Nippon Petrochemicals Company, Limited

Nippon Oil Fats Co., Ltd.

Nippon Petrochemicals

Yuichi Orikasa

Suehiro Sakazume

Shinji Kojima

Atsushi Sato

Kaoru Yamamoto

Shigenobu Kawakami

Takashi Inoue

Sadahiro Nishimura

Hirokazu Suzuki

Yoshinori Maki

There is provided a thermoplastic resin composition, the composition comprising

Thermoplastic resin composition

A thermoplastic resin composition is here provided which contains (I) 99 to 1% by weight of a polyphenylene ether resin alone or a mixture of the polyphenylene ether resin and a styrene polymer, (II) 1 to 99% by weight of at least one kind of resin selected from the group consisting of a polycarbonate resin and polyoxymethylene resin, and (III) 0.1 to 100 parts by weight, based on 100 parts by weight of the resins (I) +(II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an epoxy group-containing olefin copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of both the components being in the state of a dispersion phase having a particle diameter of 0.001 to 10 .mu.m. A method for preparing the above-mentioned thermoplastic resin composition is also provided here.

Blend of polyphenylene ether, polycarbonate or polyoxymethylene resins

A thermoplastic resin composition is here disclosed which is prepared by blending (I) 99 to 1% by weight of a polyamide resin, (II) 1 to 99% by weight of at least one kind of resin selected from the group consisting of a polyphenylene ether resin alone or a mixture of the polyphenylene ether resin and a styrene polymer, an aromatic polyester resin, a polycarbonate resin, a polyoxymethylene resin, an ABS resin, a polyarylene sulfide resin and a polyarylate resin, and (III) 0.1 to 100 parts by weight, based on 100 parts by weight of the aforesaid resins (I)+(II), of a multi-phase structure thermoplastic resin.

Polyamide resin thermoplastic blend containing a multi-phase structure

There is here provided a thermoplastic resin composition which comprises (I) 99 to 1% by weight of an aromatic polyester resin, (II) 1 to 99% by weight of at least one kind of resin selected from the group consisting of a polyphenylene ether resin, a mixture of the polyphenylene ether resin and a styrene polymer, a polycarbonate resin, and a polyarylene sulfide resin, (III) 0.1 to 100 parts by weight, based on 100 parts by weight of the aforesaid resins (I)+(II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an epoxy group-containing olefin copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of both the components being formed with a dispersion phase having a particle diameter of 0.001 to 10 .mu.m. A method for preparing the above-mentioned thermoplastic resin composition is also provided here.

Thermoplastic resin composition and method for preparing the same

There is provided a thermoplastic resin composition which comprises 99 to 1% by weight of a propylene polymer (I), 1 to 99% by weight of a vinyl polymer (II), 0.1 to 100 parts by weight, based on 100 parts by weight of the aforesaid resins (I)+(II), of a multi-phase structure thermoplastic resin (III) which is a graft copolymer comprising 5 to 95% by weight of a propylene polymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of the components being formed with a dispersion phase having a particle diameter of 0.001 to 10 .mu.m.

Thermoplastic resin compositions

A novel thermoplastic resin composition is here disclosed which comprises (I) 99 to 1% by weight of a polyolefin, (II) 1 to 99% by weight of a polyarylene sulfide, (III) 0.1 to 100 parts by weight, based on 100 parts by weight of the components (I)+(II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an olefin polymer or copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of both the components being in the state of a dispersion phase having a particle diameter of 0.001 to 10 .mu.m, and (IV) 0 to 150 parts of an inorganic filler based on 100 parts by weight of the components (I)+(II)+(III). Furthermore, a method for preparing the aforesaid composition is also disclosed here.

There is here provided a thermoplastic resin composition which comprises (I) 50 to 99% by weight of a polyamide resin, and (II) 50 to 1% by weight of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of at least one ethylene copolymer selected from the group consisting of epoxy group-containing ethylene copolymers, ethylene-unsaturated carboxylic acids, alkyl ester copolymers and metallic salts of the ethylene-unsaturated carboxylic acids, and ethylene-vinyl ester copolymers, and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one vinyl monomer, either of both the components possessing a dispersion phase where each particle has a diameter of 0.001 to 10 .mu.m. A method for preparing the above-mentioned thermoplastic resin composition is also provided here.

There is here provided a thermoplastic resin composition which comprises (I) 50 to 99% by weight of an aromatic polyester resin, and (II) 50 to 1% by weight of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of at least one ethylene copolymer selected from the group consisting of epoxy group-containing ethylene copolymers, ethylene-unsaturated carboxylic acids, alkyl ester copolymers and metallic salts of the ethylene-unsaturated carboxylic acids, and ethylene-vinyl ester copolymers, and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one vinyl monomer, either of both the components possessing a dispersion phase where each particle has a diameter of 0.001 to 10 .mu.m. A method for preparing the above-mentioned thermoplastic resin composition is also provided here.

There is provided a thermoplastic resin composition and a molded bumper therefrom in which said composition comprises:

Thermoplastic resin compositions and their use

A novel thermoplastic resin composition is here disclosed which contains

There is here provided a thermoplastic resin composition which comprises (I) 99 to 1% by weight of a polyamide resin, (II) 1 to 99% by weight of at least one kind of resin selected from the group consisting of a polyphenylene ether resin, a mixture of the polyphenylene ether resin and a styrene polymer, and a polycarbonate resin, (III) 0.1 to 100 parts by weight, based on 100 parts by weight of the aforesaid resins (I)+(II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an epoxy group-containing olefin copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of both the components being formed with a dispersion phase having a particle diameter of 0.001 to 10 .mu.m. A method for preparing the above-mentioned thermoplastic resin composition is also provided here.

A novel thermoplastic resin composition is here provided which contains

The present invention provides a method for improving impulse destructive strength of an electrical insulating material which is characterized by employing, as said electrical insulating material, an ethylene copolymer prepared by subjecting, to a high-pressure radical polymerization, ethylene or a mixture of ethylene and another monomer in the presence of at least one selected from the group consisting of one- to three-ring aromatic compounds (except styrene and substituted styrenes each having a single ring) each having one carbon-carbon double bond in one molecule, at a polymerization pressure of 500 to 4,000 kg/cm.sup.2 at a polymerization temperature of 50.degree. to 400.degree. C., with said ethylene copolymer containing 0.005 to 1 mol % of a unit derived from said aromatic compound as a polymeric component.

Method for improving impulse destructive stength of electrical

A novel thermoplastic resin composition is here disclosed which contains (I) 99 to 1% by weight of a polysulfone or polyether sulfone; (II) 1 to 99% by weight of an acrylonitrile-butadiene-styrene resin; (III) 0.1 to 100 parts by weight, based on 100 parts by weight of the aforesaid resin (I)+(II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an epoxy group-containing olefin copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of the polymer or copolymer being in the state of a dispersion phase having a particle diameter of 0.001 to 10 .mu.m; and (IV) 0 to 150 parts of an inorganic filler. Furthermore, a method for preparing the aforesaid composition is also disclosed.

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Yokohama, Japan

Yuichi Orikasa