Hashiba

Kei Yoshimura

Takeshi Tsukamoto

Mitsutoshi Honda

Hideto Momose

Akira Hatori

Shunichi Asakura

Hiroshi Yoshida

Sukekazu Aratani

Yoshiyuki Kaneko

Akihiro Miyauchi

Nobuhiko Hosotani

Hiroshi Ito

Tomoji Oishi

Motoyuki Miyata

Keiichi Kanazawa

Yuichi Kijima

Mutsuhiro Mori

Hiroshi Sasaki

Haruo Akahoshi

Masakazu Sagawa

Toshiaki Kusunoki

Takao Ishikawa

Tetsu Ohishi

Yuuichi Kijima

Kenichi Souma

Yoshie Kodera

Katsuo Wada

Yoshiyuki Yasutomi

Norihisa Iwasaki

Hideki Tamaki

Naoshi Takahashi

Kensuke Matsui

The present invention aims at providing a lead-free glass composition that can be soften and flowed at a firing temperature that is equal to or lower than that of conventional low melting point lead glass. Furthermore, the present invention aims at providing a lead-free glass composition having fine thermal stability and fine chemical stability in addition to that property. The lead-free glass composition according to the present invention is characterized by comprising at least AgO, VOand TeOwhen the components are represented by oxides, wherein the total content ratio of AgO, VOand TeOis 75 mass % or more. Preferably, the lead-free glass composition comprises 10 to 60 mass % of AgO, 5 to 65 mass % of VO, and 15 to 50 mass % of TeO.

Glass composition, glass frit containing same, glass paste containing same, and electrical/electronic component obtained using same

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.VO+TeO+FeO+PO&#x2265;90 (mass %)&#x2003;&#x2003;(1)VO&#x3e;TeO&#x3e;FeO&#x3e;PO(mass %)&#x2003;&#x2003;(2)

Electronic component, method for producing same, and sealing material paste used in same

The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.

Bonded structure and production method therefor

Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber. The composite material has a function that the oxide glass is softened and fluidized by electromagnetic waves.

Composite material

An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of AgO in terms of oxides and the glass transition point is 180&#xb0; C. or less.

Solder, aluminum wire body and motor using the same

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.VO+TeO+FeO+PO&#x2267;90(mass %)&#x2003;&#x2003;(1)VO&#x3e;TeO&#x3e;FeO&#x3e;PO(mass %)&#x2003;&#x2003;(2)

Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber, and the oxide glass is softened and fluidized by heating at or lower than a heat decomposition temperature of the resin or the rubber.

In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5&#xd7;10/&#xb0; C. or less in a temperature range from 30 to 250&#xb0; C. This invention makes it possible to heat the filler particles by irradiation with a laser to give the electronic component which is a component having a highly reliable bonding portion.

Electronic component, process for producing same, sealing material paste, and filler particles

Disclosed is a jointed body wherein multiple base members are jointed to each other through a jointing layer, and at least one of the base members is a base member of a ceramic material, semiconductor or glass. The joint material layer contains a metal and an oxide. The oxide contains V and Te, and is present between the metal and the base members. Disclosed is also a joint material in the form of a paste containing an oxide glass containing V and Te, metal particles, and a solvent; in the form of a foil piece or plate in which particles of an oxide glass containing V and Te are embedded; or in the form of a foil piece or plate containing a layer of an oxide glass containing V and Te, and a layer of a metal.

Joint material, and jointed body

A metal matrix composite having high corrosion resistance even if the coating film deposit amount is low is obtained. A metal matrix composite includes a metal or alloy substrate coated with a molten transition metal oxide glass, wherein the transition metal oxide glass has an n-type polarity. Further, a method for producing a metal matrix composite includes a step of applying a paste containing a transition metal oxide glass, an organic binder, and an organic solvent onto the surface of a metal or alloy substrate, and a step of forming a glass coating film on the substrate by heating to and maintaining a temperature equal to or higher than the softening point of the transition metal oxide glass after the application step, wherein the transition metal oxide glass has an n-type polarity.

Metal matrix composite and method for producing the same

The purpose of the present invention is to prevent the discoloration of an ink even when the ink is printed on a base to be printed and then exposed to a high-temperature environment. An ink including a glass composite, resin and a conducting agent, wherein the glass composite includes AgO in the range of 10 mass % to 60 mass %, VOin the range of 5 mass % to 65 mass %, and TeOin the range of 15 mass % to 50 mass %, and the total content ratio of the AgO, VO, and TeOis at least 75 mass %.

Ink, base to be printed, printing device, printing method, and method for producing base to be printed

Bondability and heat conductivity of a bonded body in which some of metal, ceramic, or semiconductor are bonded to each other are improved. In the bonded body in which a first member and a second member each comprise one of metal, ceramic, or semiconductor are bonded to each other, the second member is bonded to the first member by way of an adhesive member disposed to the surface of the first member, and the adhesive member contains a VO-containing glass and metal particles. In a semiconductor module having a base metal, a ceramic substrate, a metal wiring, and a semiconductor chip, the ceramic substrate is bonded to the base metal by way of a first adhesive member disposed to the surface of the base metal, the metal wiring is bonded to the ceramic substrate by way of a second adhesive member disposed to the surface of the ceramic substrate, the semiconductor chip is bonded to the metal wiring by way of a third adhesive member disposed to the surface of the metal wiring, and the first adhesive member, the second adhesive member, and the third adhesive member each comprise a VO-containing glass and metal particles.

Bonded body and semiconductor module

A glass bonding material contains vanadium and phosphor as main glass components, and comprises in amounts converted as oxides of the elements in the components, 45 to 60% by weight of VO, 15 to 30% by weight of PO, 5 to 25% by weight of BaO, or contains a glass comprising at least vanadium, phosphor, barium and antimony, wherein the glass comprises in amounts converted as oxides, 15 to 35% by weight of BaO and SbOin total, and a weight ratio of BaO/SbOor SbO/BaO is 0.3 or less.

Display apparatus

A sealing glass of a low melting point phosphate glass composition contains 15 to 35% of BaO and SbO(in total) and the ratio by weight of BaO to SbOor SbOto BaO is 0.3 or less. Particularly the transition metal is vanadium and the glass contains VOof 45 to 60 wt % as vanadium oxide and POof 15 to 30 wt % as phosphorus oxide. The bonding material is a mixture of a filler and a vanadate-phosphate glass that contains VOof 45 to 60%, POof 20 to 30%, BaO of 5 to 15%, TeOof 0 to 10%, SbOof 5 to 10%, and WOof 0 to 5%. The particle size of the filler is in the range of 1 to 150 &#x3bc;m and the ratio of filler is 80% by volume or less of the adhesive glass.

A bonding glass containing VO: 25 to 50 wt %, TeO: 20 to 40 wt % and BaO: 5 to 30 wt %, and not containing lead.

Display device and production method thereof

Growing community of inventors

Tokyo, Japan

Yuichi Sawai