Daicel Corporation

Yamaguchi University

Daicel Chemical Industries, Ltd.

Yuichi Sakanishi

Takashi Saeki

Mami Itoh

Yusuke Narusaka

Aya Kaide

Sunao Mihara

Narumi Muraoka

Provided is a polishing composition for semiconductor wiring providing an excellent polishing rate and preventing occurrence of dishing. The polishing composition for semiconductor wiring according to the present invention contains a compound represented by Formula (1) below:RO—(CHO)—H  (1) where Rrepresents a hydrogen atom, a hydrocarbon group that has from 1 to 24 carbon atoms and may include a hydroxyl group, or a group represented by RCO, where the Rrepresents a hydrocarbon group having from 1 to 24 carbon atoms; and n represents an average degree of polymerization of glycerol units shown in the parentheses and is from 2 to 60.

Polishing composition for semiconductor wiring

Provided is a hydrophilization treatment liquid for a semiconductor wafer surface, the hydrophilization treatment liquid being capable of imparting hydrophilicity to the semiconductor wafer surface. A hydrophilization treatment liquid for a semiconductor wafer surface, the hydrophilization treatment liquid comprising water and a compound represented by Formula (1) below, and a total content of the water and the compound represented by Formula (1) below being 95 wt. % or greater.RO—(CHO)—H  (1)

Hydrophilization treatment liquid for semiconductor wafer surface

Provided is a substrate hydrophilizing agent that improves the wettability of a substrate surface with respect to a photoresist. A substrate hydrophilizing agent of the present invention is an agent for hydrophilizing a surface of a substrate on which a pattern is formed through photolithography, and contains at least the following Component (A) and Component (B). Component (A): a water-soluble oligomer having a weight average molecular weight from 100 to less than 10000. Component (B): water. The water-soluble oligomer of Component (A) is preferably a compound represented by the following Formula (a-1):RO&#x2014;(CHO)&#x2014;H&#x2003;&#x2003;(a-1)(where Rrepresents a hydrogen atom, a hydrocarbon group which may have a hydroxyl group, or an acyl group; and n is an integer from 2 to 60.)

Substrate hydrophilizing agent

Provided is a surface protectant that suppresses corrosion of a semiconductor wafer surface by a basic compound, and reduces defects in the semiconductor wafer. The semiconductor wafer surface protectant of the present invention includes a compound represented by Formula (1) below;RO&#x2014;(CHO)&#x2014;H&#x2003;&#x2003;(1)

Surface protectant for semiconductor wafer

To provide a cleaning agent that can remove impurities such as metal polishing dust adhering to a semiconductor substrate without corroding metal and can prevent re-adhesion of the impurities. The semiconductor substrate cleaning agent of the present invention contains at least the following component (A) and component (B): Component (A): a water-soluble oligomer having a weight average molecular weight of not less than 100 and less than 10000; and Component (B): water. It is preferable that the water-soluble oligomer is at least one compound selected from compounds represented by the following formulas (a-1) to (a-3).RO&#x2014;(CHO)&#x2014;H&#x2003;&#x2003;(a-1)RO&#x2014;(RO)&#x2014;H&#x2003;&#x2003;(a-2)(R)&#x2014;N&#x2014;[(RO)&#x2014;H]&#x2003;&#x2003;(a-3)

Semiconductor substrate cleaning agent

Provided is a thickening/stabilizing agent that thickens, gelatinizes, and/or stabilizes a fluid organic substance to a desired viscosity. The thickening/stabilizing agent according to the present invention contains a compound (1) represented by Formula (i) and a compound (2) represented by Formula (ii), in a mole ratio of the compound (1) to the compound (2) of 95:5 to 25:75. The four Rs in Formula (i) represent, identically in each occurrence, a C-Caliphatic hydrocarbon group; and the four Rs in Formula (ii) represent, identically in each occurrence, an C-Caliphatic hydrocarbon group. Formulae (i) and (ii) are expressed as follows: 

Thickening stabilizer

A transparent cosmetic composition that provides an excellent feeling in use and excellent dissolution stability of ceramide is provided. The cosmetic composition of the present invention comprises (a) a ceramide, (b) a surfactant, and (c) water, wherein the cosmetic composition comprises (a) in an amount of 0.00001 to 5.0% by weight based on the total weight of the cosmetic composition, a polyglycerin aliphatic ether as (b) in an amount of 0.1 to 5.0% by weight based on the total weight of the cosmetic composition, and (c) in an amount of 50.0% by weight or more based on the total weight of the cosmetic composition. It is preferable that the polyglycerin aliphatic ether comprise a polyglycerin monoaliphatic ether in an amount of 75% by weight or more based on the total weight of the polyglycerin aliphatic ether and a polyglycerin dialiphatic ether in an amount of 5% by weight or less based on the total weight of the polyglycerin aliphatic ether.

Cosmetic composition

Problem to be Solved To provide a composition that can efficiently remove a photoresist adhering to an edge portion and a back surface of a substrate, in a process of producing a mask which is used when the substrate is subjected to etching treatment to have an element, a circuit etc., formed thereon using the photoresist. Solution The composition for removing a resist of the present invention is a composition comprising a surfactant and a solvent, wherein the composition contains, as the surfactant, at least the following component (A). Component (A): a polyglycerol derivative represented by the following formula (a):RO&#x2014;(CHOR)&#x2014;R&#x2003;&#x2003;(a)wherein n represents the number of the repeating units, and is an integer of 2 to 60; and Ridentically or differently represents a hydrogen atom, a Chydrocarbon group or a Cacyl group, provided that at least two of the (n+2) number of Rare Chydrocarbon groups and/or Cacyl groups.

Composition for removing resist

A nonionic surfactant that is environmentally friendly, has excellent surface active power (emulsifying power and solubilizing power), and is capable of stably maintaining the excellent surface active power for a long time is provided. A nonionic surfactant of the present invention contains polyglycerol monoether represented by the formula (1), wherein a ring Z represents a condensed ring of an aromatic hydrocarbon ring having 6 to 14 carbon atoms and a 3 to 6-membered heterocycle containing an oxygen atom as a heteroatom; Ris a substituent bonded to the ring Z and represents an aliphatic hydrocarbon group having 14 to 25 carbon atoms; the ring Z optionally has one or more substituents other than R; and n is an average number of monomers of glycerol and represents 2 to 20. 

Nonionic surfactant

The present invention provides a compound that thickens or gels a fluid organic substance to a desired viscosity, or uniformly stabilizes a composition containing a fluid organic substance. The compound of the present invention is a compound represented by Formula (1) below: wherein, Rrepresents a monovalent aliphatic hydrocarbon group having 4 or more carbons; Rrepresents a divalent aliphatic hydrocarbon group having from 1 to 12 carbons; Rrepresents a monovalent aliphatic hydrocarbon group having from 1 to 12 carbons; m represents an integer from 0 to 10; and n represents an integer from 1 to 4; in a case where n is 1 or 2, (4&#x2212;n) Rs may be the same or different; and in a case where n is from 2 to 4, n Rs, n Rs, and n m's each may be the same or different.

Thickening stabilizer and thickening stabilizer composition including same

Problem to be Solved Provided is an agent for resist hydrophilization treatment that can hydrophilize a surface of a resist coating rapidly and stably while inhibiting deterioration of the resist coating. Solution An agent for resist hydrophilization treatment of the present invention comprises at least following components (A) and (B):

Agent for resist hydrophilization treatment

Provided are: a compound, a thickening/stabilizing agent including the compound, a thickened/stabilized composition including the thickening/stabilizing agent and a fluid organic substance, and a method for producing the thickened/stabilized composition, where the compound effectively thickens the fluid organic substance to a desired viscosity and effectively uniformly stabilizes the formulation of the composition containing the fluid organic substance via thickening of the fluid organic substance. The thickening/stabilizing agent according to the present invention includes a compound represented by Formula (1):(R&#x2014;HNOC)&#x2014;R&#x2014;(CONH&#x2014;R)&#x2003;&#x2003;(1)where Ris a group resulting from removing four hydrogen atoms from the structural formula of butane; Rand Rare different from each other and are aliphatic hydrocarbon groups each containing 4 or more carbon atoms; and n is an integer of 1 to 3.

Thickening and stabilizing agent, and thickening and stabilizing composition using same

A compound that thickens or gels a fluid organic substance to a desired viscosity or homogeneously stabilizes a composition containing a fluid organic substance, a thickening/stabilizing agent containing the compound, a thickened/stabilized composition containing the thickening/stabilizing agent and a fluid organic substance, and a method for producing a thickened/stabilized composition. The compound is represented by the following formula (1): In the formula, Rand Rare different from each other and represent an aliphatic hydrocarbon group having not less than 4 carbon atoms, and n represents an integer of 1 to 3. The thickening/stabilizing agent of the present invention contains the compound.

Thickening stabilizer and thickening stabilization composition using same

A compound that thickens and/or gelatinizes a fluid organic substance to a desired viscosity, or uniformly stabilizes a composition containing the fluid organic substance. Also, a thickening/stabilizing agent including the compound, a thickened/stabilized composition including the thickening/stabilizing agent and a fluid organic substance, and a method for producing the composition. The compound according to the present invention is represented by Formula (1):(R&#x2014;HNOC)&#x2014;R&#x2014;(CONH&#x2014;R)&#x2003;&#x2003;(1)where Ris a group resulting from removing four hydrogen atoms from the structural formula of an aromatic hydrocarbon or cyclohexane, Ris, independently in each occurrence, an aliphatic hydrocarbon group containing 1 to 4 carbon atoms, Ris, independently in each occurrence, an aliphatic hydrocarbon group containing 6 or more carbon atoms, and n is an integer of 1 to 3.

Thickening/stabilizing agent and thickened/stabilized composition using the same

Provided are: a compound that thickens or gelatinizes a fluid organic substance to a desired viscosity, or uniformly stabilizes a composition containing the fluid organic substance; a thickening/stabilizing agent including the compound; a thickened/stabilized composition including the thickening/stabilizing agent and a fluid organic substance; and a method for producing a thickened/stabilized composition. The compound according to the present invention is represented by Formula (1):(R&#x2014;HNOC)&#x2014;R&#x2014;(CONH&#x2014;R)&#x2003;&#x2003;(1)where Ris a group resulting from removing four hydrogen atoms from the structural formula of benzene; Rand Rare different from each other and are each independently an aliphatic hydrocarbon group having 6 or more carbon atoms; and n represents an integer of 1 to 3.

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Tokyo, Japan

Yuichi Sakanishi