Hitachi, Ltd.

Renesas Electronics Corporation

Renesas Technology Corp.

Yuichi Mabuchi

Hiroshi Ikeda

Toru Hayashi

Hideshi Fukumoto

Satoshi Nakamura

Motoo Suwa

Daisuke Matsumoto

Yuichi Kuramochi

Yukio Hattori

Akira Mima

Tetsuya Kawashima

Kenji Kikuchi

Hiroshi Kamiduma

An imbalance of control signals between two power semiconductor elements is reduced. A first power semiconductor module and a second power semiconductor module are arranged in a predetermined direction along a surface of a control signal wiring circuit board, each of longitudinal directions of the first power semiconductor module and the second power semiconductor module along the surface of the control signal wiring circuit board is a predetermined direction, and, in a first control signal wiring, a distance between an external control signal terminal and a second control signal terminal is equal to a distance between the external control signal terminal and a first control signal terminal.

Power conversion unit, power converter, and power conversion method

An electronic device comprising: a wiring substrate having a first power-supply wiring to which a first power-supply potential is applied and a second power-supply wiring to which a second power-supply potential lower than the first power-supply potential is applied; a microcomputer having first and second power-supply terminals in which the first power-supply terminal is connected to the first power-supply wiring and the second power-supply terminal is connected to the second power-supply wiring; and a connector connected to the first and second power-supply wirings, wherein an inductor element for correcting an impedance error of the first and second wirings is connected in series to either one of the first and second power-supply wirings. According to such configuration, unnecessary electromagnetic radiation posed by a common current can be suppressed.

Electronic device

An electric braking apparatus including a motor for pressing brake pads on disks, a metal housing for housing the motor, a positive-polarity power line for transmitting power from a battery to the electric motor, a negative-polarity ground line for connecting the electric motor to the ground of a vehicle, and a conductor for electrically connecting the metal housing to the negative polarity of battery or the negative-polarity of an inverter.

Electric braking apparatus

The invention provides a method of calculating an equivalent circuit, which reduces the number of elements constituting a network to a large extent with a target accuracy secured. The method of the invention calculates an equivalent circuit by a computer, with regard to an object that has a conductor, a dielectric to support the conductor, and plural input/output terminals to the outside. Step 1 in the method receives inputs of geometry information to specify a shape of a conductor in a circuit board being the object of determining the equivalent circuit, and material information to specify a material of the circuit board; Step 2 partitions the shape of the objective conductor into meshes on the basis of the geometry information received, and creates mesh data to be expressed; Step 3 calculates a nodal admittance matrix from the mesh data, and stores the result; step 4 calculates the number of nodes and the number of independent networks on the basis of the mesh data, determines an incidence matrix, and determines the structure of an equivalent network by means of the calculated nodal admittance matrix and incidence matrix; and Step 5 determines the values of elements of the equivalent network.

Method of deducing equivalent circuit and system for the same

A semiconductor device is provided that reduces the number of external power terminals. The device is intended for a flip-chip type BGA (ball grid array) package. On the surface of the packet substrate are a plurality of output circuits each outputting a signal formed by an internal circuit, a first voltage supply electrode which supplies an operating voltage to the internal circuit and a plurality of second voltage supply electrodes which supply operating voltages to the output circuits. On the back surface of the package substrate are external terminals and a plurality of wiring layers.

Semiconductor device and an electronic device

Growing community of inventors

Hitachi, Japan

Yuichi Mabuchi