Tokyo Electron Limited

Yuichi Sakai

Masatoshi Kaneda

Hiroshi Shinya

Shigeki Aoki

Tatsuya Kawaji

Mitsuo Yamashita

Kiyomitsu Yamaguchi

A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.

Heat processing apparatus and heat processing method

A heat treating apparatus utilizes a straightening plate provided in its central part with a gas exhaust opening and disposed under a heating plate. A temperature-reducing purge ring is disposed between the face plate and the straightening plate, and is provided in its inner circumference with plural gas jetting holes. A thin gap is formed between the temperature-reducing purge ring and the face plate. When a cooling gas is jetted radially inward through the gas jetting holes, a vacuum is created between the lower surface of the face plate and the upper surface of the temperature-reducing purge ring. Air is sucked into the space between the face plate and the straightening plate and flows together with the cooling gas to rapidly cool the face plate.

Heat-treating apparatus, heat-treating method and storage medium

A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.

Growing community of inventors

Koshi, Japan

Yuichi Sakai