Lintec Corporation

C.d.n. Corporation

Yuichi Iwakata

Taiga Matsushita

Yasukazu Nakata

Katsuhisa Taguchi

Takeshi Kondo

Akira Ichikawa

Kazuyoshi Ebe

Hideo Senoo

Koichi Yamaguchi

Takeshi Segawa

Hayato Noguchi

Takehiko Nishikawa

Chisato Iino

Ryuzo Noda

Yoshio Nikawa

A semiconductor wafer processing tape sticking apparatus is provided and is capable of sticking a semiconductor wafer processing tape to a semiconductor wafer under the optimum conditions based on the processing data that has been written to a data carrier member and that has been read from the data carrier member without accessing the host computer unlike a conventional method. The semiconductor wafer processing tape sticking apparatus includes: a feeding apparatus provided with a feeding shaft to which a semiconductor wafer processing tape winding body can be detachably attached; a tape data read/write device for reading and writing the processing data that has been written to a data carrier member of the semiconductor wafer processing tape winding body; and a tape sticking apparatus for sticking a semiconductor wafer processing tape that has been fed out from the feeding apparatus to the semiconductor wafer based on the processing data that has been read by the tape data read/write device.

Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body

When at least one IC chip is mounted on electrode parts, a connecting part for mounting IC chip according to the present invention can control an area of an overlap between the electrode parts on which each IC chip is mounted and each IC chip according to a mounting position of each IC chip. An antenna circuit according to the present invention includes a connecting part for mounting IC chip and an antenna unit of the present invention. An IC inlet according to the present invention includes at least one IC chip on the connecting part for mounting IC chip of the antenna circuit of the present invention.

Connecting part for mounting IC chip, antenna circuit, IC inlet, IC tag and method of adjusting capacitance

An IC tag has a layer of heat sensitive color developing material (I), a layer of material absorbing light and converting absorbed light into heat (II) and a protective layer (III) laminated on the surface of the support successively from the surface, or (II), (I) and (III) laminated on the surface of the support successively from the surface. This structure permits recording and erasing invisible information and recording and erasing visible information, both allowing recording and erasing information in a non-contact manner. The structure is flexible and can have a small size.

IC tag, reader/writer for the IC tag and system using the IC tag

To present the ID tag including flat coil component, and characteristic adjusting method of ID tag capable of suppressing product fluctuations about the desired characteristic. The flat coil component of the ID tag of the invention comprises a flat coil composed of a conductive material provided continuously and spirally on an insulating substrate, and a jumper disposed on the flat coil with insulation, from one of inner end or outer end of this flat coil to the outside or inside of the flat coil where other end is positioned, in which the jumper is composed of a plurality of jumpers variable in the number of pieces in arrangement. The characteristic is adjusted by varying the number of effective pieces for forming the parallel arrangement.

Flat coil component, characteristic adjusting method of flat coil component, ID tag, and characteristic adjusting method of ID tag

A loop antenna is constructed by bending a linear conductor so that it forms concavo-convex portions within an antenna plane. As an example, the shape of the loop antenna comprises a long straight line portion (LP) which elongates substantially straight in the direction of the arrow X, a short straight line portion (TP) which is at a predetermined angle (&#x3b8;) with respect to the long straight line portion (LP) and shorter than the long straight line portion (LP), and a short straight line portion (TP) which is at a predetermined angle (&#x3b8;) with respect to the short straight line portion (TP) and at a predetermined angle (&#x3b8;) with respect to the long straight line portion (LP) and has approximately same length as the short straight line portion (TP), wherein an acute angle portion (TG) which is formed by the short straight line portions (TP) and (TP), and acute angle portions (TGTGand TG) each having approximately same shape as the acute angle portion (TG) are succeeding in the opposite direction of the arrow X to the vicinity of a feeding point (P).

Loop antenna, loop antenna system and wireless communication system

Reinforcing material having Rockwell hardness of 60 or above and comprising base material and adhesive is formed, and then the reinforcing material is attached to one side of silicon wafer on which circuits are not formed prior to dicing.

Reinforcement material for silicon wafer and process for producing IC chip using said material

A method of processing a semiconductor wafer. The wafer is secured to a wafer supporting member having a data carrier. Information required for working the semiconductor wafer is input to the data carrier. The wafer is then worked according to information read from the data carrier. The data carrier is configured to permit operations such as back grinding, dicing and pickup of the wafer, and prevents wafer breakage when the wafer is carried between different operations.

Method of processing semiconductor wafer and semiconductor wafer supporting member

A card sealed by using a composition which includes an acrylate compound polymerizable by an ionizing radiation and 1 to 40 parts by weight of a polyfunctional isocyanate compound per 100 parts by weight of the acrylate compound and can be cured by irradiation of the ionizing radiation and a process for producing a card disposing a coating layer of the composition between a substrate sheet and a cover sheet and curing the coating layer by irradiation of an ionizing radiation.

Growing community of inventors

Warabi, Japan

Yuichi Iwakata