Kabushiki Kaisha Toshiba

Yuichi Sano

Takashi Imoto

Katsuhiro Ishida

Naoto Takebe

Yasushi Kumagai

Tomomi Honda

According to one embodiment, a semiconductor device includes a first semiconductor element, a first electrode, a ball part, a second electrode, and a wire. The first electrode is electrically connected to the first semiconductor element. The ball part is provided on the first electrode. The wire connects the ball part and the second electrode. A thickness of a turned-back portion at an end of the wire on a side opposite to the second electrode is smaller than a diameter of the wire.

Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device

A cathode ray tube apparatus comprises the deflection yoke including a horizontal deflecting coil for deflecting the electron beams in a horizontal direction. The horizontal deflecting coil has a main coil portion located along the direction of a tube axis, a flange portion located on the phosphor-screen side of the main coil portion, and a bendless flange portion located on the neck side of the main coil portion. The maximum coil thickness of the neck-side flange portion is greater than the maximum coil thickness of the main coil portion near the neck-side flange portion.

Growing community of inventors

Mie-ken, Japan

Yuichi Sano